JPRS ID: 10570 USSR REPORT CYBERNETICS, COMPUTERS AND AUTOMATION TECHNOLOGY

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• Content Type: REPORTS

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1~()R U1~F'((.'IAI. IISM: ONI.Y
JPRS L/ 10570
= 7 June 1982

~
~ USSR Re ort
p
CYBERNETICS, COMPUTERS ~ND
AUTOMATIC~N TECHNOLOGY
CFOUQ 12/82)
a
FBIS ~OF~EIGN BROADCAST INFORM~41 ~OIV SER~!;~~
FOR OFFICIA~. USE ONLY
~
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NOTE
~ JPRS publications contain information primarily from foreign
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COPYRIGHT LAWS AND REGULATIONS GOVERNIN~ OWNERSHIP OF
I~ATERIALS REPRODUCED HEREIN RE(~UIRE THAT DISSEMINATION
OF THIS PUBLICATION BE RESTRICTED FOR OFFICIAL USE ONLY.
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JPRS L/10570
- 7 June 1982
USSR REPORT
CYBERNETICS, COMPUTERS AND AUTOMATION TECHNOLOGY
(Fauo 12/s2)
CONTENTS
HARDWAkE ~
RecorrunP:~ded Haxdwaxe for Automated Control Systems 1
Automated System for ~ontrolling Technological Processes in
Printed-Ci~cuit Board Production 3
International S~rstem of Small Computers; Basis for F~.irther
Development of Process Control Computer ^omplexFs for State
System of Industrial Instruments and Automati:,n Equipment:
SM-50 5eries 7
Microcomputer Interface for Peripheral Equipment 12
Interface of DRP-3M Plotter T~.th Nairi-2 I}igital Computer...... 13
IRPS Controller for Elektronika-60 Microcomputer 1!~
Designs and Calculation of Microcircuits and Microcomponents
of Computer Equipment 16
HYBRIDS
- Technology, Reliabilit~r and Automation of Production of Large-
' Scale Hybrid Integrated Circuits and Microassemblies......... 40
SOFTWARE
Processing of iiaster Images of Extended Objects: Pattern
. Recognition 87
De~ign of Experiments for Nonli.near Estimation and Patteril
Recognition '_'roblems 91
- a- [YII - USSR - 21.C S&T FOUOJ
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APPLICATIONS
~
. Integrated Systems for Automation of Scientific Research on
Multipurpose Research Vessels 97
Automa~ed Enterprise Control Systems 109
Principal Econorrdc Efficiency Indicators of Introducing an
ASUP ..................................e...................... 112
Automated Control System at Dnepropetrovsk Metallurgical
Plant Imeni Petrovskiy 122
OPTICAL PROCESSING
Recording, Reconstruction (Inversion) of Wavefront of I,ight,
Self-Focusing--New Effects in Stimulated Raman Scattering
of Light 121~
Possible and Impossible in Digital Holography 136
DATA CONVERSION
;Data Converters and Data Tran smission Equipment 152
High-Speed Microelectronic Data Converters Based on Bipolar
Technology 154
Digital Error Correction in Microelectrcnic Analog-Digital
Convertors 158
Use of ODA-20M Unit for Automatic Data Trans;nission 160
Haxdware of ODA-20M Data Exchange ~ystem 165
' EXHIBITIONS AND COURSES
Hungarian Computers at L~ud~;pest Fair 168
Computer Science Courses Announced 171
PUBLICATIONS
Abstracts of Articles in Jo~arnal 'AUTOMATION AND COMPUTER
, TECHNOLOGY', November-December 1981 173
- b -
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HAkDWARE
RE~ONA4ENDED HARDWARE FOR AUTOMATED CONTROL SYSTEM.~
Moscow AVTOMATIZIROVANNYYE SISTEMY UPRAVLENIYA PREDPRIYATIYAMI in Russian 1981
(signed to press 24 Mar 81) pp 166-167
~ [Table 6.1 from book "Automated Enterprise Control Systems", by Vladimir
Alekseyevich Andreyev and Gennadiy Petrovich Penkin, Izdatel'stvo "Finansy i
- statistika", 20,000 copies, 248 pages] .
[Text]. Table 6.2. List of Hardware Recommended for Use in Automated Control
- Sys ten~s
Group and Type Classes of Hardware from Uni'ts in Series Prc_~uction and Being
of Hardware Prepared for Production
' Computers M-4030, YeS-1022, YeS-1033, YeS-1035, YeS-1040, YeS-1050,
YeS-1060
Small Com;~uters M5000, M6010, M6000, M7000, M400, M40, YeS-101~, Nairi-3-2
VPM [punchcard
computers] PO-80-2/2M, PA80-2/3M, PEM80, PR80/45U, PM-80, RPM80-2MS,
KA80-2/2M, KA80-2/3ri, SE80/2, S8L-SM/4s, TA$0-1, T-5M,
EVP80-2, EVP-1
- VKM [key-
board computer] Iskra-11M, Iskra-12, Iskra~23, Iskra-1103, Iskra-2301, Iskra-
2302, Iskra-111T, Iskra-122, Iskra-522, Iskra-11.22, IIystritsa,
SVD-107. SVD-108, the group of Askota-170 class bookkeeping
machines, Tsellatron, Zoyemtron~-383, Iskra-524, Iskra-535,
Iskra-525, Iskra-526, FM-345P
- External Memory YeS-5010, YeS-5012, YeS-5016, YeS-5017, YeS-5019, YeS-5021,
Units YeS---SQ22, R421, R412, A322-1, YeS-5051, YeS-5052, YeS-5055,
YeS-5056, YeS-5058, YeS-5035, YeS-5061, YeS-5071, YeS-5027
Communications YeS-2422, YeS-4012, YeS-4430, YeS-4035, YeS-4060, Ye~-4012-01,
' Channels, Blocks YeS-4080
1
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J fTable 6.2, continued]
Group and Type Classes of Hardware from Units in Series Production and Being
of Hardware Prepared for Production
Input-Output FS-1501, A411/4, YeS-6014, YeS-6022, YeS-6121, 'IeS-6122,
Units YeS-6025, YeS-6191, R-640, YeS-6012, YeS-6013, YeS-5016,
YeS-6111, PL-150, PL-80/8, A421-2, YeS-7022, `~eS-7024,
YeS-7122, Y eS-7191, YeS-7192, R-630, YeS-7010, YeS-7012,
YeS-7013, YeS-7014, YeS-7111, YeS-7112, T-63, A531-2, A531-5,
YeS-7050, YeS-7051, YeS-7052, YeS-7053, YeS-i054
Data Prepara*_ion YeS-9001, YeS-9020, YeS-9021, Y:S-9022, YeS-9024, P80/6,
Units YeS-9010, YeS-9011, YeS-9012, YeS-9013, SPD-9000, YeS-9015,
YeS-9018, YeS-9041
Units of Remote A542-2, A-542-6, A552-3, YeS-8001, YeS-8002, YeS-8005,
Data Processing YeS-8006, YeS-8Q10, YeS-8011, YeS-8015, YeS-8019, YeS-8025,
Systems YeS-8028, YeS-8030, Ye5-80'eu xY m � N d U ~Q N
3 ~ ~ c`~O s o rl N Li ~'J tb~tl
U ~ Y ^ cn x ~ I ia
y%~ = H ~-Irn ~ ~ cv o!~-~~~, rn 0� ac ~ rl U~ G) a
b N~ x o . K��~ x ~ wy~.~ b b ~
_ ~j" ~ r, ~s ^ �c~i o. O FI N p~
~ v? Q ~ F ~r,~ o s E"" I ~ w 4~-~ v~l U~ O
V ~i" x
� ~ ~ p z a Q O~ a caqo rN-I .-I U U .-I
~ S. " ~ F ~ ~:"u ~ X �r~ ~rl 4~-1 W ~ W
~
~ N ca ai 1~ ~1 �rl
a '.~c ~ c0 ~ ~--I N ~
~ ~a :~a 4 ~ t~ v ~ H V^ fd Rf af RI ~ O
N ai E"" ^ w F" s F t- ~ p^ ~ a? a~ ^ 3 'U
~ ~ ~o ~ ~ c~a ~ v d' ~ F F- x ~-1 ~
r-1 ~ K',_� ~ o v ~ o s O m U~ ~ e; m v ~-I N M d' tl) ~
N .~.i~ ~ c~i Y ci ~ o s n�c
= o~ o Q ~oQ ~mo ors ~
~ s x � o o~ o x~ z x,-t ~
x~ E... p, s H y ~ r- a~ o N O
s
x o ~ ~
' E-~ :.d-, % w ~ z W fA u~ U x~ C ~ ia U
25
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FnR OFF((:IAL USF. UNLY
~.ontinued f.rom ~receding page]
6. Permittivity ed at frequency of 1 kHz
7. Tangent of dielectric loss angle tgd at freauency of 1 kHz
8. Electric st.rength E~rob, V/em
9. Temperature coefficient of capacitance (TKE), �C-1 in temperature
- range -60 to +125�C
10. Silicon monoxide (YeK0.028.004 TU)
11. Germanium monoxide (YeT0.021.014 TU1
12. Borosilicate glass (YeT0.035.015 TU)
13. S41-1 electrovacuum glass (NP0.027.600)
14. A99 aluminum fGOST 11069-64)
15. For temperatures
16. For
17. Tantalum pentoxide (electrolytic anodization)
_ 18. TVCh tantalum (lower plate)
19. A99 aluminum (GOST 11069-64) with vanadium sublayer (upper plate)
Table 2.2.1. Recommended Card 9izes
_ ~u~~,~~~~�~. ?~M1~ 2) (5 n,~~~~~,, M~,
- u~~wx~~anL- no?nwnn~-
:I~II UUP 9HOqC' UTKJIOIIC� IIOI� 31104C� OTH.q011C--
tll 3~~~~~~ I...~~~~~~4) I
1 96 120
2 60 - 0,3 96
3 48 (i0 - 0 , 3
4 30 48
5 24 _ ~~2 30
6 20 24 I- 0,2
7 ^ IG 20
8 12 � 16
9 IU I6
IU lU - 0,l 12 - U,I
II Fi 6
!`l 2,5 4
13 IG 60 I_ 0,3
l4 32 ( - 0,2 60
~
f~ 8 - 0,1 15 - 0,1
~ lIi S 10
l7 2~} ~ -0,2 GO
18 15 O,l. 48 - 0,3
!9 20 ~ - 0,2 48
Key :
1. Dtumber of item 4. Deviation
2. Width, mm 5. Length, mm
3. Nominal value
26
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~
0
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u t7 ~ ~ ~ ~
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a ~ d p~ ~d
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~ ~ ~ o~a T s u c. a`~, ~ N O N ~
N M H o~ F O V a,x~,;~ y V p c .r LI f0 !!1 UI 3~1 ~
o c. QU ~ c~i i o a o� � W(7 fHA ~ U
~i , ~x a;d ov vo dA NC %
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~ K ~ c x <
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~ x m ~ H o o N x a~~ H x~, o o m x N~; ~r
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,
27
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[Key wntinued from preceding page):
11. Heat conduction, W/(m�OC)
12. Softening temperature, �C
13. Permittivity at f= 106 Hz and T=+20�C
14. Tangent of dielectric loss angle at f= 106 Hz and T=+20�C
15. Volume resistance, ohms�cm, at 25�C
16. Electric strength, kV/mm
Table 2.3.1. Parameters of Multicomponent Systems of Commutation Conductors
and Contact S~arfaces
Specific
- Thickness Surface Recommended Method
_ of Layer, Resistance of Contact of
Material nm p~, ohms/~ External Leads
Sublayer--Kh20N80 10-30
nichrome (GOST 2238-58) 0.03-O.Q4 Soldering, welding
Layer--Z1 999.9 gold 600-800
(GOST 7222- 54)
Sublayer--Kh20N80 10-30
nichrome (GOST 2238-58)
Layer--vacuum melting of 600-800 0.02-0.04 Welding
MV copper (MRTU 14-14-42-65)
C~ating--nickel (MRTU 80-120
14-14-42-65)
~ublayer--Kh20P180 10-30
nichrome (GOST 2238-58)
Layer--vacuum melting of MV 600-800 0.02-0.04 Soldering, weldinr
copper (MRTU 14-14-42-65)
Coating--Z1 999.9 gold 50-60
(GOST 7222-54)
Sublayer--Kh20N80 40-50
nichrome (GOST 2238-58)
Layer--A99 aluminum 250-350 0.1 -0.2 Soldering
(GOST 11069-64)
Coating--nickel (MRTU 50
14-14-46-65)
number that indicates the number of leads and the m~difi:ation number. The
standard dimension code of the housing consists of notation of the type of
- housing (1, 2, 3 or 4) and a two-digit number (from O1 to 99) that denotes
the standard dimension number. For example, housing 201.14-2 is a rectangu- �
lar housing of type 2, standard dimension O1 with 14 leads, second
modification.
Housing designs. Based on the characteristic features of design-production
version, housings can be divided into several types: glass, ceramic, plastic,
28
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Table 2.3.2. Main Parameters of Thick-Film Conductors ~
Paste ~
Parameter PP-1 PP-2 PP-3 PP-4
Film thickness d, microns 10-20 15-20 15-25 15-25
Specific surface resistance
pp, ohms/o 0.05 0.05 0.05 0.05
Minimum distance between con-
ducting elements in one layer,
~ 0.2 0.2 0.05 0.1
Minimum dimensions of conduc-
tors, mm Oo25 0.25 0.15 0.2
Maximum precision of manufac-
turing films of components,
- ~ +0.1 +0.1 +0.05 +0.1
' Table 2.3.3. Electrophysical Parazneters of Materials of Insulating Layers
Mark of Cement
Parameter STs-273 STs-45
_ Melting point, �C 350 600
Solidification tempe rature, �C 750 700
Linear expansion coefficient, �C 1 5.2�10-6 3-10-6
Permittivity 17 ~-8
- Tangent of dielectric loss angle 2.5�10-3 3'10-3
Specific volume resistance at 20�C, ohms�cm 1013 1p13
Table 2.3.4. Maximum and Recommended Values of Design-Production Parameters
of Thick-Film Switching Parts
Par amete r Recommende d Maxi.mum
Number of ~ayers of conductor switching 2 5
Distance between centers (spacing), mm:
of interlayer junctions 1 0.6
of parallel conductors 0.5 0.3
Width of conductors (minimum), mm 0.25 0.15
Specific resi~tance of conductors, ohms/o:
of internal layers 0.03
of outer layer (after tinning) 0.005
metal-glass, cermet, metal-polymer, glass- ceramic and so on. The designs of
the most widely used housings are shown in Figures 2.4.2-2.4.4. Metal-glass
housings 151.14-1, 151.15-2, 151.15-3, 155.15-4 and 155.36-1 (Figure 2.4.2)
are widely used in hybrid integrated circuits. A total of 15 pin type leads,
one of which is connected to the metal shell to accomplish electrostatic
shielding, is used in housings 151.15-2, 151.15-3 and 151.15-4.
29
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~
ro ~
0
U N �.-I O
�~1 U~UN
~,~-1 ~ GUl N U I O I
U~ UI f~' \ 1 ri 1
Gl �.1 ~I �r~ f=+
w~ o
Rf H Q
U
~
~
�r1 ir1
>
�rl co v~
w I N ~T I
~ M
N
a
b ~
~
b v m
v ro�.~i o i i o
~ ~ N O O I I O
�rl �rl O O
~ ~ N
U N
- a
.r,
~
~
~ ~
�rl N U!
!s~ N G.'
1 ~ O u1 u'? ~n
~ X
�.-I U U ~f1 O~"1 f'1
H
H
w
O
~
N
N ~-I
td ri
a v a� a c
w cn a
- o ~
N
~
v
~
- N U b'+
~ ~ ~ ~
P, ~ N O
- O ~ U
~ U N
~ N ~
a~s a~i ~
N ~ ~r
~ ro
m ~ ~
u, i o
~ Og U
H k~ H tn -
- 30
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Table 2.4.1. Parameters of Materials Used to Manufacture Housings
~(03~~1H4HlHT ~
Marep~ian ~1'j ( ~2~ Cocrae, y6 k3~ TKJIP, 'C-' I rennonpoeoAxo�
I crx. Brllu'C1
Anb~~iniFtena~ Kepa� 94...96 AI:Oa, (6,4...7,9) ]0-" 19,6
~u~Ka (5~ 6...4 MgO~t$i0s
(~i7
Sepii~n~teeaA Kepa- I97...99 Be0 I7,U�10-� I 208
n~uKa (7)
SopocunEiKaruoc I - ~4,6�10-� I 1,1
cTeHnu ~8~
Tlpunai'iuoc cTCitno i58Pb0, 12Ba=O,, 20SiO:,I (4,0. ..12,0)10-� I
(9) ~8Zn0, 2 - npo4uaqKNCJIW
i
Konap ~11~ I 18Co, 28Ni, 54Fc I(4,7.. .5,5)10-" I 16,7
KepaHOap (12) I25Co, 27iNi, 48I'c I8,1 � 10-� I
f7~nmoii (13) Ifi1Sa, 39Pb I21,5� 10-' ' I -
TlnacrMaccW (14) I - I(20...200) t0-� I 0,3:. 2,0
Key :
- 1. Material
2. Composition, percent '
3. Linear temperature expansion coefficient, �C-1
4. Heat conductivity coefficient, W/(miOC)
5. Aluminum ceramic
6. And
7. Beryllium ceramic
8. Borosilicate glass .
9. Soldered glass
10. Miscellaneous oxides
11. Kovar
12. Keramvar
_ 13. Solder
14. Plastics
Multilead ceramic housings 421.48-1 and 421.50-1 (Figure 2.4.3) are used in
large hybrid integrated circuits. The ceramic base and cover of the housing
simultaneously perform of the role of multilayer thick-film switching cards.
Planar leads are arranged along the long sides witi~ spacing of 1.25 mm. Ex-
ternal intercard installation cunnectors are arranged along the narrow sides.
An example of a design of a metal-polymer housing is shown in Figure 2.4.4.
A ceramic card (1) with pin-type leads (2) is placed inside a metal cap (3).
The end cavity of the design is filled with a compound (4). The design does
not provide ~~ality protection of the microcircuit components under increased
moisture conditions. .
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_ ~
~
45�
~6~~~~1~ ~ \
.
ti
~~~~6 .
~ m~Q~~ �
~~,q C 1
~ ?
~
� ~
r
0
~ .
,r -
y' 4 ~
o~ b~ d)
Figure 2.4.1. Types of Microcircuit Housings
The leads of the housings are numbered. The numbers of the leads are placed
on the schematic diagram of the microcircuit and on the corresponding contact
surfaces of the card. Special marks are made to determine the position of the
- first lead on the housing: a recess on the lead, asymmetrical arrangement of
one of the leads, a notch or point on the housing surface and so on. The num-
bering proceeds clockwise if one looks at the housing from the direction of
the leads.
The accuracy of reproducing the resistance of a semiconductor resistor is de-
termined by the following factors: the precision of manufacture of the
phototemplate and photoresistive mask, the precision of the etching process
in which the opening in the protective oxide layer with given length to width
ratio is formed and the precision of proportion.ing and distribution of the
impurity atoms during alloying of the semiconiluctor by diffusion or ion
implantation.
The effect of production operations on the accuracy of reproducing the re-
sistance and the ratio of the resistance of diffusion resistors is illustrated
by the data of Table 4.8.1. It is obvious from the data of the table that the
main error is introduced at the impurity diffusion stage since it is rather
difficult to control the amount of introduced impurity and the depth of
- 32
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Knrov ~
~ ---y-y o
~4 I ~ ~o;~ 6�1,5~f5
y $a p,5
,1; E ~ Z � b - l~ b
v h ~
72 ~ c ~ 3 ~ y
11 0 4 h E H
_ ~ N ~ ~ ~ ~ ~ E
i0 1~: ~ ( ~ ~ 5 ~o 3,2min ^ v
9 ~ 6, ~
7 17 ' S'C4 ? ~C~QO~w
a ~ N .
~ ~ 10'0,2 ~ lj~ ~9,5ma:
~ ~ 144nax ~y 3,6 g ~
' O
' fl
e
H
~ E . o
~E
~ ~
~ ~ c~
> ~
J Q-s
- 9
~
~ - - C)
~ ~
: _
; ~ ~ 9v
_ II
,1
o~
Figure 2.4.2. Designs of Metal-Glass Housings 151.14-1 (a), 151.15-3 (b)
.and 151.36-1 (c)
Key:
1. Leads 2. Legend
~ 26
I
u~
. . �
. N
I
~3
, b
1 1
1,25 Q5 l{3
24k1,15 "5
36,5
Figure 2.4.3. Design of Ceramic Housing 421.50-1
33
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1 2 , 4 �y
_ oo Z 3'3 =3 5 M~
~ l~ 6 ~
3 M ~
10
9 8 7 oC
1>,8mas A~~
~ o~
.T- ~
~
1 ~ 4 E
~ v
f~ 0,73rirt .
a~
E
�
- 4 .
. ~
108mnx 1 .
Figure 2.4.4. Designs of Metal-Polymer Housing: 1--ceramic card; 2--
pin-type leads; 3--metal cover; 4--compound
Table 4.8.1. Effect of Production Operations on Precision of Diffusion
Resistors
~R I $ ~l/ 2~ $
l1
Manufacture of phototemplate and maskinq 1 1
Etching during manufacture of protective 2 1
mask
Diffusion of impurities 7 1
Entire production process +10 +3
deposition of the p-n junction. The ratio of the resistance of two resistors
is reproduced with sufficiently high accuracy since the resistive layers are
f.ormed simultaneously. This feature is used extensively in design of the cir-
cuitry of a microcircuit. Circuit developers attempt to perform it so that the
output parameter of the microcircuit is determined by the ratio of the resis-
tances of the diffusion resistors.
Rather precise control of the beam intensity and the dose of introduced ions
is possible with ion implantation. The resistance of the resistor formed by
- the ion implanatation method can be reproduced with accuracy of not more than
+ 5 percent.
34
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Table 4.9.1. Parattteters of Thin-Film Capacitors with Metal-Dielectric-Semi-
conductor Structure
Parameters
Specific capacitance, pF/mm2 400-600 800-1,600
Relative permittivity of dielectric 2.7-4.2 3.5-9
Breakdown voltage Uprob~ V 50
Variation of capacitances, percent
Variation of capacitance ratio, +20
= percent + 3
Temperature coefficient, �C 1 +15�10-6 +(4-10)10-6
~factor (at 10 MHz) 25-80 20-100
Glass, metal-glass, cermet and plastic housings are used to seal the crystals
of semiconductor integrated circuits. The designs of flat housings 401.14-1
and 401.14-2 are shown in Figure 5.6.4. Housing 401.14-1 has a glass base
with 14 flat planar leads arranged along the long sides with spacing of 1.25
mm. The metal cover of the housing is soldered to the metal-coated surface of
the base. Metal-glass housing 401.14-2 has a metal bottom of the base, which
_ permits a significant reduction of the thermal resistance of the housing (see
Figure 5.6.3). Flat cermet housings with 24 and 48 leads are used to seal the
crystals of large integrated circuits. Examples of the design of cermet hous-
ings are shown in Figure 5.6.5. The leads on the body of the housing are
formed by the thin-film method (melting the metal into the ceramic. Airtight-
ness of the housing in the regions of the leads is provided by the use of a
multilayer ceramic. The crystal of a large integrated circuit is soldered to
the metal base of the housing to reduce thermal resistance.
Rectangular plastic housings are used extensively in integrated circuits and
large integrated circuits of personal and stationary calculators operating
under normal conditions. The contact surfaces of the crystal in the design
of plastic housing 201.14-1 (Figure 5.6.6) are connected to the leads of the
housing by wire jumpers. Crystals with spider leads are used in automated
assembly. Plastic housings are characterized by low cost and the poss~bility
- of automated manufacture. The disadvantages are the inadequate moisture re-
sistance, limited operating temperature range (-10 to +70�C) and rather high
thermal resistance (Rtk = 100�C/W). The latter circ.~umstance limits the use
of plastic housings only in comparatively low-power integrated ci.rcuits and
- large integrated circuits (P < 250 mW).
Round metal-glass housings 301.8-2 and 301.12-1 have 8 or 12 pin-type leads.
The design of housing 301.8-2 (Figure 5.6.7) is characterized by a good seal
and protection of the crystal against electro-nagnetic effects. However, this
housing design does not permit good thermal contact with heat dissipation and
high configuration density of computer equipment units.
35
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~1~ 0,43'mas
Kn~ov , ~ ~ ~ , , ~ h
H
C
E
h
~e
1,25
6�1,25-7,5
~ 9,8max
O H �
O` E.
~ 2 N
N
00
1
- . 2
_ o00
t'
3
3
, ~
5
~
- 6, .
Figure 5.6.4. Designs of Flat Glass (401.14-1) and Metal-Glass (401.14-2)
Housings with 14 Leads: I--glass base; 2--metal cover;
- 3--metal bottom; 4--planar leads; 5--contacts for connec-
tion of wire leads of crystal; 6--recess for crystal
Key :
- 1. Legend
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~ ,
~ t ~
; 1 4 i
. Z ~
5
7 r-~ 2
~ ~ ~ 3
6 y
~
4~ b 1
_ Figure 5.6.5. Designs of Flat Rectangular (a) and Round (b) Cermet
_ Housings with 24 Leads: 1--ceramic body of housing;
2--lead frame; 3--internal contact surfaces; 4--metal-
coated leads of housing; 5--metal base of housing (bot-
tom); 6--metal-coatinq molding for sealing; 7--recess
for crystal
H -
0
v E
~ ~ i ~ ~ ~ ~ -
I I I I I I I c
, 0,3ma~
i ' ~
~ ' .
2~5 0,5ma~c 75�p~2 '
6x 2 5~15
795ma~c
1~r >3 >2 f0 9 8
o K
+ v
- - ~n a E
ao h
N ~p^
(1) Mfov ~ 2 3~ ~ 5 6 T
2 85+425 -
Figure 5.6.6. Designs of Plastic Housing 201.14-1
Key:
1. Legend
37
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g,t45�~3~5~
3
2
y
~
. ~ ~ - s
l~5�0,7 6
e
~
C
~O
~
~O
~ ~ � ~
C
~ ~ 4~ �
BBeiBodoO R~0,5moa
Pt9,5max
~D~y3m~n
Figure 5.6.7. Design o� Round Metal-Glass Housing 301.8-2
Key:
1. Leads ~
BIBLIOGRAPHY
1. Yefimov, I. Ye., Yu. M. Gorbunov and I. Ya. Kozyr', "Mikroelektronika.
Fizicheskiye i tekhnologicheskiye osnovy, nadezhnost': Uchebnoye posobiye
dlya vuzov" [Microelectronics. Physical and Production Fundamentals and
Reliability--Textbook for Vuzes], Moscow, Vysshaya shkola, 1977.
2. Yefimov, I. Ye., Yu. M. Gorbunov and I. Ya. Kozyr', "Mikroelektronika.
Proyektirovaniye, vidy mikroskhem, novyye napravleniya: Uchebnoye poso-
biye dlya vuzov" [Microelectronics. Design, Types of Microcircuits and
New Directions--Textbook for Vuzes], Moscaw, Vysshaya shkola, 1978.
3. Fomin, A. V., V. F. Borisov and V. V. Chermoshenskiy, "Dopuski v radio-
elektronnoy apparature" [Tolerances in Electronic Equipment], Moscow,
Sovetskoye radio, 1973.
4. Gimpel'son, V. D. and Yu. A. Radionov, "Tonkoplenochnyye mikroskhemy dlya
priborostroyeniya i vychislitel'noy tekhniki" [Thin-film Microcircuits for
Instrument Building and Computer Equipment], Moscow, Mashinostroyeniye,
1976.
38
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5. Rotkop, L. L. and Yu. Ye. Spokoynyy, "Obespecheniye teplovykh rezhimov
_ pri konstruirovanii radioelektronnoy apparatury" [Provision of Thermal
Conditions in Design of Electronic Equipment], Moscow, Sovetskoye radio,
19 76 .
6. Synorov, V. F., R. P. Pivovarova, B. K. Petrov et al, "Fizicheskiye
osnovy nadezhnosti integral'nykh skhem" [Physical Fundamentals of the
Reliability of Integrated Circuits], edited by Yu. G. Miller, Moscow,
Sovetskoye radio, 1976. ~
7. Selyutin, V. A., "Mashinoye konstruirovaniye elektronnykh ustroystv"
[Machine Design of Electronic Devices], Moscow, Sovetskoye radio, 1977.
8. Valiyev, K. A. and A. A. Orlikovskiy, "Poluprovodnikovyye integral'nyye
skhemy pamyati na bipolyarnykh tranzistornykh strukturakh" [Semiconductor
Integrated Memory Circuits Based o~n Bipolar Transistor Structures], Mos-
cow, Sovetskoye radio, 1979.
9. Valiyev, K. A., A. N. Karmazinskiy and M. A. Korolev, "Tsifrovyye inte-
gral'nyye skhemy na NIDP-tranzistorakh" [Digital Integrated Circuits Based
on Metal-Dielectric-Semiconductor Transistors], Moscow, Sovetskoye radio,
19 71.
10. Kolesnikov, V. G., V. I. Niikishin, V. I. S~norov et al, "Kremniyevyye
planarnyye tranzistory" [Planar Silicon TransistorsJ, edited by Ya. A.
Fedotov, Moscow, Sovetskoye radio, 1973.
11. Yermolayev, Yu. P., M. F. Ponomarev and Yu. G. Kryukov, "Konstruktsii i
tekhnologiya mikroskhem: Uchebnik dlya vuzov" [Designs and Technology
of Microcircuits--Textbook for Vuzes], edited by U. P. Yermolayev,
Moscow, Sovetskoye radio, 1980.
COPYRIGHT: Izdatel'stvo "Radio i svyaz 1982.
6521
CSO: 1863/147
39
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, HYBRIDS
UDC 621.396.9(075)
TECHNOLOGY, RELIABILITY AND AUTOMATION OF PRODUCTION OF LARGE-SCALE HYBRID
INTEGRATED CIRCUITS AND MICROASSEMBLIES
Moscow TEKHNOLOGIYA, NADEZHNOST' I AVTOMATIZATSIYA PROIZVODSTVA BGIS I MIKROSBOROK
in Russian 1981 (signed to press 20 Jul 81) pp 1-4, 245-267, 314-346, 350-351
[Publication data, ann~tation, foreword, Section 9.3, excerpt from Section 9.4,
Chapter 11, Appendices 1 and 2, conclusion, bibliography and table of contents from
book "Technology, Reliability and Automation of Production of Large-Scale Hybrid In-
tegrated Circuits and Microassemblies", by Aleksey Vasil'yevich Fomin, Yuriy
Ivanovich Bochenkov and Viktor Andreyevich Sorokopud, reviewed by Department of
Microelectronics, Moscow Institute of Electronic Technology (Professor L.A. Koledov,
~ doctor of technical sciences, department head) and Department of Microelectronics
and Radioelectronic Equipment Design, Kazan' Aviation Institute (Professor Yu.P.
Yermolayev, doctor of technical sciences, department head), Izdatel'stvo "Radio i
svyaz 20,000 copies, 352 pages]
[Text] This book has been approved by the USSR MinistXy of High-
er and Secondary Specialized Education as a textbook for WZ stu-
dents specializing in "Design and Production of Radio Equipment"
and "Design and Production of Electronic Computer Equipment."
ANNOTATION
The authors discuss methods for designing and insuring the quality of microcircuits
and methods for and special features of calculating the reliability, functional ac-
curacy and technological reproducibility of BGIS's [large-scale hybrid integrated
circuitJ and microassemblies. They explain the basic technologic:al processes in-
volved in the production of BGIS's and microassemblies and discuss systems and meth-
ods for automating the designing of BGIS's and microassemblies and equipment based
on them, as well as methods for modeling and controlling the technological processes
involved in the production of BGIS's and microassemblies.
This book is intended for WZ students and specialists engaged in the design and
production of radioelectronic and electronic computer equipment.
FOREWORD
The present period of development of radio equipment building is characterized by a
universal transition from equipment based on discrete elements to microelectronic
equipment (MEA) based on integrated circuits (IS). In order to produce and develop
1~0
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MEA, it is necessary to know the phy~ics of operation, failure mechanisms and quali-
tative characteristic formation factors of MEA elements.
In high-quality MEA and vehicle-borne equipment with improved size and weight char-
acteristics, the basic design elements are BGIS's and microassemblies based on
housingless, semiconducting IS's. The qualitative characteristics and reliability
of MEA are determined by the qualitative characteristics and reliability of the
BGIS's and microassemblies. Therefore, an engineer engaged in designing and preduc-
ing MEA must known the technologcial design features of BGIS's and micrflassemblies
and their interrelationship with the functional parameters and master the methods
for calculating the quality characteristics of IS's, BGIS's and microassemblies and
the methods for their technological support and automated design and production.
Thi~ book is devoted to these questions. In it the following subjects are dis-
cussed:
the basic technological operations that form and determine the qualitative charac-
teristics of thin-film BGIS's and an analysis of their technical capabilities;
methods for and features of the calculation of the reliability, functional accuracy,
technological reproducibility and other qualitative characteristics of BGIS's and
microassemblies;
the state of and prospects for the automation of the designing, technological prepa-
ration for production and manufacturing of BGIS's and microassemblies, as well as
controlling their quality during the production process.
The explanation of the material and the engineering calculation methods is illus-
- trated with process diagrams, algorithm flowcharts and examples of designs and cal-
culations.
The book is intended to be used as a textbook for WZ students in specialties 0705
and 0648, the design and production of REA [radioelectroreic equipment] and EVA
[electronic computer equipmentJ. It can also be useful to REA designers and process
engineers specializing in the area of designing and producing microelectronic equip-
ment.
Materials from the domestic and foreign press, as well as the authors' works and
_ lectures, are used in this book.
The Introduction and Chapters 1, 5~, 6, 7 and 8 were written by A.V. Fomin, Chapters
2-4 by Yu.I. Bochenkov and Chapters 9-11 and the Appendices by V.A. Sorokopud.
The authors wish to express their sincere gratitude and thanks to Professors Yu.P,
Ye r�nolayev and L.A. Koledov, doctors of technical scisnc-es, and the collectives of
the Department of Microelectronics, Moscow Institute of Electronic Technology, and
the Department of Microelectronics and REA Design, Kazan' Aviation Institute, for
the valuable comments and advice offered durinq the review of the book that made it
~ossible to improve its contents.
CHAPTER 9. AUTOMATING THE DESIGNING OF BGIS'S AND MICROASSEMBLIES
SECTION 9.3. EQUIPMENT FOR AUTOMATING THE DESIGNING AND TECHNOLOGICAL PREPARATION
FOR PRODUCTION OF BGIS'S AND MICROASSEMBLIES
= 1~1
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Systems for the automated designing and technological preparation for production of
E3GIS's are based on modern computer facilities, most frequently on multicomputer
comi~lexes with a centralized structure. The central computer usually solves prob-
lems on the REA cell, subblock and block level, while the peripheral ones solve the
problems involved in the designing and technological preparation for production of
BGIS's and wiring boards.
Since the makeup of a SAPR's [automated design system] determines, to some extent,
the other equipment in the system, let us first discuss the hardware (Figure 9.3).
ueHmpunaNeid ~bivucnumene ca mmamnuu nepa~Oeputu (1~
Cprdcq~6a o6paDomA'u
- (6)
C rJco~Ba 6noK conp~~re,vu~r C edcm0a
N c yeNmp�pbNb/M P
- UI/C/1O/7~fIONOCO ?srvucnumene~ ~ ~ OOoda-BsiBoda ~ 11
O~auNUdedcm0un
( 2 ycmp oucmBa
~cnci~iadn, ManaA3BM OBoda-BaBada
namyu~an NautuNn'� co mmamNUU nep�~aneNmei 1
nepu~epueu $
9cmp oucmBa
CundunaNeiu 6nuK conuen~eNUn OBada-OnrBo9a
duu~~eu ~ ~ ca cpcdcm9an nep~oxQpm ~
4 Konnncnca 9
~ 9cmporlcm a
~pu4Dfl4CG'K!!(! NuKOnumtnu na xodupoBaNUA �
duCU~CU MCLH(!NlNd/X d!!C 'Q,C CpQQ1RY0CK0![
~ rj ~ v ACNIl1QX 1~ UN�OpMQq(l!! ~
CD~dC/1!9� C/1CdG'//l06 Bd/pyCA'Q C/16Q!!C/16N0lX
doKyNCHinupoBa,vu~ (15 ) /IICXN[lAOd(lYOCfi011 OCHQCIl/A'(L
/levamarou~ue u Nu,rpo~nun~- Mu,rpOq~omny�6apI16IB
Mupyrou{ue ycmpollc~iB�~ 16 ycmQyoO,Ya (19
~pa~u~ncmpoumenu(~7} rYoopaaHamoapa~abl (20 )
Figure 9.3. Hardware of system for automated designing and tech-
nological preparation for production of BGIS's.
Key:
1. Central computer with standard per- 10. Magnetic disk and tape storage units
ipheral gear 11. Input-output facilities
2. Operation interaction facilities 12. Punched tape input-output equipment
~ 3. Teletype, printer 13. Punched card input-output equipment
4. Character display 14. Graphic information encoding equip-
5. Grapliic display ment
6. Processing facilities 15. Documentation facilities
7. Unit for coupling with central com- 16. Printing and microfilming equipment
puter 17. Plotter
8. Small computer with standard per- 18. Facilities for output vi.a special
ipheral gear equipment accessories
9. Unit for coupling with other equip- 19. Microphone installations
ment in complex 20. Coordinate plotters
Computers from the YeS EVM [Unified System of Electronic Computers] are used as the
central computer: modeZs YeS1033, YeS1045, YeS1055, YeS1060 and BESM-6 [large digi-
tal electronic computer], wii:h devices for coupling with the complex's peripheral
~.2
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comPut~:r over either computer channels or a telephone-telegraph channel. An example
of such a complex is the automated work site for radio engineers (ARM-R), which is
based on SM [International System of Small Computers] and Nairi-4-ARM computers.
The ARM-R is a graphic, dialog-type complex that is intended for the automation of
engineering, design and tec:~nological problems, as well as to support the designer's
operational interact:ion with the SAPR.
The program compatibi].ity, standardization of the equipment interaction and textual
and graphic informati.on description structure, the presence of common computer sys-
tems elements, magrF�tic disk and tape storage units, input-output equipment and the
significant computational and logic capabilities of the processor of the small com-
puter used in the ARM-R insure [43]:
the solution of an extensive circle of REA design problems related to the reception,
storage and reprocessing of information;
data output on punched tape, printers, granh plotters and graphic or character
(alphanumeric) displays;
information input in the ARM-R's memory from the central computer, the SAPR, punched
cards and tape, magnetic tape, the graphic information encoding unit and various
keyboards;
reading or retrieval of information on magnetic tapes and disks;
communication with the SAP's central computer via computer or telephone-telegraph
- channels; '
conduct of a dialog clesigning mode, with access to programs in both the ARM-R's com-
puter and the SAPR's central c~mputer.
The makeup of the ARM-R was determined on the basis of its functional purpose, as
_ well as the composition and volume of the problems to be solved. The ARM-R was put
- together on the basis of series-produced hardware manufactured by domestic industry
or the countries in the socialist concord. '
The makeup of all BGIS SAPR hardware can be divided into five groups:
- data processing facilities (computers, magnetic disk (MD) and tape (ML) storage
units and communication equipment);
facilities for the input of textual and graphic information and information on ma-
_ chine carriers into the SAPR;
facilities for operational interaction between the BGIS and MSB [microassembly] de-
signer and the sys*_em;
facilities for the output of information on machine carriers and the production of
design and engineering documents;
facilities for producing special equipment accessories (photographic originals and
copies).
Let us discuss in more detail the composition and basic characteristics of ARM-R
hardware based on a small type M-400 or SM series comput~r, so as to evaluate the
~ ARM-R's capability for solving the problems in~~olved in the designing and technolo-
i
gical preparation for production of BGIS's and MSB's.
ARM-R Data Processing Facilities. These include the process control computer com-
_ plex (UVK), magnetic disk and tape information storage units, and devices for match-
ing the information excliange channels. Along with the standard input-output equip-
ment, the iNK contains a small M-400, SM-3 or SM-4 computer that is used as the
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ARM-R's host processor, performs the functions of a graphic display processor, and
acts as the ARM-R's logic nucleus (controls the ARM-R's equipment, converts informa-
tion and provides communication with the SAPR's central computer).
The complex of data processing equipment for an ARM-R based on an 1~I-400 UVK inCludes
a memory expansion unit. The total volume of the ARM-R's memory is 48 Kbyte. SM-3
and SM-4 UVK's have improved technical characteristics in comparison with the M-400. .
The maximum number of addressable 16-bit words is 32 K for the SM-3 and 128 K for
the SM-4.
Magnetic disk information storage units are used to store programs for the WK's
disk operating system (DOS), the ARM's DOS, the testing system, the real time sys-
tem, the package of applied SAPR programs, constants and the archives, and is de-
signed to operate with storage units of the IZOT-1370 type. The magnetic disk stor-
age unit has one constant and one replaceable disk. A magnetic tape storage unit
provides for the entry, storage and reproduction of information on standard magnetic
tape with an extzrnal reel diameter of 216 mm. The entry and readout rate is about
4,000 lines/s.
In addition to this, the processing facilities include units for matching the infor-
mation exchange channels between the ARM's and central computer's processors over
machine or telephone-telegraph channels.
Information Input Facilities. The ARM-R utilizes punched tape, punched card and
graphic info;~mation input (encoding) devices.
The punched tape and punched card input units are standard computer peripheral gear,
so let us discuss only the special SAPR graphic information input units.
The complexity of the design documentation is explained by the presence of variegat-
ed conventional symbols defined by YeSKD [Unified System of Design Documentation]
~ and YeSTD [Unified System of Technological Documentation~, the meaningful inter-
connectedness of the images in drawings, and the presence of arbitrarily arranged
_ syml~ols and texts. Manual entry in a computer of graphic information, which is done
with the help of special input languages, is distinguished by low productivity and
inadequate protection against human error. Therefore, automating the input process
is an urgent probZem that is being solved by the creation of automatic and semi-
automatic equipment. Automatic graphic information input units convert the traces
of lines and symbols on paper, tracing cloth, photographic film or some other carri-
er into digital computer code. The various designs of automatic graphic input de-
vices can be divided, according to operating principle, into two basic types: scan-
ning and tracking. In scanning devices, the field of a drawing is reviewed line-by-
line with the help of scanning systems. Scanning systems are based on ELT's
[cathode-ray tube] or electromechanical drives. Tracking units "follow" the lines
of a drawing, predicting their possible continuation and searching for the nearest
points of a line if ttiere is random drift.
Automatic graphic information input devices are used to enter relatively simple in-
formation in a computer: graphs produced on automatic recording devices, the out-
lines of flat parts. Therefore, they are still not used on a mass basis in REA and
MEA SAPR's.
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- r~~~�~i f�,r r_hc sernir~utomatic input of yraphic information have been used more wide-
1 y i r~ r~:cr~nt ycars . This is explained by the possibility of identifying the ele-
ment~s uf a drawing and synthesiZing a complete image of an object with human parti-
ciF,ation. A number of designs of semiautomatic devices for the input encoding of
graphic information (PAKGI) have been developed ,z,-~d realized on the basis of differ-
ent p'~ysical phenomena. Common to all PAKGI's is the principle of distribution o~
functions between the operator and the machine. The operator analyzes the drawing,
picks out the elements that need encoding, and sets the device's working member at
certain points on the drawing, after which--at his signal--it automatically computes
the points' coordinates and converts them into a digital code. Thus, a PAKGI is
used to automate one stage of the entry of a drawing into a computer (computation of
the coordinates of points in the drawing that have been designated by the operator).
One of the widely used graphic information input devices is the display. Despite a
number of positive qualities, graphic displays have shortcomings (low accuracy and
resolution, limited field (screen) size, low productivity, high cost).
Atp~opamap~ 1 ~ NO!(/UMNQ ~B~
(3 ~
B ~ '
Placuimu~v,oo - .S~cm,ooricmBo
0%vue ~ycmo- ynpoBneyun
yoB~a N,
~ne0eix BBodoa
KOO,OOI/NO/7/ ~ Q ~ ~ ~j ~ UNQDO,DiYO//UU
C~/B/11VUK /I,,;~nom
NOOPdUHO/!l
a ~ 6~ yn,oo9ne~u9 ~ ~
~S'onnymomo,o Cvemvu~r v
damvuKaB uadu~romo,o
a u y 8~ ,rud,ooB ~ 9~
y a
.Qadovee~
~0~~~ iYa~apyoe no~e (11)
(10) .
(12 )/I~aaurem Busu,oNOe ycm,poricmBo (13 )
Figure 9.4. Functional diagram of a PAKGI.
Key:
1. KeyE~unch machine 7. Control console
2. Typ~wri.ter 8. Commutator of x and y sensors
- 3. Com}~uter 9. Frame counter and indicator
4. Scaling and setting of zero coordi- 10. Working field
nates 11. Patchboard
5. Information input control unit 12. P.lotting board
6. Reader of x and y coordinates 13. Sighting device
- PAKGI's and displays are not mutually exclusive, but supplement each other. In con-
nection with this, the distribution of functions between displays and PAKGI's de-
pends on the nature of the problems to be solved by the system. Most typical is the
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FOR UFFIC'IAL USE: ()NLY
Il~ivann K;uipri (RK ~ia lIA(10~IIQM Kuopn~~uaTa ki(3)
u~~nc) (1) (4~3nnK
0-O
3na~~eu~ie x, (5)
0-9 uoMep Nourypa (2)
~--9 huup,li~H:~ra yZ ~3) -
I(uopu~ws~Ta z, ( 3 ) ( 4')3i+ax
(4)~3u:i~ 3Ha~~eu?~e yq (5)
3na~ieHFie x,(5) �
Koueu xaAea(fIC Ha eadopxoM
0-9 none) (6)
0-9 �
Koopnnnara y, ( 3 )
(Q~naK
U-9
3na~ieiuie y, (5)
0-9
0-9
Q-9
Figure 9.5. Structure of frame for EM-709 PAKGI in "outline" mode.
Key :
1. Beginning of frame (BK on patch- 4. Character
board) 5. Value of
2. Number of circuit 6. End of frame (IIC on patchboar')
3. Coordinate
distribution where PAKGI's are used to enter the basic mass of graphic information
and graphic displays are used for operational monitoring and editing of the informa-
t?on entered in the computer.
9~M ~ Let us discuss in more detail the technical
' ~~2'y2'~ characteristics and functional diagram
16 - 3 (Figure 9.4) of a PAKGI of the EM-709 type.
It is designed to operate in modes for en-
(x3,JJj coding points, outlines and lines. It
12 ~x~,y,~j makes it possible to correlate the dr~~aing
~,~2, being encoded to an electrically set coord-
inate network, round off coordinates, work
8~'~~yi~ ~'~~'ys~ in absolute and relative systems of coordi-
f~,~,y3~ nates, change and turn the coordinate axes
6~ ~ through angles that are multiples of 90�,
4 ~~'~~iJ produce a digital display of the determined
f.xo, ~
~~'2~y2~ coordinates, and form the code for a print-
2 ~`~''y'~ out, output on punched tape, or transmis-
~ sion to a computer.
2 4 b' S ,x, ~~r~
P'igure 9.6. Fragment of MSB topology. Structurally, the EM-709 PAKGI is a plot-
ting board with a control console, a mova-
ble patchboard and a sighting device. The EM-709 PAKGI has a plotting board with a
working field that makes it possible to encode drawings measuring 900 x 1,200 mm
with a coordinate determination error of +0.2 mm. In connection w~th this, the ori-
gin of coordinates can be moved beyond the limits of the plotting board's working
ficld to a distance of up to 8,200 mm and correlate the drawing being encoded to the
. clectrical grid with 0.1-, 1-, 2-, 2.5- and 5-mm discreteness.
Rs a result of the EM-709 PAKGI's operation, digital information is produced on
punched tape, a"Konsul-260" electric typewriter, ar directly in a computer. The
!~6
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`Pabl~ ~~.2. Result of Encoding Topology of Figure 9.6 With Help of EM-709 PAKGI
jl~ruwtR KoA IG~pxvHS+ii 3xavew~e
9M-709 ~ 1~I KoA~ 2 Kojla~ 3~ npwca:~e( 4,
10001101 8D BK Ffaeano xaupa(5)
- I 0110001 B i I � Kouryp Ns 1( 6)
I1011000 DS z I7p~i3uaK KOOPAHH8T6I x(7)
_ In1 t010r) Q4 4 x,=4
IOIIQI01 59 .u flpn3naK xoopAUr?arw ~(7)
110~ 10(?1 I 33 3 y~=3
'IIOIIU00 D8 x flp~t3HaK KoopltH~iaru x(7)
l0110010 ~ !32 2 x~=2
01011001 59 y IlpxsHax KoopAFixaT~ y(~~
10110100 B4 4 ~~=.4
I I01 IOOU D8 7G IIpN3H8K KOOpAyHflT61 X~
- OOIIOIIU 36 6 x~=6
O 101 t 001 59 I,~ IIpN3H8K xoopAxxar~c y( 7)
00110110 36 6 y~ ~ g
I1011000 D8 z Ilpxsxax xoopAexaTx x(7)
00111001 39 9 x~=9
~~0~ I~~I 5~ IJ ]-(PN3H8K ROOPJ(HH8Tt~[ j/ ~7~
1011010U B4 4 y~m4
11U11000 D8 z ~]~(PN3H8K KOOPJ(NHBTd X(7)
10110001 BI l
10t1000? BI ~ xs=11
0101 ] 001 ~9 y Iipxsttax xoop,�xxar~ y( 7)
IOt11000 BS 8 ys~6
0000t010 OA IiC I(oxeu xaApa($)
1000I101 8D BK Hayano xa,uga(5)
10110010 B2 2 Koxryp NQ 2(6 )
t 101 I000 D8 1C I~IpH3H2K KOOpRHH8T6t X( 7)
00110011 33 3 z~~a3
OIOIl00l 59 y IIpxsxax xoopAxHaT~t y~~~ .
OOIt0101 35 5 y~~=5
11011000 D8 , z TIPN3H8K KOOpANNflT6i X(7)
OOIIOIOI 35 5 z~~~5
0101~~~~ J9 ~J I~IPH3H2K KOOpAHHBTH /f ~7~
~~~~~001 B~ ~
ooi ioooo ao o } y'~m io
00001010 OA [1C Kotteu xaApa(8)
1~0~0~~~~ 30 BK Hayano xaApa(5)
1101I000 g x KoHryp Ns 3(6)
TIpN3H2K KOOpANN8Tb1 X ~ ~
~~~00~~~ B2 Q xn~~2
OlO11001 59 tf TIPN3HSK NOOpANH3T61 tf~7~
OO111001 39 9 y~,~=9
I 1011000 D8 z rIpN3H8K HOOpANFI8Thi x( 7)
00110110 36 G x'~=6
01011001 59 y T1pxsHaK KOOPAHH8T6[ ff ~ 7~
lO1t0001 B1 I
101101 I I B7 7 } y"s=17
11011000 D8 aG TIPH3H2K KOOPAHHBThi X~ 7~
001 I 001 l 33 3 = g
0101( 001 59 y rlpx3xaK K00()ANH$Tbi y( 7)
10110001 Bl 1
10110100 84 4 } y"a=14
- ~ IOI IOOO D8 z rIPN3H8K KOOPANHflT6I X~~]~
OOIIOl10 36 6 z"~=6
n~~~~~~~ 59 J/ TIPH3H8K KOOpANH8T6I ff~']~
10110001 B1 ~ } y"~=11
_ 0(?001010 OA I7C Koaeu xaApa (8)
~
Key:
1. ~M-709 binary code 5. Beginning of frame
2. 16-bit code 6. Outline No .
3. Meaning of code 7. Sign of , coordinate
4. Notes 8. End of frame
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~ FOR OFFICIAL USE ONLY
~A
~utput information is grouped in the form of frames corresponding to the type of in-
_�='formation being encoded: point, line, outline, or code. As an example, Figure 9.5
_2" depicts the structure of the frames of an outline, while Figure 9.6 is a fragment of
the topology of an MSB. Table 9.2 shows the information obtained as the result of
thc c:ncodiny of the topology in F'igure 9.6. In the binary codes presented in the
- table, "1" corresponds to a hole punched in a tape. This fragment was encoded in an
absolute reading mode with a grid with 1-mm spacing. All three outlines were plot-
ted clockwise from the lower left corner, with the encoding being done in terms of
the corner.
The EM-709 PAKGI makes it possible to achieve a significant increase i_n labor pro-
ductivity when entering graphic information in a computer, to a rate of 350-400
points/h or more.
Facilities for Operation Interaction With the ARM-R. These include character and
graphic displays, electric typewriters and teletypes.
Of these facilities for operational interaction of a designer with the SAPR, the
electric typewriter and the teletype are devices for conducting a limited dialog ~
with symbols. They are frequently used as the operator's console for entering or
removing several symbols or words when controlling the computer's operation.
For the conduct of a dialog in symbol form between a designer and the SAPR, displays
based on cathode-ray tubes, with both symbol and function keyboards, are the most
efficient.
3UM /~~~~~n Yur.npci/enu- qpeodpaap- ycunu- I
r.u~ri~~~ a,~v mcne Pe~ucm~i ~ame~n xud- mene
- ~ 1~ AYC'N!~ ~ ~ 3 (~Nl~IU(/MOl~O!! ~'OIIP(/llll(!q/ NanPn.weNUe MOOpl7U- I
NO/J1H6/!L
~4) 5 (6 (7 i
!/.rmpouci~iBu 3HaKO- /lpca6pa~o- Jcu/~u- i
I/l:pUddG'H!/N 8. tCNCp6(//9p HQ
pA~
N
C JH
KOBbI!! I
~
6nuK 6nu,r 6aax
pqvHUau cUcn,aBoeu ynpaBneNUn ycunumenb
Utludn ncpa nodcBcmon nqdcBcma
(11) (1~) (13) 14)
3~~15)
HN~OpMQ!{OA
0 JNQKC A'OCp- ~ 1 S
( ~,6 CBC/71OB041 duNam,z~ u y
nuffu~ii~yUV ncpo ~
Figure 9.7. Functional diagram of graphic display.
Key:
1. Computer 11. Manual input unit
2. CouF~ling unit 12. Light pen unit
3. Operational memory 13. Illumination control unit
4. Information distributor 14. Illumination amplifier ,
, 5. Coordinate register 15. ELT
6. Code-to-voltage converter 16. Keyboard
7. Coordinate amplifier 17. Light pen
~3. ~:ur~rr~l unit 18. Information on signs of x and y coord-
9. Sign generator inates
10. Sign amplifier
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Figure 9.7 is a functional diagram of a graphic display. The use of ELT's in the
display requires the solution of the problems involved in controlling ray deflection
with the help of signals from the computer. In the computer the signals normally
appear in digital form, but since analog signals (such as voltage) are required to
Control an ELT, a digital-to-analog code-to-voltage converter is used. Precise or-
servance of the temporal relationships is necessary in order to control ELT's; this
is provided by the control and synchronization units. Modern ELT's have little
afterglow, so in order to obtain a stable, nonflickering image under normal work-
place illumination, an image regeneration frequency of 30-40 cycles per second is
required.
Different methods are used *_o form the ima.ge on the display screen: point, vector
and step-by~-step modes or a mode utilizing straight line segments and short vectors
[45]. In the point mode, the image is formed from points on the screen that are
addressable separately and have coordinates that are given as x and y in the regis-
ters. Displays have ELT's with horizontal and vertical arrays ranging from 256 to
4,096 addressable points; for solving problems with the SAPR, displays with arrays
measuring 1,024 x 1,024 points or more are normally used.
In the point mode of a display for laying out some figure consisting (for example)
of 100 points, it is necessary to organize a computation cycle that repeats itself
_ 100 times and consists of approximately the following sequence of operations: con-
firm that i> 100 or not; send the values of xi and yi into the display's registers;
illuminate point (xi,yi); increase i by 1. This sequence of operations--a program
in the commands of the specific display--will contain 5-10 commands. In order to
execute such a program on, for example, a YeS 1020 computer (with an operating speed
of about 20,000 operations/s), it takes about 0.5�10-3 s, while execution of an en-
tire cycle requires about 0.05 s. Since it is necessary to have regeneration (re-
peated extraction of information from the computer ev~ry 0.03 s), the maximum number
of reproducibie points for the given computer must not be more than 100. In order
to obtain an image consisting of 1,000 points, it is necessary to have a computer
with a productivity rate of at least 300,000 operationsjs (such as an M-400). From
this it is obvious that a point display is useful for images of simple figures and
sets of individual points.
In order to depict on a display's ELT diagrams and drawings consisting of a set of
lines, the vector mode is used. In this mode, Oxi and ~yi give the displacements
along the corresponding axes from the previou5 point depicted on the screen. The
basic advantage of the vector mode is the smaller OZU [operational memory] capacity
and the possibility of producing a quite complex image on the screen.
The substantial savings in memory in the vector mode as opposed to the point mode
can be demonstrated with a simple example. In order to store information about the
framework of a sketch drawn around the working field (1,000 x 1,000 discrete points
of the array) in the point mode, it is necessary to store 4 x 1,000 point coordinate
values; in the case of the vector mode, it is sufficient to store the coordinates of
the initial point and the values of four increments along each of the x and y axes.
- As a rule, displays operating on the vector generation pri~lciple utilize several op-
erating modes. The straight-line-segment (vector) mode is used to produce long
lines. When the image contains many curved lines, the short-vector mode is used.
~ In this mode, in order to record ~X and ~Y it is sufficient to use 4 bits instead of
.
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the 8-10 bits required in the straight-line-segment mode. This makes it possible to
reduce the memory capacity even further. ~
Displays can usually function in different modes, and the capability of changing
from one mode to another is provided in order to insure optimum reproduction of dif-
ferent parts of an image. This can be done by various methods. One of them is the
designation of the appropriate mode parameter in the special commands of the program
controlling the functioning of the display. ~
The designer's work with a BGIS SAPR involves constant participation in the design
process, correction of the decisions made by the computer, modification of the ini-
tial conditions and, finally, active intervention in the process of the solution of
problems that cannot be completely formal~.zed. Thus, the designer needs both hard-
ware and software that give him the capability to enter the necessary information in
the computer on an operational basis.
A SAPR usually has as part o� its linguistic capability certain graphic languages,
while the operators can have a line-by-line entry capability that makes it possible
to enter geometric information from such operational interaction devices as electric
typewriters, teletypes, or the symbol and function keyboards of the displays. Dur-
ing the process of designing a BGIS, it is most convenient to conduct a dialog on
the level of geometric images, where the designer has the ability to modify some
figure or sketch fragment displayed on the ELT for analysis. In order to insure
graphic interaction there exist such devices as a light pen, a tracking cross, ana-
log input devices of the myshek [translation unknown] type, a tracking ball, a co-
ordinate knob and so on [45].
lla~e~paNU~.~`~`~ Let us discuss the light pen used in the
~1~ Soviet-made YeS7064 and EPG-400 displays.
- ~'upnyc-- ~ ~ ~
~2~ ,rNOnKU Figure 9.8 is a block diagram of the light
~am(3; pen. If a point or line is in the pen's
_ field of view, an impulse is generated in
i~a~na~q~ the photomultiplier every time the given
~O/7703/1CKO1~10 NU~O �
!'MHU.M'!ll.~~enN element of the image is regenerated. This
_ ~ ~~"d"~u`~ im ulse is formed and transmitted to the
cBemodad P
(5) display's control unit. The output impulse
6�oK Ky~n
p~ucmBy appears simultaneously with the image of
~oprrup0- 9 P nexuA
BONflN the element on the screen. This makes it
(6 u,vnynacoB possible to determine the specific indicat-
Figure 9.8. Block diagram of a light ed element of the image.
pen for a display.
Key: Let us examine the technical characterist-
1. Field of view ics and capabilities of the ARM-R's symbol
2. Housing and graphic displays.
3. St~utter button
4. P}~otoelectronic multiplier bulb The "Videoton-340" symbol display in the
5. Plexible light guide ARM-R is used as a systems console for the
- 6. Impulse formation unit reception of control information, such as
7. To control unit a directive from the BGIS and MSB develop-
er, and the depiction of inessages, as well
_ as for the depiction and editing of symbol information. On the display's screen,
which measures 200 x 140 mm, it is possible to reproduce a text of 16 lines, with up
50
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to 80 symbols per line. The display's operating modes are as follows: autonomous,
operation with the computer, information transmission from the buffer memory into
~ the computer and parallel printing on a typewriter of the buffer memory's contents.
The display has the following text-editing capabilities: clearing of the image on
the screen, setting of a tag in the first position of the first line, movement of a
tag in four directions, tabulation, replacement, insertion, deletion of a character,
insertion and deletion of a line, memory protection, underlining, raising of a frame
one line upward and replacement of the last line.
The EPG-400 graphic display in the ARM-R is used to enter, depict and edit graphic
and symbolic information on an ELT screen. The display utilizes a channel that
gives direct access to the computer's memory in order to register an image on the
screen. It provides for the depiction of information in the following modes:
plotting of symbols;
plotting of long vectors, star vector points and right angles with absolute and rel-
ative assignment of coordinates;
plotting of short vectors with relative assignment of coordinates;
plotting of graphs with automatic increments along the x and y axes;
marking arbitrary positions with any symbol. �
- Images with the following parameters can be depicted on the EPG-400's screen: image
size--240 x 240 mm; number of addressable points--1,024 x 1,024; number of line mod-
ulation levels--8; types of lines--4 (continuous, dotted, dash, and dot and dash).
The graphic display provides for the entry of information in the computer by means
of symbol and function keyboards and a light pen that has resolution no worse thar~
seven units of the array.
The ARM-R complex contains the following documentation facilities: an alphanumeric
printer, a plotter and a microfilming unit.
The experience gained in automating technological design work shows that even a
small amount of manual intervention in the drawing up of technical doruments causes
their quality to deteriorate, so it is not advisable to use a SAPR that does not
' provide automatic registration of the design process's results in the form of docu-
ments acceptable to the archive services of enterprises.
An alphanumeric printer (ATsPU) is used for the output of textual 3ocumentation
(specifications, tables of coordinates and so on). The ARM-R has an ATsPU that fea-
tures sequential printing with a mosaic set of symbols. Each symbol is formed by a
- ~oint-type mosaic matrix of 7 x 7 elements. The printing is done on perforated pa-
- per up to 420 mm wide, with up to 4 copies. The maximum printing rate is 180 sym-
bols per second.
- I'lottcrs controlled by the computer or perforated or magnetic tape are used for the
~roduction of graphic information (graphs and diagrams, functional and electrical
ciiagrams, design and engineering drawings) in a BGIS SAPR. Plotters are semi-
automatic electromechanical drawing devices that consist of a recording unit (Figure
9.9) that reproduces an image on some carrier or another (paper, photographic film
and so on), a unit that controls the plotting process, and a unit for the entry and
conversion of the input information.
51
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FOR UFFICIAL USC~; UNLY
- C neQ ~oseymb~ The functioning of plotters is based on the
(C MOLN4TN0!! A?NI/lb/~ ~ 1 ~
6no,r ~oe
oeo- ~o~
avQ- principle of converting input commands into
aeoaQ eQHU~ ~oaap~~ proportional movements of a writing unit.
BONNb/X C//CNOqOD dOHMI/,f
4 The writing assembly is put into motion by
step electric motors (or direct-current
6no~ electric motors) throuqh mechanisms for
ynpaOne- non~map pvmvp converting rotary motion into progressive
xuM nocT- .,uNUd cuMOcnoB
poumeneM motion. Depending on the form of the docu-
~5~ mentation being produced, the following
types of writing devices are used: pens, ~
lUatoe~,u !!/ataBs~u
aeuzamanb aeuzameeb rapidografy [translation unknown] , light or
- laser recording units or a precision en-
nnaH
~98~.. g~ving unit and so on. Plotters are
o equipped with several (from one to six)
(10) ~ U writing devices that are filled with dif-
nuurywec! ferent inks and draw lines of varying
- ycmpnucmBo
- thickness.
Figure 9.9. Functional diagram of a
plotter. When both motors revolve alternately or si-
Key: 1. From punched (magnetic) tape multaneously, the writing unit draws hori-
2. Data input unit zontal (vertical) or slanted lines. A lin-
3. Signal matching unit ear interpolator is used to draw lines with
4. Data conversion unit an arbitrary inclination. Modern plotters
5. Plotter control unit are also equipped with linear-circular and
6. Line interpolator parabolic interpolators for drawing second-
7. Symbol generator order curves. For the production oF draw-
8. Step motor ings in accordance with YeSKD and YeSTD re-
9. Plotting board quirements, plotters have interrupters for
10. Writing device drawing dash, dotted and other non-
continuous lines. Leqends are inscribed on
_ drawings with the help of a pen or are printed by special symbol-printing heads that
are part of the plotter. .
As far as their design is concerned, plotters are either of the plotting board or
the drum type. Drum plotters are used for the operational output of information on
paper from a roll. Plotting-board plotters are more accurate than the drum types,
and are used to produce drawings and photographic templates.
The specifications of several types of plotters are presented in Appendix 1.
Plott~rs have systems of control commands that are formulated in accordance with
thcir capabilities and purpose. The system of commands for the AF-7252 plotter that
is part of the ARM-R's hardw~tre comF~lex is presented in Table 9.3. It is easy to
understand the rules for encoding graphic image by examininq an example of the
� control program for drawing thc figure shown in Figure 9.10. When operating in the
~ncrement mode, the segment that is being drawn or the transition (with the writing
- device lifted from the carrier) is a number of steps or half-steps in 16th form.
The control program consists of a heading, data and a graph completion indicator.
The heading consists of the commands that determine the plotter's operating mode.
The data consist of a sequence of increments in the coordinates of points in the
graph that give the magnitiide and direction of movement of the writing device. The
commands are given as two bytes. The first byte contains command indicator 2A,
5?
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Tablc 9.3. System of Commands y~y
for AP-7252 Plotter
20
HaHMe.HOeaH~~e xo.aeHAd I 18�pN~ B
~ 1 ~ npeACraen ~
~ ~
C N
( 3 ) PeNCyM npNpau~eNxA 04 �
(4') Nxxpe~eHTanbxd~ pe- 26 A �
NCH1t
( 5) Pa6ora c nonxd?s wa- 15 . j~ ~
ro~
(6) Pa6ora c nonywaroe+ 16 E
~ B~6op nxmyulero yrr- 21 ~5 '
poi~rrsa Ns I
( 7) Bm6op nxmyiuero ycr- 22
poNCrea Ns 2
(7) B~6op nHmyu~ero ycr� 23
poHrr~a Ns 3 ~ '~~My
(8) iTu~llyu~ee ycTpoi~crao 06 Figure 9.10. Example of topological
/ ORyCTNTb fi ure = writin device No 1;
1y~ TINIllYlllCe yCTP011CT80 n7 9 g
~ noAj~Arb = writ.ing device No 2) .
(10 ) 1(oaeu nocneuosarenb- 8l
HOCTN KOMBH{[
- (11) I(otieu rpac~Hxa 82 whil~ the second contains the command code
' (see Table 9.4). The i.n~rements in the co-
Key: 1. Name of command ordinates of the points in the graph are
- 2. 16th-form representation given by four bytes: two bytes for ~x and
= 3. Mode of increments two for Dy. Negative increment values are
4. Incremental mode given in a supplementary code.
5. Operation with full step
6. Operation with half step One promising documentation method is
7. Choice of writing device No . micrography. Micrography makes it possible
8. Lower writing device to solve most problems involved in the
9. Lift writing device long-term storage and circulation of infor-
10. End of sequence of commands mation in SAPR's and ASUP's [automated pro-
11. End of graph duction control system], including those
connected with reducing the volume of the
document depository, achieving a significant reduction in the time required to re-
trieve needed information, and reducing the mass, volume and--consequently--cost of
the documents. The solution of all these problems is possible because of micro-
miniaturization of documents with complete preservation of their special graphic
features.
_ Photographic films in different formats are used as microcarriers. Microcarriers
are classified as continuous (microfilm) and discrete (microcards). Microfilm is
normally used for the archival storage of documents and the creation of an insurance
stock of documents.
~ Discrete microcarriers are used to create flexible information systems in ASUP's and
SAPR's. As a rule, a discrete microcarrier is a card made of photographic film on
either a paper or a plastic base in combination with the film. The most widely used
microcards measure 105 x 148 mm and are called microfiches. A microfiche has a vis-
ually readable heading, and when 20-fold reduction is used, 72 pages of text can be
- placed on it. In connection with this, a reduction in the volume of the printed
unit by a factor of 70-75 can be achieved, which makes it possible to create themat-
ic card libraries and archives of typical BGIS SAPR technological design solutions
that contain a great deal of information.
' S3
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FOR OFFI('IA1. II~F. !)NI.Y
~rr~t~lc, ~).4. Program for Drawing Topology of Figure 9.10 With AP-7252 Plotter '
Ko~aei (i, I KoM?+erraP~ ~
2A ,
} Pa6oTa a npypauteHi+�x (3)
2A } Pa6ora c nonH~ wacoM(4)
l5
2A } RNwyu~ee ycTpo~creo Ns 1(5)
21
'lA 1 [l~wyu~ee yCTPO~CTBO OIIyCTNTb ~Fj~
06 ~
80 1 ~x = 0
00 ~
A, nxiiiyulee ycTpo~3crao N_ 1( 5)
R�i t
Bo J �y = 60 -
} fluwyu~ec ycrpoi~creo Jw 2 (5)
83 } Gx-45
80
B, nywyulee ycrpo~icTno N^. ~5~
80
Ufl Ay - 0
FF_
70 } ax = -20
C
F ~
70 } ay = -20
81
gp } Gx - 20
FE - } D
} ~y = 20
FD .
~p } Az - -45 ,
RO _ F
00 } ~y 0
~
R;, } Koueu rpac~uKa (7) '
~I 1
H~ 1 hoi~eu nocneAOeaTe:IbHUCTN KoMaii,4 (8)
Kc~y :
1. C'ommancls 5. Writing device No .
2. Comments 6. Lower writing device
3. Work in increments 7. End of graph
4. Wark with full step 8. End of sequence of commands
P'or the production of special technological equipment, in addition to the ARM-R
equipment facilities, BGIS SAPR's ani3 ASTPP's (automated system for the technologi-
- cal preparation of production] also include devices such as a koordinatograf [trans-
lation unknown] and a microphotocomposition unit.
In order to produce the originals of BGIS phototemplates, program-controlled
koordinatografy are widely used at the present time. They consist of a drawing
5~
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tablc, a device for information input from punched tape, and a control unit. The
basic technical parameters characterizing a koordinatograf are its speed and drawing
accuracy. These parameters are closely interrelated: increasing the drawing speed
leads to a lowering of accuracy and vice versa. The type of koordinatograf chosen
depends on the required accuracy in the production of the phototemplate originals.
Modern program-controlled koordinatografy have a drawing accuracy of 20-150 um at
drawing speeds of 2.5-25 m/min.
One wide'ly used program-controlled koordinatograf is the EM-703 [16], which combines
high productivity (up to 5.5 m/min) with high accuracy (+50 um) and a large field
for movement of the working tool (1,200 x 1,200 mm), which has a linear-circular in-
terpolator that makes it possible to cut out both rectangular and curvilinear out-
lines. This koordinatograf contains a high-speed tracking drive for moving the car-
riages that is based on direct-current motors, as well as a system for continuous,
automatic orientation of the tool's cutting edge in the direction of the cut. The
presence of a special device makes it possible to use the koordinatograf to draw on
photosensitive material with a light beam during the designing of IS and BGIS wiring
cards. The coordinate table insures high accuracy of the mo~~ements over the entire
working field because of its rigid design and the presence of photoelectric sensors
and mechanisms for the correction of screw errors.
The original of a phototemplate produced on
NcmavNUK Cnep~oncNma~ the koordinatograf is photographed with a
cBema (c MazxumHOu
~1, . ~2~eHina) special precision camera in order to obtain
3am0op an intermediate original, which is then
~2~ y~~~vov- copied on a glass substrate.
~me~
eBuaa
: r
~ (4) In order to insure the required degree of
,quaq,PazMa ~ au~oN integration, accuracy and productivity in
(5) 3BM the production of special technological
06aeKm 0 6~ equipment for BGIS's and MSB's, there has
cman ynp�C~e- begun a transition to image generators,
(g f~- which are program-controlled optico-
; ~amonnacmaHa 10~ mechanical equipment for the production of
Figure 9.11. Block diagram of photo- primary phototempla~e originals. The pri-
composition unit. mary originals can be used directly for the
Key: l. Light source production of standard phototemplates on
2. From punched (magnetic) tape photorepeaters [16] without preliminary re-
3. Shutter duction.
4. Input device
S. Diapltragm The method of image generation by photo-
6. Control computer composition is the most widely used one.
7. Lens Figure 9.11 is a diagram of a photo-
�3. Control unit c~mposition unit. The phototemplate is di-
9. Table vided, with the necessary angular orienta-
10. Photogra~hic plate tation, into elementary rectangles of dif-
ferent sizes and with different side orien-
tations. These rectangles are then positioned highly accurately with the help of
the coordinate table and then imprinted in the necessary places on a photographic
plate. The advantage of photocomposition consists of higher productivity, and when
the coordinate table and the control system are designed appropriately, this method
provides very high accuracy.
55
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h'OR l)H'M7('IA1, litil~. UNI.Y
The EM-549 microphotocomposition unit has a working field of 140 x 140 mm, with po-
sitioning accuracy of +0.5 Um. The size of the image elements that are generated is
0.30-3U mm. The unit's productivity is 2,400 exposures per hour. The EM-549 micro-
photocomposition unit utilizes a coordinate table on an air cushion, while movement
along the axes is accomplished with the help of a motor with a developed rotor. The
unit's large working field makes it possible to use it in the production of high-
quality thin-film BGIS's. ~ao working modes (photocomposition and scanning) make it
possible to use it not only to generate phototemplates, but also as a photorepeater.
Its broad scaling range (2-10) makes it a general-purpose device.
Specific systems for automating the design and production preparation processes are
put together on the basis of SAPR hardware. The hardware of SAPR's for different
purposes are, as a rule, identical in functional makeup. They differ in the charac-
teristics of the individual devices.(operating speed of the computer, magnetic disk
memory capacity, accuracy and drawing speed of the plotter, printing speed for tex-
tual documents and so forth). The software is basically individualistic and is de-
termined by the specialization, purpose and quality of the SAPR and the technologi-
cal preparation for the production of BGIS's.
SECTION 9.4. METHODS AND ALGORITHMS FOR AUTOMATF~ DESIGNING OF BGIS'S AND MICRO-
ASSEMBLIES �
~tao methods--automatic and interactive--have been developed in the process of auto-
= mating the 3esigning of BGIS's.
The automatic.design method's essence is that synthesis of the design is carried out
only by the SAPR's facilities, according to a certain algorithm, while the designer
gives the initial data, sets off the design process, and evaluates and approves the
d~cision that is produced.
In the interactive method of design, there is interactian between the designer and
- the SAPR facilities in the synthesis of the design. It is based on that division of
functions between them that makes it possible to use the creative qualities of man
and the computational power of computers to solve a formulated problem in the best
combination and as efficiently as possible.
In the automatic synthesis of a BGIS design, the design process is divided into sev-
eral stages because of the complexity of the solution of the problem as a whole and
the lack of general, effective optimization criteria. The design process is usually
divided into the following stages: layout of the BGIS, calculation of the pellicu-
lar elements, placement of the pellicular elements and discrete components on the
substrate, and layout of connections. When the design process is automated, each
stage has its own specialized algorithms and criteria. Communication between the
stages is realized through transformable computer models of the BGIS and special
criteria. The special criteria of the individual stages allow for the special fea-
tures of the subsequent design stages; for instance, during BGIS layout the number
of external leads is minimized, thus reducing the nu*nber and length of connections
between the BGIS's. In the placement stage, using the criterion of minimum connec-
tion length, the total length of the connections is reduced as they are being laid
out on the BGIS substrate.
BGIS layout differs little from the layout of cells on printed-circuit cards, and
the same algorithms and criteria are used for the solution of these problems [46].
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Layout algorithms can be categorized as sequential, parallel-sequential and itera-
- tive. In sequential algorithms, the layout process is realized sequentially, with
one of the design elements being added to the next MSB in each stage. In parallel-
sequential algorithms, some initial set of groups of elements is first singled out
and then distributed by assemblies, with due consideration for the layout criteria
and limitations. Sequential and parallel-sequential algorithms are used to create
the elementary layout variant for the given limitations on the number of elements
and leads on the MSB substrate.
Iterative layout algorithms are used to improve some initial layout variant in ac-
cordance with an adopted criterion. The basic optimization criteria are a minimum
number of BGIS's and a minimum number of interassembly connections, while the limi-
tations are on the number of elements in the BGIS's and external leads on the sub-
strate.
During the stage of placement of pellicular elements and discrete co:nponents on the
BGIS substrate, their optimum spatial positioning on the substrate is determined.
A frequently used placement optimization criterion is the criterion of minimum total
length of the connections.
Depending on the structural features of a BGIS, it is possible to use criteria that
minimize the number of connection intersections or layers of connections on the sub-
strate.
Placement problems can be divided into two types: placement of structurally mono-
typical components modeled on the substrate by points in previously given coordi-
- nates, and placement of heterotypical pellicular elements and discrete components,
having a great variation in geometrical dimensions, on a continuous model of the
substrate without fixing their positions. Problems of the first type are typical
for digital devices. There are several types of algorithms for the solution of
these problems [46]:
placement algorithms that use mathematical methods for solving function pr~blems.
For placement modeled by a linear function problem, a Hungarian algorithm is used,
while for placement modeled by a quadratic function problem, the method of branches
and boundaries is used;
structural placement algorithms utilizing a sequential or parallel-sequential pro-
cess for the arrangement of components at positions given by coordinates create a
placement that can be an initial one for subsequent optimization according to a cer-
tain criterion;
in iterative algorithms there is reposi.tioning of the components (or groups of them)
after the initial placement is produced by one of the structural algorithms. Itera-
tive algorithms require substantial expenditures of computer time and are used to
obtain a final solution.
The following recommendations on the use of placement algorithms can be made for di-
- yital BGIS's. When the re are limited computer time resou~ces, relatively fast
structural algorithms for initial placement should be used. Among them, the simp-
- lest ones from the realization viewpoint are algorithms for placement based on com-
pendency. For relatively small problem dimensionalities, these algorithms can also
he used to deternline the final placement.
In order to obtain more accurate results, it is advisable to combine a fast initial
algorithm with an improving iterative one. Practice shows that this gives better
57
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than when the initial positioning is obtained by some method that is more or less
random.
Among the iterative algarithms, the most effective methods are based on paired re-
arrangements of elements in truncated neighborhoods of interrelated elements, which
makes it possible to reduce the time substantially while maintaining the same level
of accuracy in the result.
Problems of the second type are typical of digital-to-analog and analog devices,
which have a greater (by factors of tens to hundreds) variety of geometrical dimen-
sions of elements and components. These problems are frequently soived by the use
of interactive methods for arranging elements and components on the substrate with
the help of operational interaction facilities.
In Section 9.2 it was shown that modern SAPR hardware consists of devices that ex-
- pand SAPR and designer capabilities significantly. For operational interaction of
the designer with the system (that is, the conduct of a dialog), symbol and graphic
displays are used; for input of graphic information into the system--PAKGI graphic
information encoders; for the production of documentation and original photographs
of the layers--plotters, microfilming units, koordinatografy and microphoto-
composition devices.
The presence of these special facilities, computers of the SM series, the ARM's disk
operating system and a package of applied programs providing a mode where the de-
_ signer can conduct a dialog with the system, made it possible to create methods and
algorithms for synthesizing the designs of BGIS's and MSB's.
Since the complex of BGIS SAPR hardware contains a graphic display and a package of
applied graphic programs, it is possible to create an impression of universality of
these operational interaction facilities for the interactive solution of the indi-
cated problems when designing BGIS's. In reality, the EPG-400 graphic display has a
screen measuring 240 x 240 mm, while the size of the light beam on the display's
screen is focused to a diameter of 0.3-0.5 mm. Thus, one or two lines per milli-
meter can be distinguished on the display's screen. In order to represent on the
display's screen fully distinguishable elements of BGIS and MSB topology having a
minimum size of several tens of microns, it is necessary to represent the topology
with a magnification scale of 20:1, 40:1, or even more. From this it is obvious
that an MSB substrate measuring 24'x 30 mm can be represented on such a scale only
in the form of separate fragments comprising one-sixth or less of the area covered
by the substrate. Therefore, in the face of such great fragmentation, dialog de-
signing of BGIS's consisting of tens and hundreds of elements and components cannot
be sufficiently optimum because of the "nonreviewability" of the plan on the dis-
play's screen. The interactive arrangement method makes it possible to find the
first acceptable solution, since the optimization inherent in multivariant planning
is made more difficult. Besides this, the interactive method is more labor-
intensive and requires considerable amounts of time for the designer to interact
with the SAPR.
CIIAPTER 11. AUTOMATING CONTROL OF THE TECHNOLOGICAL PROCESSES INVOLVED IN BGIS AND
MSB PRODUCTION
Automating the production of BGIS's encompasses a broad circle of problems, ranging
from automating the design process and the technological pr~paration for production
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to automating the direct control of the technological operations and processes and
production sections as a whole. The improvement of the production process on the
basis of automation of the control of technological processes serves as a means for
increasing the productivity of labor, the quality of the articles produced and the
profitability of production.
At the present time most systems for the automated control of technological process-
es (ASUTP) involved in the production of microelectronic equipment are based on con-
trol computers. Modern facilities for the automatic collection and processing of
information make it possible to solve the problems involved in automating the con-
trol of technological processes and obtain results that increase the productivity of
labor, the quality of the output and production efficiency, which were impossible to
achieve with other control facilities and methods.
The introduction of ASUTP's makes it possible to do the following [13]:
realize a process with maximum productivity by automatically allowing for dev'iations
(drift) occurring in the technological parameters and the properties of the raw ma-
terials and semifinished goods, as well as changes in environmental parameters, op-
erator error and so on;
control a technological ~rocess by canstantly allowing for the dynamics of the plan-
actuality relationship for the list of products being manufactured (rated values,
classes, accuracy and quality groups) by timely resetting of the technological
equipment's modes, redistribution of the work among monotypical equipment and so on;
realize automatic control, according to an optimum algorithm, under conditions that
are harmful or dangerous for human life.
It is important that the introduction of an ASUTP in a complex with facilities for
the mechanization of manual labor (industrial robots) makes it possible to use labor
resources efficiently and solve the problem of the deficit of qualified and un-
qualified personnel. In addition, the introduction of an ASUTP produces (in princi-
ple) not only a direct economic (or socioeconomic) effect, but also makes it possi-
ble to obtain a large secondary effect, since it requires an improvement in the
overall level of technology, organizational orderliness of the production process,
and production efficiency.
All of this shows how essential the introduction of control computers in technologi-
cal production processes is for scientific and technical progress in radio equipment
construction.
11.1. STRUCTURE AND COMPOSITION OF ASUTP'S FOR THE PRODUCTION OF BGIS'S AND MSB'S
' At the present time, integrated automation of technological processes on the basis
of a systems analysis approach is widely used; this means not the development of an
ASUTP for a given technological process, but technological process-ASUTP systems
[zl-
~ The concept "technological process" as an object of control includes, in particular,
tlie technological equipment, with the exception of sensors and actuating members
that are structural elements of the equipment but are actually part of the ASUTP
hardware. In the following explication, therefore, control of a technological pro-
cess means control of the technological equipment's operating modes.
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ruK urri~ ~A~, u~r, un~.tr
Henceforth, the term "controlled technological process" will be understood to mean a
process for which the monitorable input effects (controlling, controlled) have been
determined, the deterministic or ~robability relationships between the input effects
and the output parameters of the article being produced have been established, and
methods for the automatic measurement of input effects and output parameters ancl
methods for controlling the process have been developed [2J. Thus, a controlled
technological process is one tnat, in principle, has been prepared for the introduc-
tion of an ASUTP; that is, for the creation of a technological process-ASUTP system.
9npa0nqiou{aN JdM
I- 'JBHH - - - -
oiiepumu 3 ( 2, 9cinpuucmda Onepunm
cBn~u 3UM 3
HCnunNUmens- c uncpa;nupaM
Nb/C
9cm~uucmBa ycmpnucmCu (4) ~1Cmp0uCn~BO
,ruHmpunH dnN ,ruHmpona dnR
_ uaepaioupa ( 5) Onepamo~~( 3 oimpaiuapa
(6) (7)
I I ,QamvuKU g) ~ ,qamvu,ru( )
Bo3deucmBuN~ r - - - -J - ~
_ ~ 1 ~ ~~~I~QC/1HCM6/L' (I61XOdN0f! .
(11 kaNmponupyeMare napaHemp
TexHU~u~uvecKUU npaqecca ~15)
eynpaBnNe,vme ~ ~~?OK~~~ (14 )
NCKONmponapyeaeie
Figure 11.1. Generalized block diagram of a techn~logical process-
ASUTF system.
~ Key.
l. Control computer 8. Sensors
2. Information input-output devices 9. Effects
3. Operator 10. Controlled
4. Devices for computer communication 11. Monitored
with operator 12. Uncontroiled
5. Actuating members 13. Unmonitored
6. Monitoring device for operator 14. Technological process
7. Monitorinc device for operator 15. Output parameter of process
Figure 11.1 is a generalized diagram of a technological process-ASUTP system. The
ASUTP in this system must predict, on the basis of an analysis of the measured val-
ues, the path of the process and realize that plan of controlling effects such that,
at a certain moment of time, the state of the process corresponds to some value of
the generalized process quality criterion that is close to optimum. As is obvious
from Figure 11.1, in addition to the control computer the ASUTP contains a compl~x
of information input-output devices (UWI), actuating members and sensors that are
connected, on the one hand, to the computer through the UWI and, on the other, to
ti~c~ controlled object. In a special case, measurement of the technological parame-
ters and control of the actuating members can be carried out through the operator
(dash lines in Figure 11.1).
_ The control functions are realized ground?essly, automatically, or with the partici-
pation of man in individual (or all) circuits. At the present stage, for all
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practical purposes, primarily in preparatory, monitoring and assembly operations,
- without the participation of man it is extremely difficult to realize control of
technological grocesses, so--as a rule--an ASUTP also contains different devices for
communicating with operators (signal panels, mnemonics, displays, manual information
inp~~t and output consoles).
- Among other production processes, the production of BGIS's and MSB's is distin-
guished by the multiplicity of the technological processes, which differ in the na-
ture of the procedures (discrete, continuous, continuous-discrete), the physical es-
sence (vacuum, electrochemical, thermochemical and so forth), and the organizational
indicator (group or individual processing).
An analysis of the different technological processes and operations involved in the
- production of BGIS's and MSB's and an investigation of technological prccess-ASUTP
systems make it possible to formulate the characteristic features of processes as
objects oz`. control:
substantial dependence of the results of a subsequent operation in a single techno-
logical process on the preceding one;
the diversity of the raw materials and relative instability of their properties;
- the presence of temporally changing uncontrollable and even unmonitorable effects;
a tendence toward changing over to highly productive, mechanized realization of the
_ process (complexly mechanized technological lines), which practically eliminates the
possibility of manual control of the process, and allowing for the effect of dis-
turbing (controllable and uncontrollable) effects;
the presence of a large number of operations in mass production that were previously
done manually (monitoring, assembly, installation and others).
For different technological and production processes (spraying, painting, vzhiganiye
[translation unknown] and others), these factors are not of equal weight as far as
- their effect on the quality of finished articles is concerned, although it is essen-
tial that in the production of practically any BGIS or MSB, the percentage of output
of serviceable articles is considerably less than 100 percent.
A no less important factor (specific for the electronics and radio industries) that
reduces production efficiency is the continuously changing portfolio of orders when
there is an extensive goods list of rated-value types and classification groups of
articles being produced. Using old technology and production control methods, the
timely and complete satisfaction of a request is an almost unsolvable problem. ~
These special features in the production of BGIS's and MSB's determined the objec-
tive necessity of introducing automated control systems of both separate determining
technological operations and as technology and production as a whole.
Modern ASUTP's are constructed on the basis of control computers that receive infor-
mation about the course of a technological process, process the information in ac-
cordance with the control algorithm that is entered in the memory in the form of a
package of programs, and transmits regulating actions to the actuating members or
advises the operating personnel through information display facilities.
- In practice it is important to know what functions an ASUTP can perform relative to
a s~~ecific technological process and what are the sources of the economic effect
achieved by introducing the system, with due consideration for the functions beir.g
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62
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I~~rformed. A certain degree of clarity in this question is made possible by the
_ classification of ASUTP's by functional-algorithmic features (Table 11.1) proposed
in [15]. Let us examine in more detail the functions of ASUTP's on the basis of
this classifi^ation. It is necessary to allow for the fact that the functions per-
- formed by the systems in different classifications can overlap in a number of Caees.
The first class includes ASUTP's with the simplest control algorithms; in other
words, there is a completely controlled technological process that was previously
under the control of an operator. ~he basic function of the central processor of
such ASIITP's is to execute control programs with automatic time distribution. The
control algorithm is an established sequence of logical operations with conditional
or unconditional transitions from one operation to another.
' Systems of the first clsss include, in particular, direct multichannel digital regu-
lation systems or systems for the direct digital control of equipment, such as a
microphotocomposition unit.
The introduction of such automated systems makes it possible to:
eliminate incorrect human actions;
use, for control purposes, information in volumes that exceed considerably the
knowledge of a single operator;
operationally and accurately change the control program in accordance with a change
in the technological process's parameters;
increase equipment productivity as the result of eliminating manual control opera-
tions;
realize logic-program control of those operations and processes that man cannot con-
trol accurately and on a timely basis because of his relatively slow reaction to a
ch ange in the course of the process.
2'he block diagram of an automated system
_ ynpaon~awa~ asM (1) for the logic-program control of a single
technological operation is shown in Figure
11.2.
9BBM ~ 2 ~ ~ -1
I
The use of a computer fcr program cor~trol
IIC/JO/INU- ICIQAeS it possible to adjust control a]_go-
/7~CAAN~/C ~qamvuKU Onepamop rithms flexibl and o erationall and, in
oPaa~3) (4) ~5 addition, realize multiprogram control of a
6 group of technological operations (instal-
TexHOnotuvec.raHOnepaquA lations) in a time-sharing mode. In the
Figure 11.2. Block diagram of a sys- general case, the computer's memory stores
tem for the logic-program control of the control programs, the number of which
a single technological operation (in- corresponds to the number of control ob-
stallation). jects, while the general program--the dis-
Kcy: 1. Control computer patcher--organizes their multiprogram oper-
2. UVVI ating mode. Such systems have the follow-
- 3. Actuating members ing advantages over individual program con-
- 4. Sensors trol facilities:
5. Operator a reduction in the total volume of elec-
6. Technological operation tronic equipment and a corresponding reduc-
tion in capital expenditures for the auto-
mation of a technological process;
63
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F'()R OFN'1('IA1, 11~F: (1NI.Y
the t>ossibility of--parallel with the direct program control of individual opera-
tions--solving problems related to centralized monitoring, accounting for the work
being done and monitoring the equipment's tunctioning, overall control and, in the
case of control of monotypical equipment, redistributing the~work;
~he possibility of changing over to optimization of the control of the technological
process;
bilateral communication with integrated production control systems.
r _ _ _ ~ ~
(1~3BM r
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i KaNaA npapu6anu y~a~nAeM ~
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J-zo Z-eo -ao -zo 1-eo 2-e? ~ eo 4-eo
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_ (1 (1 ) (1 (13)
~
1-AycmaxaBKa 1[} Z-n ycmaHas,ra 14 -Aycma,vaC~ra 1~-A.ycmaNOBKa 14~
TexHana�uytCdue ycmpoacmB�(15)
Figure 11.3. Block diagram of a system for logic-program control,
with the help of a single computer, of a group of technological
units.
Key:
1. Computer 8. Relay input channel
2. Selector channel 9. Relay output channel
3. Program interrupt unit 10. Code-to-analog converter
4. Program-controlled channel 11. Sensors
5. Magnetic tape and disk starage 12. Actuating memb-ars
units 13. Channel No .
6. Alphanumeric printer 14. Uni.t No .
7. Analog-to-code converter 15. Technological devices
Figure 11.3 is the block diagram of a system for the program control of a group of
technological units (operations) with the help of a single computer.
The second class includes ASUTP's that, on the basis of a deterministic or statisti-
cal model of a process (see Section 10.2) entered in the computer's memory, solve
the problems involved in optimizing the process for the purpose of satisfying some
quality indicator. As has already been mentioned, for most technological processes
related to the production of BGIS's and MSB's, there is a typical dependence o.`. the
results of subsequent technological processes on preceding ones, along with the
presence of a significant number of uncontrollable and unmonitorable factors (in-
sl-ability of the properties of the raw materials being sprayed on, the effect of en-
vironmental factors and so on); that is, any process has stochastic (having the
64
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nnt~ire of regular randomness) and purely random (noncalculable) components. Under
:;ucl~ conditions an opcrator cannot conduct a technological process in a mode that is
clos~ to optimum, and in a number of cases this problem can be solved only by a con-
trol computer.
r (1 ~ 1-n onepayux ~ ~ (1) Z-~r onep~[qvR 1
( 1 N(~y~ 4C/llONdllff yC
QN~~ I I C/POM C//IONODR" (i~'/IION OA' I
~CP~ON
L _ _ .1 ~ - -
yaar3 )
SlnpoBn,viv 4H
- 3BM ~ Q )
Ko po.~eNn-
.rnaccu~u~rayuaKNae ~
o6opyaoon~5~ �
Figure 11.4. Blc^'~ diagram of a system for the optimum control
of a sequential cechnological process.
Key:
l. Operation No . 4. Control computer
2. Unit No . 5. Monitoring and classification equipment
3. UWI
The basic function of the computer in an au~tomated optimum control system is to per-
form, on the basis of ineasured values of the process's parameters and accepted math-
ematical methods (linear programming, regression and correlation analysis and oth-
ers), a greater (in comparison with logic-program control) number of computations
and to use the results of these computations to work out the controlling actions
(advice to the operator). The design of ASUTP's provides for equipment-program com-
muna.cation between succ~ssive operations in the process (Figure 11.4) and the exten-
s=ve use of inethods for the statistical control of a process as a whole (see Sec~ion
10.2), it being the case that the use of an ASUTP witY: adaptation is most effective
for many of the technological processes involved in the production af BGIS's.
In contrast to extreme control systems (without adaptation), where the optimum
strategy is determined unambiguously (the distribution of probabilities for the ran-
dom variables is assume~? to be known), during operation an adaptive control system
must recognize the nature of the random variables and, on the basis of the results
_ of the analysis, work out some optimum strategy or another. What has been said is
explained by Figure 11.5. From the figure it is obvious that the information enter-
ing the system's input is filtered (by either an equipment or program filter} in or.-
der to isolate information related to the effect on the process of uncontrollable
and unmonitorable factors (noise). The results of the primary processing of the in-
formation, on the basis of a mathematical mo~el, are used to pre3ict the course of
' thc ~~rocess, as well as to calculate the optimum mode for its conduct. The data ob-
tained are processed in a status analyzer. If the ~reas of technological process
prediction and optimum process conduct mode d:~ not intersect, control is t_ransferred
to a control process status.analyzer that, t1lr.ough a correction unit, makes the ne-
cessary correction in the mathematical model i~z order to improve the quali~y of the
control process. As soon as areas of prediction and optimum mode intersect, control
~ is transferred to the unit that is working out the control actions.
65
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N'OK OI~H'!('fAL (1tiE ONI.Y
r ANnnu.lamop~ MoOena , r GnuK ~
I( 2~ueNanotl I ~ ~ 5~npayccca I I'~ A~pcneKmudai ~
ANanu- I I ,~(CmCP- I I 6nuK I ~
I aamo0 Nu,vupo- np0eN0~a (1 q
1 ecxHeiv xo6a o q ~
~ curnanq 3 ~ n,ooueci( ) npaueccd 0~) F i ~
~ ~ ~ ~ ~ ~ 5E ~
~ e.~ a
~ AHanu- I( CmaxaCmu- ~ I 6noK I x ~ t
~amap vec,rur7 onn u~an
N ` e
- ~ uryM� ~ 4' ~ nPo4ecCi ~ eo pe,vrun� 1~1)
-
6naK
Koppe.ryuu
Figure 11.5. Block diagram of_ the information processing process
in an adaptive control system.
Key:
.l. Filter 8. Correction unit
2. Input signal analyzer 9. Prospects unit
- 3. Signal analyzer 10. Process course prediction unit
- 4. Noise analyzer 11. Optimum mode calculation unit
5. Process model 12. Sta~tus analyzer
_ 6. Deterministic process 13. Control unit
7. Stochastic process
The diagram presented for the information processing process in adaptive systems
- corresponds to the case where the results of a passive experiment are used in the
mathPmatical model. An adaptive control system's software can also include an ac-
tive experiment unit that, through an experimental analyzer unit, makes the neces-
sary correction in the mathematical model.
The third clas~ includes ASUTP's that monitor and control groups of processes or a
single complex process within the framework of a production subunit (section, tech-
nological line). ASUTP's in this class az�e systems of an organizational-
technological nature, which is determined by the purposes and problems in~o].ved in
controlling an object.
A system for controlling a group of technological operations is also charged with
organi.zation~l control problems that are aimed at reducing disorderliness in a given
production process and optimizing the goods list distribution of the artiales being
produced in accordance with the portfolio of orders. In this case direct control of
the technological process is subordinated to more general purposes and goals; that
is, this type of control of technological processes is of the integrated type.
In the gencral case the structure of integrated control systems is a multilevel one
(normally two or three hierarchica~ levels), it being the case that at least on the
upper level, the basic link in the automated control system is man. Integrated con-
trol systems are formulated on the basis of ASUTP's from the first or second class-
es. Their introduction is becoming more and more important because they are compo-
nent parts of the production control system as a whole and, therefore, carry out a
definite, more generalized assignment in parallel with the solution of a specific
technclogical process control problem.
According to the different classes of ASUTP's and the different vers;.ons of their
block diagrams, the equipment facilities of ASUTP's can be divided into the
66
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following four groups on the basis of their functional purpose:
facilities for processing information and solving technological process control
problems (control computers);
facilities for direct interaction of the ASUTP with the technological equipment
(sensors and actuating members);
facilities for transmitting and converting information from the sensors to the com-
puter and vice versa;
facilities for the interaction of operating personnel with the system.
CucmeMa KaNnneKCxaaa ynpaOaeHUH zpynna~i meXHO~otuvoc,YUx nuNr/ ~
CucmeMa ynpaBneNUn Cucma,va ynpaBneHUA
mexHOnotu vecKOd nur. utu ~ 2) mexNO~oeuyec~roJnrrHUer7 ~ 2~
ucmeNa ucmeNa ucme~a
� ynpaC~exuA ynpo~
~
xuA AOKQAbHO/f! ynpaOneNUA JJOKOAbNbIl~
anepaqued onepaque~7 Peaynrmap onepuyued Peaynnmap
Figure 11.6. Generalized block diagram of an integrated ASUTP.
Key:
l. System for integrated control of a 3. System for control of operation No .
group of technological lines 4. Local regulator
2. Technological line control system
ASUTP's in the second and (particularly) third classes have a complicated hierarchi-
cal structure (Figure 11.6) and consist of several computers: a central control
computer and less powerful peripheral control computers that carry out the primary
information processing and realize the special control algorithms.
- In the general case, the complex of ASUTP equipment can consist of th~e following de-
vices:
a central control computer with a priority program interrupt unit, selector and
program-controlled channels, and devices for bilateral automatic exchanges with the
_ upper-level computer(s) and the lower-level minicomputers that control the separate
technological operations or processes;
an expanded complex of inemory units, including large-capacity magnetic tape and disk
- storage units;
a complex of information input-output devices, primarily for digital single-bit and
symbolic information, as well as analog-to-digital and digital-to-analog converters
with .channel commutators;
a central monitoring and control board with a mnemonic diagram of the controlled ob-
ject, an information display (for both textual and graphic information), and a docu-
mentation unit;
� local subsystems for the automatic monitoring and control of technological opera-
tions, with panels for the bilateral exchange of information with the central con-
- trol computer, as ~+rell as visual depiction and documentation units;
communication line concentrators with commutators and analog-to-digital and digital-
to-analog converters;
primary information sensors, including automatic analog and digital information sen-
sors, as well as local consoles for the manual input and transmission of information;
actuating members.
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A more detailed description of this hardware and its characteristics is given in
[2,15J. The specifications of the control computers, minicomputers and micro-
processor microcomputers are presented in Appendix 2.
11.2. AUTOMATED TECHNOLOGICAL PROCESS CONTROL SYSTEM FOR THE PRODUCTION OF THE
_ PASSIVE PART OF THICK-FILM BGIS'S
Before describing the ASUTP for the production of the passive part of thick-film
_ BGIS's, it is necessary to discuss the basi~ characteristics of this process as a
controlled system. A diagram of the technological process involved in the produc-
tion of thick-film BGIS's is presented in Figure 11.6. From the diagram it is obvi-
_ ous that the process consists of one group of preparatory and three groups of basic
operations: manufacturing of the passive elements, monitoring-classification and
assembly.
This process is characterized by a large number of technological operations, com-
plexity and an abundance of various random effects; as a consequence, the process's
reproducibility is comparatively low.
The group of operations for the production of the passive elements (preparation of
- the pastes, application and vzhiganiye of the conductors, dielectrics and resistors) �
determines the integral value of the thick-film technology.
The basic components of the conducting and resistive pastes are finely dispersed
powders of precious metals, a special qlass frit and a mixture of organic liquids.
The paste is applied by an automatic UPM3.280.000 unit, which has the following spe-
cifir.ations:
Number of simultaneously treatable cards . . . . . . . . . . . . . . . . 2
Number of four-position swivel tables . . . . . . . . . . . . . . . . . . 2
Paste application . . . . . . . . . . . . . . . . . . . . . . .double-sided
Operating cycle, s . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Regulation of wiper's rate of motion continuously adjustable
Leveling of paste in front of wiper . . . . . . . . . . . . . . . automatic
Card feed for charging . . . . . . . . . . . . . . . . . . . . . automatic
Vzhiganiye of the passive part of thick-film BGIS's is a complex process, for which
a Furnace of the SK-10(16.5)UP type, having five temperature zones, is used. In the
first and second zones the organic components are eliminated from the paste, in the
third and fourth an oxidation-reduction process takes place, and in the fifth the
glass is sintered with the ceramic substrate, thus completing the process of the
formation of the thick-film resistors.
- ~1n analysis of the distribution of reasons for rejection shows that the greatest
percentage of rejection (37 percent) occurs during the inspection after the resist-
ors undergo vzhiganiye, although the causes for the appearance of the defect actual-
ly build up during all the precedinq operations and are determined by the quality of
the preparation of the substrate, its dimensions, the shape and quality of the sur-
face, the quality and uniformity of the resistive pastes' composition, the quality
of the pattern, the application conditions and the temperature and temporal condi-
tions of the vzhiganiye process. Thus, the percentage of output of serviceable
BGI5's depends both on controllable and uncontrollable and random factors.
_ 68
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nopo~uKaC ~ 2 I napaHempaE antNeMmnB I ~ 2 g
---f---� -4
ApMUpoBaHUe � ~ ~ ~ /Ia~zoHK MoNma ~ ~
C60poVN6J //Q/~/ (!!/716/ ANf! ' Kapnyc o- lepNemu9a-
q p ~ ~CJL'G/IIOQ ~ OK/A!/BHb X BOH!/C CXBM !(!U? CdC/M
anepagu~A 2 9~ ~ 3 g~yM'eNUe ~ ~ Bn no~uHana 3ne,veNmoB ~ ~
Figure 11.7. Diagram of technological process for the production
of thick-film BGIS's.
Key:
' 1. Preparatory operations 18. Input monitoring and calibration of
2. Group treatment substrates
3. Chemical and thermal treatment of 19. Monitoring of poured masses and degree
_ substrates of dispersion of powders
4. Preparation of finely dispersed Ag, 20. Monitoring of viscosity of pastes
Pd, Ag20 and glass powders 21. Monitoring of appearance
5. Production of patterns 22. Monitoring of parameters and separation
6. Individual treatment into groups
7. Production of bodies 23. Monitoring of appearance after tinning
8. Preparation of compound 24. Monitoring of appearance and parameters
9. Production of passive hybrid inte- 25. Monitoring of appearance and parameters
grated circuits of unsealed IS's
10. Preparation of conducting di-' 26. Input monitoring of active elements
electric and resistive pastes 27. Output monitor 3 of finished elements
11. Application of conductors 28. Testing
12. Vzhiganiye of conductors 29. Assembly operations
13. Application of dielectrics 30. Reinforcement of cards with pins, tin-
14. Vzhiganiye of dielectrics ning
15. Application of resistors 31. Adjustment of resistors to rated values
- 16. Vzhiganiye of resistors 32. Assembly of active elements
17. Monitoring and classification oper- 33. Enclosure of circuits
ations 34. Sealing of circuits
With the tielp of a mathematical description of this complex p'rocess, models for the
technological process involved in the production of the passive part of thick-film
- BGIS's have been obtained. For instance, by using screening experiments and the
methods of prior ranking and random balance, the basic factors of the technological
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process that have the greatest effect on the reproducibility of the resistor:~ wc~re
discovered. By realiziny a fractional factorial experiment of the 26-1 type (see
Chapter 10), it is possible to obtain a mathematical model for the pastes used in
thick-film resistors:
yom - 0.478 + 0.085x1 + 0.053x~ - 0.07x5 - 0.012x1x5 - 0.012x4x5.
Using this mathematical model, it is possible to exercise control over the technolo-
_ gical process for producing the passive part of thick-film BGIS's according to the
- rated value of the resistors' resistance.
TexNOnaeuvec,ruu npoqccc
OpuzumnBneNUe d'oHmpnAb
_ peaucmuBne~x yQNCCCNUC BerutaNUe conpomuBncNUn
nacm ~ 2~ P~~ucmopa0~ peaucmoqnd, peaucmopa
p5 ~
~.3 ~4
PezynAnwp
~{amvu,ru cKOpocmu
meNnepamypa~ dBu.weNUA
fl CA'RJ10C KUNOCliCQHU(!
~fj ) neHmnr nevu ~
One~amnp
mexNOnoru- A'aMn rAa~na
- /CCKUJO � /YOMMqmQa~ap OUCKpCO1Nbl,C
iipuytcca �NanoeoBau cur.NanO 9 cuzHanaB
C 8 AHaeozo- qu~po- _ ~ 1 O~
_ qu~poBod aNanaaaBer~r ~omn-
npao6paso- npeoQpaeo-
ecme ell eame 12 oam
nda
3ne,rmpuvecKaA
nuruyu{aN , ManaA 3BM P~
M(I(UUHKQ �3ne,rmpoNUKa-100" ~a
(14 �A'aNCyn-Z54" 15 . pa
_ Figure 11.8. Block ~diagram of ASUTP for manufacturing the passive
part of thick-film microcircuits.
Key:
1. Technological process 9. Analog signal commutator
2. Preparation of resistive pastes 10. Discrete signal commutator
3. Applicati~an of resistors 11. Analog-to-digital converter
4. Vzhiganiye of resistors 12. Digital-to-analog converter
5. Monitoring of resistors' resistance 13. Photoreader
6. Temp~~rature and speed sensors 14. "Konsul-254" electric typewriter
7. Furnace conveyor belt speed regula- 15. Small "Elektronika-100" computer
tor 16. Perforator
8. Tecnnological process operator
Let us examine in more detail an ASUTP for manufacturing the passive part of thick-
film microcircuits (Figure 11.8). This system realizes the foll~wing:
local control of the resistor vzhiganiye operation (on the control level);
control of the operations of preparing and applying the resistive pastes (on the
information-advisory level);
operational monitoring and supervisory control of the production of the passive part
of a BGIS;
automated statistical monitoring of the thick-film resistors' parameters.
As its main output parameter, the ASUTP uses the percentage of output of serviceable
cards after the resistor vzhiganiye operation.
70
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The ASUTP f~r the production of the passive part of thick-film BGIS's and MSB's is
constructed according to a hierarchical principle. On the upper level of the sys-
tem, analysis of the technological process is carried out and automated statistical
monitoring according to the quality indicator--percentage of output of serviceable
pas~ive cards--is conducted. Or the lower level there is automatic or manual (ac-
cording to "advice" from the system) control of the technological modes in the basic
operations [23].
The nature of the control is determined on the basis of an analysis of information
about the results of the automated statistical monitoring, for the conduct of which
the initial information is a data sample about the resistors' resistance after
vzhiganiye that is obtained from an automatic resistance monitoring unit through a
discrete channel commutator. The initial data are used to calculate the percentage
of output of serviceable cards.in the sample, the percentage of output of servicea-
resistors according to their rated values, and the mean arithmetic values and root-
mean-square deviations of the resistance of the resistors in the sample.
Sampling data accumulated over a week's time are used to calculate the average value
of the output quality indicator and the lower monitoring alert boundary. The cur-
rent value of the percentage of output of serviceable cards in a sample is compared
- with the value corresponding to the lower monitoring alert boundary, and when it is
greater than the value of this boundary, there is a changeover to automatic control
of the speed of the furnace's conveyor belt. However, if the percentage of output
- of serviceable cards in the sample is smaller than the lower monitoring alert limit,
the sampling parameters are analyzed and the results of the analysis are used to
ctiange over either to automatic control of the furnace's conveyor belt's speed ac-
cording to one of the rated values within the limits of the limitations on the tech-
nological vzhiganiye conditions or to the informational-advisory mode of controlling
the resistor application and vzhiganiye operations. In this case, advisory informa-
tion on the change in the technological vzhiganiye (temperature in the furnace's
sintering zone) and paste application (change in the wiper's pressure, replacement
of the pattern and so on) modes is printed out.
If the current value of the percentage of output of serviceable cards in a sample is
below the allowable level, as determined by economic considerations, a recommenda-
tion for replacement of the resistive pastes is printed out. Correspondingly, in-
formation on the distribution of the resistances of the resistors in the sample is
both printed and punched out; the technologist uses this inf.ormation to make an op-
erational analys~s of the process. Information that has been accumulated from sev-
eral samples is processed by statistical analysis programs in a"Minsk-22" computer.
The automatic mode utilizes a self-adjusting algorithm that constructs a mathemati-
cal model of the dependence of the resistors' resistances on the speed of the fur-
. nace's conveyor belt, with correction of the model's parameters according to the
current values of the resistors' resistances, the cc,nveyor belt's speed v and the
temperature T in the furnace's sintering zone. Information on the temperature and
s~eed are entered in the computer, from the appropriate sensors, through an analog
channel commutator and an analog-to-code converter. The mathematical model for the
vzhiganiye process is a second-order polynomial:
R= av2 + bv + c when T= const.
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- The model's coefficients a, b and c are computec~ as the result of the solution of a
� system of linear equations by Kramer's method. The constructed model's parameters
are used to determine the correcting action ~v, which is transmitted through a code-
to-analog converter and the analog channel commutator to the speed regulator, which
_ changes the furnace's conveyor belt's speed.
Information on the state of the resistive pastes, the resistor application condi-
tions and the planned quota and actual output of articles from the conductor and re-
sistor application and vzhigani~e operations is entered in the computer through one
of the recording devices (a manual input unit, an external UWI, or the computer's
keyboard register). The resultant control information for the current moment is
printed as a table, with a periodicity determined by the technological cycle for the
- resistor vzhiganiye operation, and then transmitted to an information panel through
an independent control board.
The system's hardware complex is based on an "Elektronika-lU0" computer. In addi-
tion, the system contains the following equipment:
four temperature sensors, having a measurement range of 250-760�C with sensitivity
o f 100 i~V/deg ;
a speed sensor that converts the furnace's conveyor belt's speed into an analog sig-
nal (1-5 V); the measurement limits are 15-150 mm/min with a sensitivity of 0.5 V�
�min/mm;
a speed regulator that controls the actuating mechanism that changes the furnace's
conve~~or belt's speed within limits of 30-100 mm/min;
automatic resistance monitoring units that convert a resistor's resistance into a
discrete signal with 0.3-percent accuracy; the measurable resistance range is 1 S2 to
10 mS~;
an automatic card feed and resistor-contact unit that feeds the cards in and sorts
them into three'groups; the unit's productivity is 1,600 pieces/h;
an information panel with an independent control board, for the depiction of produc-
tion information.
~ The system's software includes: program modules for entering the resistors' resist-
- ances, the conveyor belt's speed and the furnace's temperature in the computer; sub-
programs for computing the percentage of output and quantity of serviceable cards,
~s well as the mean arithmetic value of the resistors' resistances, and analyzing
the technological parameters, computing the cliange in the conveyor belt's speed,
forming the voltage code according to the computed value of the change in speed,
gener.ating the correcting signal and sending it to the speed regulator, and comput-
ing the root-mean-square deviation; a control program; supervisory information input
programs for the automated statistical monitoring program; supervisory information
I~rinting programs and a series of standard programs for the "Elektronika-100" com-
~~uter, such a translation from the decimal to the binary system, multiplication, di-
vision and so on.
By making it possible to achieve the optimum change in the temperature conditions
for vzhiganiye and automatically correct the furnace's conveyor belt's speed, the
introduction of this system into the production process inereases the output of
serviceable cards with resistors by more than 10 percent and the productivity of the
technological process by more than 40 percent [23].
72
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AI~Y1:iJU IY 1. SPT�.CIFICATIONS OF DEVICES FOR PRODUCING TECHNICAL DOCUMENTATION AND
INDUSTRIAL EQUIPMENT
YeS7033 Alphanumeric Printer (for the output of textual documentation on paper)
Printing speed, lines/min . . . . . . . . . . . . . . . . . . . 1,100 or 550
Printing density, lines/cm . . . . . . . . . . . . . . . . . . . 2.4, 3.2
Number of symbols per line . . . . . . . . . . . . . . . . . . . 120, 128, 160
Size of symbols, mm . . . . . . . . . . . . . . . . . . . . . . . 2.4 x 1.4
Capacity of buffer memory, bytes . . . . . . . . . . . . . . . . 160
Power consumption, kW . . . . . . . . . . . . . . . . . . . . . . 3.5
Operating conditions, �C . . . . . . . . . . . . . . . . . . . . 5-40
Dimensions, mm . . . . . . . . . . . . . . . . . . . . . . . . . I,250 x 820 x 1,270
Weight, kg . . . . . . . . . . . . . . . . . . . . . . . . . . . 700
, YeS7051 and AP-7251 Graphic Plotting-Board Recorders (for the automatic drawing of
graphs, diagrams, drawings anc: functional and electrical diagrams)
The YeS7051 unit works with YeS-series computers or the FS-1501 photoreading device.
The AP-7251 unit works with ARM computers (ASVT-M or SM computers) or from an
_ AP-5080 NML [magnetic tape storage] or from an FS-1501.
Technical Parameters YeS7051 AP-7251
Working field, mm 1,000 x 1,050 1,189 x 841
Minim:im spacing, mm 0.05, 0.025 0.05, 0.025
Maximum drawing speed, mm/s 50 100 or 50
Number of types of lines 3 3
W~dth of lines, mm 0.3, 0.6, 0.8 0.3, 0.6, 0.8
Number of drawable symbols Up to 255
Number of angles of symbol inclination 16
Number of scales or symbol dimensions 3
Repetition, mm +0.1
YeS7052 and AP-7252 Drum-Type Graphic Recorders (for the automatic drawing of
graphs, diagrams, drawings, small-format drawings and functional and electrical dia-
grams)
The YeS7502 works with YeS-series computers, an FS-1501 photoreading device and YeS
computer NML's. �
The AP-7052 works with ARM computers (ASVT-M or SM computers), the FS-1501 photo-
reading device and the AP-5080 NML.
Technical Parameters YeS7052 AP-7252
Working field, mm 600 x 380 594 x 420
Minimum spacing, mm 0.1, 0.05 0.05, 0.025
Maximum drawing speed, mm/s 100 250, 100
~ Number of types of lines 3 3
Width of lines, mm 0.3, 0.5, 0.8 0.3, 0.6, 0.8
Number of drawable symbole 65
Symbol dimensions, mm 3.0, 6.0, 12
or 1.5, 3.0, 6
Repetition, mm +0.2
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KPA-1200 Koordinatograf With Program Control (for programmed drawing of any outlines
approximating straight lines, ares of circles and parabolas)
This koordinatograf is used to perform the following operations:
four-color drawing on paper, with an automatic change of colors, with curve-drawing
instrument;
cutting enamel with a cutter having tangential control;
engraving Qn enamel or metal;
producing phototemplates by drawing with a light beam directly on the emulsion layer
of a photographic material.
When operating with the photographic head, the koordinatograf's working field is
shielded from light.
= Working area of the coordinate table, mm . . . . . . . . . . . . . . . 1,200 x 1,200
Maximum straight line drawing rate, mm/s . . . . . . . . . . . . . . . 90
Positioning accuracy, mm . . . . . . . . . . . . . . . . . . . . . . . 0.05
Number of replaceable diaphragms . . . . . . . . . . . . . . . . . . . 24
Maximum size of printed element, mm:
on 1:1 scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 x 18
on 1:2 scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 x 8
Width of lines , mm . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1-5.0
Drawing scales . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1:100, 1:50,
1:20, 1:10,
1:5, 1:2, I:1,
2:1, 4:1, 5:1,
' 10:1, 20:1,
5C:1, 100:1
EM-538 Precision Photokoordinatograf (for producing phototemplates of multilayer
~rinted-circuit cards and microassemblies by the method of generating an image on
photographic film with the help of a modulatable light ray)
Structurally, this photokoordinatograf is a two-coordinate table with independent
movement with respect to the x and y coordinates. Step motors are used for the
drive. The table's upper plate, to which a vacuum cassette with the photographic
film is attached (emulsion layer downward) moves along the x axis. Inside the ped-
estal is a carriage with a photographic head that moves along the y axis. The car-
riage with the photc~raphic head, which has an illuminating system, a high-
resolution lens and a symbol-changing mechanism that is a diaphragm with 93 ele-
ments, is used to obtain lines of different widths, contact areas and alphanumeric
information.
Maximum size of working field, mm . . . . . . . . . . . . . . . . . . . . . 450 x 450
Discreteness of movement, mm . . . . . . . . . . . . . . . . . . . . . . . 0.~20
Positioning error, mm:
- of printing assembly elements . . . . . . . . . . . . . . . . . . . . . . +0.03
of literal and digital information . . . . . . . . . . . . . . . . . . . +0.05
Maximum size of symbols, mm . . . . . . . . . . . . . . . . . . . . . . . . 5
Maxi.mum size of printable fragments, mm . . . . . . . . . . . . . . . . . . 25
Number. of diaphragms in photographic head . . . . . . . . . . . . . . . . . 93
Width of lines, mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1-2.5
Maximum rate of movement, mm/s . . . . . . . . . . . . . . . . . . . . . . 67
- APPENDIX 2. SPECIFICATIONS OF MICROCOMPUTERS FOR ASUTP'S [61)
Elektronika S5-O1
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This multicard, general-purpose microcomputer consists of the following modules:
microprocessor, operational and permanent memories, memory control and central
input-output control. It has a developed input-output system that contains a varia-
ble set of modules: parallel interface, an interrupt and timer module for organiz-
ing the microcomputer's functioning on a real time scale, and a module for cont~ol-
ling telegraph equipment, devices for information input-output on punched tape, a
typewriter, an analog-to-digital converter, and devices for communicating over tele-
phone and telegraph links.
Operation speed, thousands of operations/s . . . . . . . . . . . . . 10
Number of basic commands . . . . . . . . . . . . . . . . . . . . . . 31
Word lenqth, bits . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Memory capacity, Kbytes . . . . . . . . . . . . . . . . . . . . . . . 28
~ Interrupt system . . . . . . . . . . . . . . . . . . . . . . . . . . three-level
Interrupt depth . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operating temperature, �C . . . . . . . . . . . . . . . . . . . . . . -10 to +50
Power consumption, V � A . . . . . . . . . . . . . . . . . . . . . . . 90
Dimensions, mm . . . . . . . . . . . . . . . . . . . . . . . . . . . 420 x 3S0 x 225
Software: a dispatch system, peripheral gear controllers, library of standard
_ microprograms, library of standard subprograms, monitoring and diagnostic tests, as-
sembler and loader for symbol-encoding language, modeling programs.
This microcomputer is used in data transmission systems, small and medium-sized
ASUTP's to control equipment and industrial installations, control and measuring
systems, and automated testers, trainers, simulators and information collection and
processing systems.
~lektronika 55-02
This is a modified model of the "Elektronika S5-O1" microcomputer that has a more
developed input-output system for controlling an extensive set of peripheral gear.
Elektronika SS-11
A single-card, general-purpose control microcomputer that contains three basic units
connected by a single 16-bit main information line: microprocessor, input-output
unit, memory.
Microprocessor: arithmetic-logic unit, microprogram control unit.
Input-Output Unit: central control unit, communication links.
Memory: operational and permanent memories.
Control principle . . . . . . . . . . . . . . . . . . . . . . . . . . Microprogrammed
Operating principle . . . . . . . . . . . . . . . . . . . . . . . . . Parallel
Operating speed, thousands of operations/s . . . . . . . . . . . . . 10
Word length, bits . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Number of basic commands . . . . . . . . . . . . . . . . . . . . . . 31
Memory capacity, bi.ts:
operational memory' . . . . . . . . . . . . . . . . . . . . . . . . 128 x 16
permanent memory . . . . . . . . . . . . . . . . . . . . . . . . . 1, 024 x 16
Memory capacity enlargement capability, Kbytes . . . . . . . . . . . Up to 64
Input-output . . . . . . . . . . . . . . . . . . . . . . . . . . . . four 8-bit di-
- gital inputs,
four 8-bit di-
gital outputs
Working temperature , �C . . . . . . . . . . . . . . . . . . . . . . -10 to +50
Power consumption, V � A . . . . . . . . . . . . . . . . . . . . . . . 10
Dimensions, mm . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 x 270 x 28.5
Weight, kg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2
,
75
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This computer is used in programmed subscriber points, channel-switching equipment,
automated large-scale integrated circuit monitoring systems, design-testing systems,
telemechanical and industrial automation systems, microphotocomposition units for
the electronics industry and so on.
- In order to change the area of application of this microcomputer, it is sufficient
' to replace only two large-scale integrated circuits.
Elektronika S5-21
11 single-card microcomputer that is program-compatible with the "Elektronika S5-O1"
microcomputer. Striicturally, it is based on a single printed-circuit card that
holds a microprocessor, the operational and permanent memories and the input-output
- channels.
The input-output system includes four reorganizable 8-bit digital channels and two
sequentiai 8-bit digital channels. There is a capability for receiving information
over eight priority-interrupt channels and asynchronous operation with an external
memory. The frequency stability network is 600, 100, 60, 12 and 1001 kHz and 1 Hz.
This microcomputer is intended for use in systems operating on a real time scale.
Operating speed, thousands of operations/s . . . . . . . . . . . . . . 150-200
Word length, bits . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Memory capacity:
operational memory, bits . . . . . . . . . . . . . . . . . . . . . . 256 x 16
permanent memory , Kbytes . . . . . . . . . . . . . . . . . . . . . . 2 x 16
Memory capacity enlargement capability, Kwords. . . . . . . . . . . . Up to 32
Number of basic commands . . . . . . . . . . . . . . . . . . . . . . 31
Working temperature, �C . . . . . . . . . . . . . . . . . . . . . . . -10 to +5Q
Pocaer consumption, V�A . . . . . . . . . . . . . . . . . . . . . . . . 20
- Dimensions, mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240 x 180 x 30
Used in monitoring-measuri~ng and control equipment, communication links, terminal
units and so forth.
Kristall-60
A microcomputer based on a K580IK80 microprocessor large-scale integrated circuit
and a K505RU6 operational memory large-scale integrated circuit.
_ Operating speed, thousands of operations/s . . . . . . . . . . . . . . . . Tip to 500
~ Word length, bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Memory capac.ity, Kbits . . . . . . . . . . . . . . . . . . . . . . . . . . Up to 64
Number of commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Number of priority-interrupt levels . . . . . . . . . . . . . . . . . . . . 8
Peripheral Gear Complex: "Konsul-260~1" electric typewriter, FS-1501 photoreadinq
unit, i~L-150 perforator.
Periph~ral Gear Compl~x Enlargement Capabilitv: up to 256 input units and 256 out-
c~ut units.
Sc~ftware: cross-assembler, interpreter, emulyator [translation un7cnown], macro-
assembler, monitor.
Used in measuring devices, automated systems for monitoring and controlling techno-
loyical processes and industrial installations, information-measuring and testing
systems, scientific experiment automation systems.
Elektronika NTs-03
This microprocessor microcomputer consists of the following modules:
PRTsl, PRTs 2--processors,
PU1, PU2--modules for interaction with control console,
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AT--module for servicing inquiries on use of common main line,
UM--interface amplifier-matcher,
OZU--operational memory module with capacity of 2K, 4K, 8K words,
KK--"Konsul-260" electric typewriter control controller,
KSP--PL-150 perforator and FS-1501 photoreader control controller,
PW--"Videoton-340" display control controller,
W--progranm?able interface,
BP--power unit,
PPU--console.
Processor
Word length, bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Operating speed, thousands of operation~/s:
register-register type:
in single-processor version . . . . . . . . . . . . . . . . . . . . . . . . . 100
in twa-processor version . . . . . . . . . . . . . . . . . . . . . . . . . . 160
register-memory type:
in single-processor version . . . . . . . . . . . . . . . . . . . . . . . . . 50
in two-processor version . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Number of commands differentiable by operations code and form of addressing. 190
Number of priority-interrupt levels . . . . . . . . . . . . . . . . . . . . . . . 8
- Interrupt reaction time, us . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Number of user registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Memory Module
Volume. Kbytes . . . . . . . . . . . . . . . . . . . 32
Volume when additional modules connected, Kbytes. . 128
Program scope . . . . . . . . . . . . . . . . . . . short, relative, direct, through
register, stack
Data scope . . . . . . . . . . . . . . . . . . . . . short in zero page, direct,
through register with.increment
and decrement, with indexing
Interface compatible with interface of SM series
computers; exchange operating speed 100,000 words
Software: cross-system of programming realized on a BESM-6 large digital computer;
assembler, debugging system, text editor, library of standard programs, monitoring
system, punched tape operating system.
The following operations are carried out from the proyramming engineer's console:
power connection and disconnection, direct access to memory in readout and entry
modes, readout with display of processor registers, command-by-command execution of
- programs, halting of automatic execution of programs, memory cell display according
to a selected address in the automatic operation mode, initial setting of computer
modules, suppression of key actions.
There exist additional capabilities for organizing multiprocessor and multicomputer
complexes; complexes interacting at the common main line interface; the connection
of additional memory units; the connection of additional specialized units.
General Data
Powcr consumption, V-A . . . . . . . . . . . . . . . . . . . . . . . 30
Dimensions, mm . . . . . . . . . . . . . . . . . . . . . . . . . . . 483 x 360 x 221
Weight, kg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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H'UK UM'F'i(:IAL U~H: UNLY
u `I~h i:; n~ i~� rucuml~uter is used in systems for controlling technological processes and
- ra~asuring and monitoring-testing equipment, for the collection and preliminary pro-
cessing of data in information retrieval complexes, to solve engineering computa-
tional problems, and as a peripheral, programmable terminal controller in computer
complexes.
CONCLUSION
In order to acquaint the reader with the prospects for the further development of
microelectronics and radio equipment in the next decade and the problems for the so-
lution of which the future engineer specializing in the design and production of REA
must be prepared, let us discuss several prognostic evaluations of the development
of microelectronics and MEA based on it.
Microelectronics will continue to be developed at a rapid rate. It is assumed [11,
18,25] that the rate of growth of the degree of integration of IS's will even in-
crease and that the functional complexity will triple each year. Along with the im-
provement and expansion of production of IS's, there will be created complex solid-
state electronic instruments that perform the functions of units, devices and equip-
ment as a whole. Primary development will be maintained for discrete micro-
electronics; that is, the increase in the degree of integration will take place be-
cause of a reduction in the size of the transistors, diodes and resistors used in an
IS realized inside a silicon monocrystal. At the present time, however, the possi-
bilities of light photolithography can be regarded as exhausted. Therefore, for a
further reduction in the size of IS elements, to (50-100)�10-4 um, in the next dec-
ade we must see the industrial mastery of new technological methods for forming
structures on the basis of the utilization of electron-beam and X-ray lithography,
ion implantation and ion doping.
In connection with the increase in the functional complexity of IS's and the re-
quirements for improving their quality as well as the efficiency and accuracy of the
manufacturing process, in the next 10 years we must realize complete automation of
the processes involved in designing and producing IS's.
The acceleration of the rate of scientific and technical progress in radioelectron-
ics has resulted in a continuous increase in the complexity of MEA. At the present
time the complexity of some devices has reached 108 elements and is continuing to
grow. Under these conditions, a most important national economic goal is the utmost
~~ossible improvement in the quality and reZiability of MEA and the improvment of the
efficiency of its production. The successful solution of these problems is possible
_ only with full automation of the designing and produc*ion of MEA on the basis of the
utilization of computers.
This problem is complicated and multifaceted. For total automation of the designing
cL' MEA it is tiecessary, for example, to develop new and more accurate methods for
= computer calcizlation and modeling of the quality characteristics of the MEA being
desiyned, in order to replace laborious experimental investigations of these charac-
teristics. Further refinement is needed in the methodological questions related to
the creation of automated systems for technological preparation for production, the
autcmation of technologi~al processes and so on.
Thus, in radio- and microelectronics in the next decade, considerable attention will
be devoted to questions of automating the designing and production of IS's and MEA.
78
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Both domestic and foreign work experience in this area shows that an engineer con-
~ cerned with automation problems must be a highly qualified specialist both in the
area of designing and producing MEA and the area of computer technolog~ and program-
ming. Only when this is the case will the greatest effect in the solution of auto-
mation problems be achieved.
~
- BIBLIOGRAPHY
Basic
l. Aleksenico, A.G., "Osnovy mikroskhemotekhniki" [Principles of Microcircuitry
_ Analysis), Moscow, Izdatel'stvo "Sovetskoye radio", 1977, 405 pp.
2. Val'kov, V.M., and Vershin, V.Ye., "Avtomatizirovannyye sistemy upravleniya
tekhnol~gicheskimi protsessami" [Automated Systems for the Control of Technologi-
cal Processes], Leningrad, Izdatel'stvo "Mashinostroyeniye", 1977, 240 pp.
3. Aleksenko, A.G., Badulin, S.S., Barulin, L.G., et al., "Osnovy proyektirovaniya
mikroelektronnoy apparatura" [Principles of the Designing of Microelectronic
Equipment], edited by B.F. Vysotskiy, Moscow, Izdatel'stvo "Sovetskoye radio",
1977, 351 pp.
4. Parfenov, O.D., "Tekhnologiya mikroskhem" [Microcircuit Technology], Moscow,
Izdatel'stvo "Vysshaya shkola", 1977, 256 pp.
" 5. Fomin, A.V., Borisov, V.F., and Chermoshenskiy, V.V., "Dopuski v radioelektronnoy
- apparature" [Tolerances in Rac~ioelectronic Equipment], Mosco~u, Izdatel'stvo
"Sovetskoye radio", 1973, 128 pp.
6. Chernyayev, V.N., "Tekhnologiya proizvodstva integral'nykh skhem'' [Technology of
the Production of Integrated Circuits], Moscow, Izdatel'stvo "Energiya", 1977,
- 370 pp.
Suppl.ementary
- 7. "Avtomatizatsiya tekhnologicheskoy podgotovki na osnove YeSTPP" [Automation of
Technological Preparation on the Basis of the Unified System of Technological
Production Prepar�cion, collection of works], Moscow, Izdatel'stvo "standartov",
1977, 148 pp.
8. Avayev, N.A., Dulin, V.N., and Naumov, Yu.Ye., "Bol'shiye integral'nyye skhemy s
inzhektsionnym pitaniyem" [Large-Scale Integrated Circuits With Injection Power
_ Sup~ly], Moscow, Izdatel'stvo "Sovetskoye radio", 1977, 248 pp.
~3. Adler, Yu.P., Markova; Ye.V., and Granovskiy, Yu.V., "Planirovaniye eksperimenta
= E~ri poiske optimal'nykh usloviy" [ExpPrimental Planning With a Search for Optimum
Cond.itions], Moscow, Izdatel'stvo "Diauka", 1971, 279 pp.
10. (i~erri), R., (Kholl), P., and (Garris), M., "Tonkoplenochnaya tekhnologiya
[Thin-Film Technology], translated from English by V.I. Genkin and Ye.I.
_ Givargizov, Moscow, Izdate'stvo "Energiya", 1972, 335 pp.
_ 79
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, 11. Vasenkov, A.A., Sretenskiy, V.N., and Fedotov, Ya.A., "Three Problems in Soli~-
State Electronics," in "Mikroelektronika i poluprovodnikovyye pribory" [Micro-
el~ctronics and Semiconducting Instruments], edited by A.A. Vasenkov and Ya.A.
Fedotov, Moscow, Izdatel'stvo "Sovetskoye radio", 2nd edition, 1977, pp 3-19.
12. Val'kov, V.M., "Principles for the Designing of Automated Systems for the Opera-
tional Control of Technoloqical Processes," in "Elektronnaya promyshlennost'/
TsNII 'Elektronika [The Electronics Industry--"Elektronika" Central Scientific
Research Institute], P4oscow, lst edition, 1970, pp 17-21.
13. Va1'kov, ~I.M., "ASUTP v proizvodstve izdeliy elektronnoy tekhniki" [ASUTP's in
tne Production of Electronic Technology Articles], Moscow, Izdatel'stvo
"Sovetskoye ra~3io", 1974, 72 pp ("Elektronika" Central Scientific Research In-
>titute's Engineering Library).
14. Gavrilov, A.N., and Lebedev, N.A., "Tekhnologiya sistem upravleniya letatel'nykh
a~~paratov" [Technology of Aircraft Control Systems], Moscow, Izdatel'stvo
"Mashinostroyeniye", 1971, 484 pp.
15. Gavrilov, A.N., and Skorodumov, S.V., "Avtomatizatsiya tekhnologicheskoy
podgotovka proizvodstva" [Automation of the Technological PrQparation for Pro-
duction], Moscow, Izdatel'stvo "Znaniye", 1976, 64 pp.
16. Glazkov, N.M., "Oborudovaniye dlya proizvodstva fotoshablonov i vypolneniya
- operatsiy fotolitografii" [Equipment for the Pr.oduction of Phototemplates and
the Performance of Photolithography Operations], Moscow, Izdatel'stvo
"Sovetskoye radio", 1975, 72 pp.
17. Gorskiy, V.G., and Adler, Yu.P., "Planirovaniye eksperimenta v sistemakh
kontrolya kachestva. Nadezhnost' i kontrol' kachestva" [Experiment Planning,in
puality Control Systems: Reliability and Quality ~ontrol], Moscow, Izdatel'stvo
"standartov", No 6, 1971, pp 31-39.
18. Gubkin, Yu.N., "On the Limits of Integration in Microelectronics," in
"Elektronnaya promyshlennost'/TsNII 'Elektronika Moscow, lOth edition, 1979,
pp 69-72.
19. Gus'kov, G.Ya., "Principles for the Designing of Microelectronic Equipment," in
"Elektronnaya promyshlennost'/TsNII 'Elektronika Moscow, 6th edition, 1976,
pp 31-36.
- 20. GOST 22487-77. Proyektirovaniye avtomatizirovannoye. Terminy i opredeleniya"
,[All-Union State Standard 22487-77. Automated Designing: Terms and Defini-
tions].
- 21. "GOST 23501.0-79 i dr. Systemy avtomatizirovannogo proyektirovaniya. Osnovnyye
polozheniya: Sbornik.--Soderzh. GOST 23501.0-79-23.50i.3-79" [All-Union State
Standard 23501.0-79 and others. Automated Design Systems. Basic Propositions:
Collection of Works Containing All-Union State Standards 23501.0-79 to
23501.3-79].
80
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FnR nF FI(�in~. ~ ~s~; ~Ni.v
22. Uani.lin, B.S., and Kireyev, V.Yu., "Methods for Obtaining IS Element Configura-
tions," in "Zarubezhnaya elektronnaya tekhnika/TsNII 'Elektronika [Foreign
Electronics Technology/"Elektronika" Central Scientifi~ Research Institute],
Moscow, 18th edition, 1973, p 54.
23. Yeremeyevskiy, V.I., et al., "Cotnputer-Assisted Control of the Production Pro-
cess for the Manufacturing of the Passive Part of Thick-Film Microcircuits,"
in "Elektronnaya promyshlennost'/TsNII 'Elektronika Moscow, lst edition,
1974, pp 38-41.
24. Yermolayev, Yu.P., Ponomarev, M.F., and Kryukov, Yu.G., "Konstruirovaniye i
_ tekhnologiya mikroskhem (GIS i BGIS)" [Design and Technology of Microcircuits
(Hybrid and Large-Scale Hybrid Integrated Circuits)], edited by Yu.P.
Yermolayev, Moscow, Izdate'stvo "Sovetskoye radio", 1980, 256 pp (WZ textbook).
~
25. Yefimov, I.Ye., Gorbunov, Yu.I., and Kozyr', I.Ya., "Mikroelektronika" [Micro-
- electronics], Moscow, Izdatel'stvo "Vysshaya shkola", 1977, 416 pp.
26. Zabrodskaya, V.P., Xotov, B.A., and Sernov, I.S., "Machine Designing of Photo-
templates for Television FEP's [possibly photoelectric pyrometer]," in
"Elektronnaya promyshlennost'/TsNII 'Elektronika Moscow, 3rd edition, 1974,
pp 56-59.
27. Zozulevich, D.M., "Mashinnaya grafika v avtomatizirovannom proyektirovanii."
[Machine Graphics in Automated Designing], Moscow, Izdatel'stvo
"Mashinopostroyeniye", 1976, 218 pp.
28. Ivanov, R.B., "Katodnyy metod sozdaniya plenochnykh elementov mikroskhem" [The
Cathode Method of Creating Pellicular Microcircuit Elements], Moscow,
- Izdatel'stvo "Sovetskoye radio", 1972, 109 pp.
= 29. Gal'perin, Ye.I., Golovanov, A.I., Nayderov, V.Z., et al., "Investigation of the
Statistical Characteristics of Linear Semiconducting IS's and Their Components,"
in "Mikroelektronika" [Microelectronics~, edited by F.V. Lukin, Moscow,
Izdatel'stvo "Sovetskoye radio", 4th edition, 1971, pp 270-281.
30. I1'in, V.N., and Frolkin, V.T., "Ucheb. posobiye po mashinnomu
skhemotekhnicheskomu proyektirovaniyu elektronnykh skhem dlya seminarskikh
zanyatiy po kursu 'Modelirovaniye inzhenernykh zadach na EVM [Textbook on Ma-
chine Circuit Engineering Designing of Electronic Circuits for Seminar Students
in the Course "Modeling Engineering Problems on Computers"j, MAI [Moscow Avia-
- tion Institute imeni Sergo Ordzhonikidze], 1977, SG pp.
31. Kazennov, G.G., et al., "Data Preparation Algorithms for A7i~rophotocomposition
Units," in "Elektronnaya promyshlennost'/TsNII 'EZektronika Moscow, 3rd edi-
tion, 1974, pp 56-59.
32. "Kontrol' proizvodstva mikroskhem. Obzornaya informatsiya/TsNIITEI
priborostroyeniya" [Monitoring the Production of Microcircuits: Review Informa-
tion From the Central Scientific Research Institute of Information and Technical
- and ~conomic Research on Instr.ument Making, Means of Automation and ~;ontrol Sys-
tems], Moscow, 1978, 64 pp.
81
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33. Kostychev, G.I., "Physical Method for ~valuating IS Reliability," IZV. WZOV
SSSR. RADIOTEKHNIKA, Vo1_ 17, No 5, 1974, pp 57-59.
34. Koledov, L.A., Volkov, V.A., I~'ina, E.M., et al., "Konstruirovaniye i
tekhnologiya izgotovleniya gibridnykh integral'nykh skhem" [Design and Produc-
tion Technology for Hybrid Integrated Circuits], edited by L.A. Koledov, Moscow,
MIET [expansion unknownJ, 1977, 114 pp.
35. Mikhaylov, A.V., and Savin, S.K., "Tochnost' radioelektronnykh ustroystv" [Accu-
racy of Radioelectronic Devices], Moscow, Izdatel'stvo "Mashinopostroyeniye",
1976, 214 pp.
36. Makarov, V.I., Ryabov, L.P., and Temnitskiy, Yu.N., "Iterative Method for rlaking
_ Layouts on Printed-Circuit Cards," in "Obmen opytom v radiopromyshlennosti/
NII~IR" [Exchanges of Experience in the Radio Industry/NIIEIR [expansion un-
known]], Moscow, 2nd edition, 1977, pp 4-8.
37. Fomin, A.V., Obichk.in, Yu.G., Molostov, Ye.A., et al., "Nadezhnost'
poluprovodnikovykh r~3dioustroystv letatel'nykh apparat" [Reliability of Semi-
- conducting Radio Equipment in Aircraft], edited by A.V. Fomin, Moscow,
Izdatel'stvo "Mashinopostroyeniye", 1968, 267 pp.
38. Nazarov, G.V., and Grevtsov, N.V., "Svarka i payka ~v mikroelektronike" [Welding
and Soldering in Microelectronics], Moscow, Izdatel'stvo "Sovetskoye radio",
1969, 212 pp.
39. Nikolayev, I.M., and Filinyuk, N.A., "Mikroelektronnyye ustroystva i osnovy ikh
proyektirovaniya" [Microelectronic Devices and Principles of Their Design],
Moscow, Izdatel'stvo "Energiya", 1979, 336 pp.
40. Ortenberg, V.D., "Konstruirovaniye elektronnoy apparatury na mikrouzlakh s
germetichny[ni obolochkami" [Designing Electronic Equipment Based on Micro-
_ assemblies With Sealed Housings], Moscow, Izdatel'stvo "Mashinopostroyeniye",
l~"/1, 77 pp.
41. Palatnik, L.S., Fuks, M.Ya., ar.d Kosevich, V.M., "Mekhanizm obrazovaniya i
_ struktura kondensirovannykh plenok" [Formation Mechanism and Structure of Films
Formed by Condensation], Moscow, Izdatel'stvo "Nauka", 1972, 318 pp.
42. Pr~snukhin, L.N., Shakhnov, V.A., and Kustov, V.A., "Osnovy konstruirovaniya
mikroelektronnykh vychislitel'nykh mashin" [Principles of Designing Micro-
electronic Computers], Moscow, Izdatel'stvo "Vysshaya shkola", 1978, 408 pp.
43. Presnukllin, L.N., and Yelshin, Yu.M., "Automated Work Site for an REA Develop-
cr~" in "Obmen opytom v radiopromyshlennosti/NIIEIR", Moscow, 12th edition,
= 1977, p~ ~_0-17.
44. Prolcyko, V.M., and Sretenskiy, V.N., "Some Problems in the Reliability of Elec-
, tronic Technology Articles," in "Elektronnaya promyshlennost'/TsNII
'Elektronika Moscow, 6th edition, 1977, pp 27-31.
82
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45. Prins, M.D., "Mashinnaya grafika v avtomatizirovannom proyektirovanii" (Machine
Graphics in Automated Design], Moscow, Izdatel'stvo "Sovetskoye radio", 1975,
232 pp.
46. Selyutin, V.A., "Mashinnoye konstruirovaniye elektronnykh ustroystv" [Machine
Design of Electronic Devices], Moscow, Izdatel'stvo "Sovetskoye radio", 1977,
384 pp.
47. Sorokopud, V.A., and Yengalychev, A.N., "Metodicheskiye ukazaniya po kursu
'Avtomatizatsiya konstruirovaniya i proizvodstva s ispol'zovaniyem EVM [Meth-
odological I,zstructions for the Course "Automation of Design and Production With
the Help of Computers], MAI, 1979, 40 pp.
48. Talalay, A.M., Proshunin, V.V., and Babicheva, T.P., "Using the Random Balance
Method to Investigate the Production Process for Hybrid Integrated Circuit Re-
sistors," ELEKTRONNAYA TEKHNIKA. SER. 6. MIKROELEKTRONIKA, No 3, 1971, pp 56-62.
49. Tarabrin, B.V., Nazarov, A.S., Keydzhyan, K.A., et al., "Methods for Determir_ing
the Optimum Nomenclature for the Output Electrical Parameters of IS's," in
"Mikroelektronika i poluprovodnikovyye pribory", edited by A.A. Vasenkov ar.d
Ya.A. Fedotov, Moscow, Izdatel'stvo "Sovetskoye radio", lst edition, 1976, pp
15:: -179.
S0. Yelinson, M.N., and Smolko, G.G., editors, "Tekhnologiya tonkikh plenok.
Spravochnik v 2-kh t." [Thin-Film Technology: Handbook in 2 Volumes], Moscow,
Izdatel'stvo "Sovetskoye radio", Vol 1--662 pp, Vol 2--766 pp (translated from
~nglish).
51. Synorov, V.F., Pivovarova, R.P., Petrov, B.K., et al., "Fizicheskiye osnovy
nadezhnosti I5" [Physical Principles of IS Reliability], edited by Yu.G. Miller,
Moscow, Izdatel'stvo "Sovetskoye Radio", 1976, 320 pp.
52. Fomin, V.M., "Prospects for the Utilization of Microfilming in Automated Control
Systems," in "Elektronnaya promyshlennost'/TsNII 'Elektronika Moscow, 6th
edition, 1972, pp 113-118.
53. Fomin, A.V., and Beletskiy, V.V., "Nadezhnost' radioelektronnoy aFparatury.
-._Osnovy teorii i rascheta' [Reliability of Radioelectronic Equipment: Principles
~ `of '~H~s~t_and Calculatior_s] , MAI, 1971, 164 pp.
54. Fomin, A.V., U r khin, . and Sorokopud, V.A., "Metodicheskiye ukazaniya k
kursovoy rabote po kursu 'Teor~~skiye osnovy konstruirovaniya, tekhnologii i
nadezhnosti mikroeletronnoy apparatury'~"'-f-Methodological Instructions for the
Course Work in the Course "Theoretical Principle~~~o�_.the Design, Technology and
Reliability of Microelectronic Equipment], MAI, 1976, 57 pp._,,,
55. P'omin, A.V., and Umrikhin, O.N., "Sbornik zadach po kursu 'Teoreticheskiye
- osnovy konstruirovaniye, tekhnologii i nadezhnosti mikroelektronnoy apparatury
[Collection of Problems for the Course "Theoretical Principles of the Design,
Technology and Reliability of Microelectronic Equipment"], MAI, 1978, 55 pp.
~6. Fedotov, P.A., and Pol', G.I., editors, "Fotolitografiya i optika" (Photo-
lithography and Optics~, Moscow, Izdatel'stvo "Sovetskoye radio", 1972, 374 pp.
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~7. Frolkin, V.T., and Popov, L.N., "Impul'snyye ustroystva" (Pulse Equipment],
Moscow, Izdatel'stvo "Sovetskoye radio', 1980, 320 pp.
58. (Khamer), F., and (Bigger), Dzh., "Tekhnologiya tolstoplenochnykh gibridnykh
integral'nykh skhem" [Technology of Thick-Film Hyi:rid Integrated Circuits], ed-
ited by T.D. Shermergor, Moscaw, Izdatel'stvo "Mir", 1975, 495 pp (translated
from English).
59. Chernyakovskiy, V.S., and Shereshevskiy, A.S., "Classification of Methods of
Statistical Control of Technological Processes," in "Elektronnaya
promyshlennost/TsNI2 'Elektronika Moscow, lst edition, 1974, pp 4-8.
60. ~~hetverikov, N.I., "Nadezhnost' v mikroelektroniki" [Reliability in Micro-
electronics], Moscow, Izdatel'stvo "Znaniye", 1975, 64 pp.
61. "Flekfironnaya promyshlennost [The Electronics Industry]. 5th edition, 1978.
62. A1'tman, L., "Hybrid Integrated Circuit Technology," ELEKTRONIKA, Vol 46, No 12,
1973, pp 27-44.
63. Gnatek, Ye.R., "Investigations of the Electrical Characteristics of Integrated
Circuits at Enterprises Using Them," ELEKTRONIKA, Vol 48, No 24, 1975, pp 43-51.
64. Al'tman, L., "Five Directions for the Further Improvement of Large-Scale Hybrid
Integrated Circuits," ELEKTRONIKA, Vol 50, No 17, 1977, pp 23-27.
65. Laymen, Dzh., "Beginnings of the Introduction of X-Ray Lithography,"
ELEKTRONIKA, Vol 51, No 15, 1978, pp 70-73.
66. Uoller, L., "Difference Between the Actual Parameters of Large-Scale Integrated
Circuits and Their Certification Data," ELEKTRONIKA, Vol 51, No 3, 1978, pp
75-76.
67. Kh'yuz, Fink, "X-Ray Lithography: a Method for Manufacturing Cheap SBIS's [ex-
pansion unknown] With Submicron Dimensions," ELEKTRONIKA, Vol 51, No 23, 1978,
pp 26-37.
TABLE OF CONTENTS
Page
Foreword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chapter 1. Present State and Prospects for the Development of Integrated-
Circuit Technoloc~y . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.1. General Information on Integrated Circuits . . . . . . . . . . . . . . . . . 12
1.2. Spe~~ial Design Features of Thin-Film BGIS's and Microassemblies 21
1.3. Special Features of the Design and Technology of Thick-Film BGIS's. 27
1.4. rvolution of the Development and Prospects for the Utilization of Hybrid
]:S' s in MEA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
84
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Chapter 2. Technology of Thin Film Production by Spraying. 38
2.1. Substrates and the Reliability of BGIS Elements . . . . . . . . . . . . . . 39
2.2. Physical Principles of the Thermovacuum Evaporation of Materials and the
� Condensation of Thin Films . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.3. Technology of Producing Conducting, Resistive and Dielectric Films by
Spraying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
2.4. Producing Thin Films by the Ion Atomization of Materials. 77
Chapter 3. Methods for Producing Thin-Film Elements of Microcircuits 89
3.1. Photolittiography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
3.2. Mask Methods for Producing Microcircuit Patterns . . . . . . . . . . . . . . 112
3.3. Methods for Improving the Accuracy of the Parameters of Thin-Film Elements
of BGIS's . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
3.4. Comparison of Different Methods for Forming Microcircuit Patterns 126
Chapter 4. Assembly and Installation Processes in BGIS Technology. 128
4.1. Installation of Inserted BGIS Components . . . . . . . . . . . . . . . . . . 129
4.2. Reliability of Contact Connections . . . . . . . . . . . . . . . . . . . . . 138
4.3. Sealing t9icrocircuits e . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Chapter 5. Insuring the Operational Quality and Technological Reproducibility of
BGIS's . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
5.1. Evaluational Criteria and Calculation of the Technological Reproducibility
of BGIS's . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
5 . 2 . Adj ustment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
5.3. Analyzing IS Quality While Determining Their Use in BGIS's. 165
Chapter 6. Analyzing the Physics and Mechanisms of IS Failures 169
6.1. Analysis of the Causes of IS Unreliability; Types of Failures and Defects . 170
6.2. Physical Limits on the Microminiaturization of Bipolar and MOP [probably
Metal Oxide Semiconductor] IS's . . . . . . . . . . . . . . . . . . . . . . 181
Chapter 7. Methods for Evaluating and Insuring the Reliability of IS's.. 188
7.1. The Statistical Method of Evaluation . . . . . . . . . . . . . . . . . . . . 188
7.2. The Causal (Physical) Method of Evaluation . . . . . . . . . . . . . . . . . 194
7.3. Technological Redundancy . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Chapter 8. Calculating the Reliability of BGIS's and Microassemblies From Data
on Gradual Failures . . . . . . . . . . . . . . . . . . . . . . . . . 211
8.1. Effect of Gradual Changes in the Parameters of BGIS Elements and Components
on Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
8.2. Methods for Calculating BGIS Reliability on the Basis of Data on Gradual
~ Fai lures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . e . . . . 214
Chapter 9. Automating the Designing of BGIS's and Microassemblies. 230
9.1. Systems for the Automated Designing of BGIS's and PrinGiples of Their Con-
struction . . . . . . . ~ . . . . . . . . . . . . . . . . . . . . . . . . . 234
9.2. Special Features of the Automation of the Designing of BGIS's 240
9.3. Equipment for Auromating the Designing and Technological Preparation for
Production of BGIS's and Microassemblies . . . . . . . . . . . . . . . . . . 245
9.4. Methods and Algorithms for Automated Designing of BGIS's and Micro-
assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263
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Chapter 10. Automating the Technological Preparation for Production of BGIS's
and Microassemblies . . . . . . . . . . . . . . . . . . . . . . . . . 274
10.1. Problems Related to Automating the Technological Preparati.on for Produc-
tion of BGIS's Within the Framework of the Unified System of Technological
Production Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . 274
10.2. Mathematic
where I~(w) = H(w) - R~(w) is a random (unknown) component of the spatial filter.
It is demonstrated in [10] that under certain conditions the reconstruction error
for (30) has the form
2~ ([N.~G~'WIGN(c~~]G(G,) w
~ . n,,aG(WIG.(w1*IN.~W,i ~rw~ d~~~'
(31)
where
G~~ (w) ~E (I11lwl l~ ~
- is the energy spectrum of the error of the spatial filter.
Let us note that model (30) can be used for describing the quantizing and sampling
processes when entering a hologram or holographic image into a computer.
In the examples below we specify the observation model described above ~'or certain
arrangements o~ a holographic experiment.
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Example 3.1. Use o~ '~raunho~er Hol.ograi4s for 2'~easuri,ng yel,ocit~;ea o~ Micxoparticles
In [11] a methqd i~ described ~or ~easur~ng the ~nean velocity v~ partic7,es ~rom an
interference paCt~rn in a~r$unho~er plane produced during doub7,e exposure. The
Fraunhofer di.~~xac~ion pattern recc~n~txueted ~rom the hologram has a periodic strue-
ture which ~or at un~;dimensional Ga,usstan distxibutfion oi` velocities has the form:
S(x,a)= B(J[)~1+coS~Ax)exp xz}~, ~32)
where a is the measured quantity proportional to the mean velocity of microparti-
cles, 62 is the variance in velocities of microparticles, B(x) is a structure
function determined b}r the form and orientation of microparticles (for analysis we
assume that B(x) = B), It is easy to see that (3~i) corresponds to model (21):
~
~ VQ I aTa B~~~c'sin~ax)erp(~~,.~,~~~�~~ �
~ (33)
Tn (33) we assume that the region of analysis is unlimited (x and that a/cr �
� 1. Using (22) and (27) we get
_ z 4N,6~
r~a ~ e*-~a �
(34)
Let us note that the use of appropriate methods of signal processing [7] makes it
possible also to estimate parameter ,0'2 .
Example 3.2. Estimate of Diameter and Coordinates of Center of Particle
The intensity of the holographic image of a round particle can be described approxi-
mately by means of a Gauss spot:
I s z
q ~x,~.,a,.uo,yo)=A exP _ x-x�) - o) ,
2a z ' ~35~
where a is thQ diameter of the particle and (x y~) represents the coordinates
of the center of the particle. Using (22), we ge~
~~,ty.~ Ti
~ ~
~a ~Y 2
A
x . �
(36)
Let us note that the 7.imits o~ ~the accur~cy~ of detex~mining the coordinates of the
center of the particle do not depenii on its dianteter.
. 147
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1?xampl.e 3.3. Multipllicati.ve Noise
' For the sake o~ simp~.ici~y~ ~,et us consfider a unidi,mensional model o~ observati:on of
a particle:
:
~ ~~c)= ~(peKp a ) ~(z) + n (xl~
(37)
where ~(x) is a random ~unctfi~on describing the multiplicattve noise of the holo-
graphic process (e.g., the ~iffuse noise). Equation (37) agrees with model (21)
with a random signal o~ s(x,a) rafith corxelation function (24) of the form
_ . xt+ , ~x_~~2
Ks (:fi, y, a.) s f
d~ eXP ar '
(38)
With a/b 1 from (22) and (38) we get
~ ~ 3
P
~a ~
(39)
Let us notie that the limit of the relative mean square error is inversely proportion-
al to the correlation distance of multiplicative noise.
- Example 3.4. Accuracy of Reconstruction of Image
Let us determine the mean square error in observation of an image against a back-
ground of additive noise--model (26). We will discuss the three most widespread
classes of images corresponding to the following correlation functions: 1) biex-
ponential, 2) exponential isotropic and 3) ~auss3an isotropic.
Using (16) and (18) we get
, '/z
~~_~~~i ~~~-~ZK~~,i ;;l . c40>
Z 6n Q?~ ~~'n ~ 1 ~ LIYC L' ~~r ~
e~ ~ (4i>
. t-A+/1 AJ~3 nr~
e,=j~ ~(i~ 2 c42>
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Here /1 is the signal,~tq~npi~e xakiq and IC.( 1s a, capsp7,ete e7,~iptic integral
o~ the ~ixst kind. Re~.ation~~hiRs (40) i(~47,) and (42). a,re px~s,ex~ted in ~ig 5,
e' ~ ~
1
~
I
10~ , Q
b'~ ,~1
~ ~p'h 10 10 101
Figure 5. Limit of Mean Square Error in Reconstruction of Image with Correla-
tion ~unctions: 1--Biexponential, 2--Exponential Isotropic, 3--
Gaussian Isotropic
- In conclusion we get the limit of the accuracy of reconstruction of holographic
images with a Gaussian isotropic correlation function with a correlation distance
of 1/a taking into account the limited angular dimension, 2S2 , of a Fraunhofer
hologram. From (29) we get
_ : P' : 2~ ,
6= eX I+ n. eKP~_n=) (43>
where T[ = S2/2a is the reduced dimension of the hologram. Error (43) is illustra-
ted in fig 6.
4. Conclusion
Further studies of the limiting characteristics of the accuracy of solving primal
and inverse problems and the limits of the.possible and impossible in digital holo-
graphy are most urgent along the ~ollowing lines:
1. Expansion of the range o~ applied problems studied--visualization, adaptive
spatial filtering, optical systems for detecting and recognizing ob~ects.
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= i e~
: n~;~
. f0.~ n~~~
~ ~ � .
. ,
r
~Q"~ : ~ . .
: ~ ~ a ~ ~q.i ~ a~ ~ .
Figure 6. Limit of Mean Square Error in Reconstructton of Images with Limited
Dimensions of Hologram
2. Conduction of series of experiments confirming (or disproving) theoretical esti-
mates of the limits of the possible and impossible in ~igital holography.
3. Study of a broader set of equipment for digital holography--graph plotters,
; photolithographic units, computer-controlled space modulators, units with a con-
trolled laser beam, etc.
4. Analysis of a broader class of holograms and interferograms.
5. Study of the implementation aspects of digital holography ass~ciated with input
of machine time for solving primal and inverse problems.
The authors t-~ope that the work done by them wi11 attract the attention of investiga-
tors toward solving theoretical and experimental problems in digital holography
already formulated an~ toward formulat~ng new ones.
Bibliogra.phy
1. Khuang, T. "Digital Holography" in the collection "Primeneni}ra golografii"
[Holography Applications], Mo~cow, MiX, 197~, p 65. .
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2. Soyfer, v.t~. "~~i~xc~vaya p,p~.ogra~iy~~ Aos~ti.zhe.n3,y~a. i, probleury~ :"~at~xialy
IX Vsesoyuzna~� ~~koly po gologxafii fi kogexentnoy~ optik~~' jAigi,~a7, Ho],pgraph~�:
Achievements and Problems. Matertals o~ the Ninth ~~~-Union ~xaining Program
, in Hologra~hy and Coherent Optics~, Leni,ngrad, LTY'aF; 1977, p 199.
- 3. Yaroslavskiy, L.~. and Merzlyaltov, N.S. "Metod}r tsifxpvoy gologra~ii"
_ [Methods o~ Digital Hvlography], T4oscow, Nauka, 1977.
4. Brown, B.R. and Lohmann, A.W. APPT.. OP~., 5, 6, 967, 1966.
5. Go1ub, M.A., Karpeyev, S.V., Nezhe~renko, Ye.S., Soy~er, V.A. and Khotskin, V.I.
"Study of Spatial ~ilters Sy~nthesized on a Computer" in the collection
"Voprosy kibernetiki" [Problems 3.n Cybernetics], No 62, 1979, p 56.
6. Soyfer, V.A. AVTOMETRIYA, No 3, 1978, p 16.
7. Van Tris, G. "Teoriya obnaruzheniya, otsenuk i modulyatsii" [Theory of Detec-
tion, Estimates and Modulation], Vol 1, Moscow, Sovetskoye Radio, 1972.
8. Van Tris, G. "Teoriya� obnaruzheniya, otsenok i modulyatsii", Vol 3, Moscow,
Sovetskoye Radio, 1977.
9. Helstrom, C.H. J. OPT. SOC. AMER., 57, 3, 297, 1976.
10. Klovskiy, D.D. and Soyfer, V.A. "Obrabotka grostranstvenno-vremennykh
si~nalov" [Processing of Space-Time Signals], Moscow, Svyaz', 1976.
11. Ewan, B.C.R. APPL. OPT., 18, 5, 623, 1979.
COPYRIGHT: LIYaF, 1980
8831
CSO: 1863/127
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FOR OFFICIAI. USF ONI,Y
DATA CONVERSION
UDC 681.335+681.325
DATA CONVERTERS AND DATA TRANSMISSION EQUIPMENT
Kiev PREOBRAZOVATELI FORMY INFORMATSII I SREDSTVA PEREDACHI DANNYKH in Russian
1981 (signed to press 21 Apr 81) pp 2, 82
[Annotation and table of contents of book "Data Convertors and Data Transmission
_ Equipment" edited by Doctor of Technical Sciences A. I. Kondalev, Ordena
Lenina Institut kibernetiki, 600 copies, 89 pages]
[Text) 'Annotation
The art~cles in this collection reviera the questions of designing microelectronic
data convertors and their components. The book presents an analysis of the .
error o'~ data conversion equipment used in monitoring devices and measuring de-
vices for displacements and dimensions, and investigates the dynamic character-
istics of elements of analog-digital and digital-analog convertors. The hard-
ware of data exchange systems is considered. Requirements are defined for the
characteristics of receivers, concentrators, and other untts of data transmis-
sion systems.
The editorial board for this publication was composed of doctor of technical
sciences A. I. Kondalev (responsible editor), doctor of tecfinical sciences V. M.
Yegipko, candidate of technical sciences S. G. Bunin, and candidate of technical
sciences V. A. Romanov (responsible for this publication). The reviewer was
- doctor of technical sciences A. M. Luchuk.
Table of Contents Page
A.-I. K. Martsinkyavichus.and V. B. Abraytis, "High-Speed Micro-
electronic Data Convertors Based on &ipolar Technology" . . . . . . . . 3
T. M. Goncharuk, L. V. Teslenko, and V. A. Romanov, "Digital
Error Correction in Microelectronic Analog-Digital Convertors" 8
P. S. Klochan, "Determining the Requirements for the Precision of
Hardware To Automate Measurements of ttie Parameters of
Components of Data Convertors" . . . . . . . . . . . . . . . . . . . . 14
~ N. V. Bessarabov, "Errors in Dimension and Displacement Measuring ~
Devices Based on Read-Unly Memory Organized by Line" 20
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- Page
V. N. Lavrent'yev, "Evaluating the Productivity of Data Convertor~" 27
V. A. Bagatskiy, N. N. Mironets, V. K. Leshchev, and A. A. Fremke,
"Dynamic Characteristics of a Single-Bit Digital-Analog Convertor
with a Transistor Key" . . . . . . . . . . . . . . . . . . . . . . . 32
V. A. Fabrichev, and Sh. A. Mekhtiyev, "Study of the Dynamic Charac- .
teristics of Circuits To Coordinate Levels" . . . . . . . . . . . . 39
S. N. Zharovskiy, "Principles of Organizing Data Transmission in Com-
plexes To Automate Scientific ExperimPnts on the Basis of the
ODA-20M Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
P. A. Abysov, S. N. Zharovskiy, and A. Z. Divinskiy, "Hardware of the
ODA-20M Data Exchange System" . . . . . . . . . . . . . . . . . . . 51
- D. I. Zelinskiy, "Noise Suppresston of the Frequency-Pfiase Method
of Reception with Predistortion of Signals" . . . . . . . . . . . . 54
A. Yu. Spirin, and M. V. Builakov, "One Method of Determining the
Capacity of a Capacitor ~ith a Characteristic Distribution
of Message Lengths" . . . . . � . . . . . . . . � . . . . . . . . 59
V. D. Zayko, "A Single Relative Phase Manipulation Signal Receiver
~ for Data Collection Subsystems" . . . . . . . . . . . . . . . . . . 63
M. V. Burlakov, and A. Yu. Spirin, "The Possibility of Step-by-Step
Situation Control in Information-Computing Systems" . . . . . . . . 70
V. A. Protsenko, L. A. Korytanya, and V. V. Nelup, "One Way of
Forming a Given Value for the Amplitude of Alternating
Current Using Digital-Analog Convertors" . . . . . . . . . . . . . . 77
COPYRIGHT: Institut kibernetiki, 1981.
11,176
~CSO: 1863/121
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UDC 681.355 ~
HIG~I-SPEED MICROELECTRONIC DATA CONVERTERS $ASED ON SIPOLAR TECHNOLOGY
Kiev PREOBRAZOVATELI FORMY INFORMATSII I SREDSTVA PEREDACHI DANNYKH in Russian
1981 (signed to press 21 Apr 81) pp 3-8
[Artiele by A.-I. K. Martsinkyavichus and V. B. A~.raytis from book "Data Con-
vertors and Data Transmission Equipment" edited by Doctor of Technical Sciences
A. I. Kondalev, Ordena Lenina Institut kibernetiki, 600 copies, 89 pages]
[Text] The integrated circuits of high-speed digital-analog and analog-digital
convertors are applied in digital television, digttal videorecording, digital
processing of radar signals, digital communications systems, and in measuring
- and telemetric devices.
At the present time work on digi.tal-analog and a.nalog-digital convertors is pro-
- gressing in the following areas:
1. Broadening the functional capafitlitte~ of tlie information systems of digital-
analog convertors (DAC's) and analog-digital convertors (ADC's) by increasing
their circuit and design complexity and including in tliem sources of reference
quantities, operations amplifiers, digital tnterlinking circuits, and the ltke.
In this case the number of components on a cfiip increases from 150-200 to 5,000-
20,000 and more.
2. Increasing the precision and resolution of converston to 14-16 bits for
DAC's and 8-10 bits for ADC's with a stmultaneous decrease in power consumed per
bit.
3. Increasing the speed from hundreds of k~lohertz to hundreds of inegafiertz.
4. Improving temperature stability to 10-6 1/degree in the temperature range
from -60 to +125 degrees C.
The distinguishing features of the development of integrated DAC and ADC cir-
cuits in comparison with digital circuits are the following:
1. The large assortment of types. of components, including n-p-n and p-n-p
transfers and lateral transistors, diodes, stabilitrons, and solid state and film
resistors; this makes the fabrication of integrated circuits in a single indus-
- trial cycle more complex.
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2. The irregular etructure of the achemat~c electrical diagram, which makes it
more difficult to formalize the structure of faFrication topologp and to monitor
the microcircuits.
3. Heightened requi.rements for tTis parameters~and ~pread of parameters of the
compon.ents and for the temperature and time staTiility of the input and output
characteristics of the integrated circuits (for example, tfie relattve error of
resistors for the 12-b it 594PA1 DAC should be no more tfian 0.01 percent and the
temperature stability of the output current should be 3�10'6 1/degree.)
4. T~o-three times as many monitored parameter~ in the production cycle, final
monitoring, and testing, and also higfi requirements for the precision of the
monitoring and testing apparatus.
5. Special conditions for measurement and testing of electrical characteristics
(such as the shielding of the space, the presence of a separate grounding line
and special power supply sources, and so on).
In the fabrication of high-speed, highly complex DAC and ADC integrated circuits
three-diffusion bipolar technology is widely used. In this case only five photo-
lithographs are required to fabricate microcircutts on P-type silicon substrates
without an epitaxial layer. Microcircuits made ustng this technology can oper-
ate at frequencies of 30-500 megafiertz. This teciuiology makes it possifile to
obtain a high percentage of usable highly tntegrated bipolar circuits that con-
tain 20,000-40,000 components per chip. The active components fabricated by
bipolar technology have a boundary frequency of about five gigahertz. There-
fore, to support a speed of more than 100 megafiertz for the DAC and ADC cir-
cuits it is necessary to use a more advanced technological base, for example
- gallium araenide.
Table 1 below gives the parameters of certain types of domestically produced
microelectronic circuits of assemblies for DACts and ADC~s and also of DAC and
ADC integrated circuits. Table 2 below shows the parameters of advanced types
of DAC and ADC integrated circuits.
Table 1. Parameters of Certain ~pes of Aigh-Speed Bipolar
DAC and ADC Integrated Circuits.
Series
No. Name of Parameter 597SA1 597SA2 597SA3
1. Propagation delay time, ns 6.5 12 300
2. Bias voltage, mv -2 - +2 -2 - +2 -5 - +5
3. Range of synphasal input -3.3 - +3.3 -2.7 - + 2.7 -12 - +12
voltages, v
4. Output levels ESL [expansion TTL TTL, CMOS
unknown]
~ 5. Power consumption, mwt 300 400 600
[Table continued next page]
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[Table 1 continued]
II. Digital-~?nalog Convertors
Series
No. Name of Parameter 594KT1 594PA1
1. Bit of configuration (resolution) For construction of 12
4-, 8-, and 10-bit
DAC's
2. (Standard) set-up time, ns 2UQ.0 3,500
3. Nonlinearity, X �0.~5 0.012
4. Input levels TTL TTL, CMOS
5. Power consumption, mwt 300 650
6. Output signal of full scale, ma 1; 0.5; 0.25; 0.0125 2.0(�1.0)
III. Analog-Digital Convertor
No. Name of Parameter Series
1. Resolution (bit con- 6
figuration)
2. Range of input voltages, v 0...--2.0
3. Nonlinearity, YeMR[expansion unknown] 0.8
4. Quantization frequency, Mhz 30.0
S. Signal conversion time, ns 7.0
6. Output levels TTL
7. Power consumption, mvt 900.0
Table 2. Parameters. of Advanced Types of DACts and ADC's
Type of Power
Micro- ~ Word Con- Pre-
circuit Name Length Speed sumption cison
Code-current DAC controlled from ESL 8 10 ns 500 mwt 0.2X
DAC
Code-current DAC with input control 10 30 ns S00 mwt �O.OSq
register from ESL and TTL
Voltage-code ADC with output register 8 30 mhz 2,500 mwt 1/2Ye.I~IIt
on TTL (input signal 0...-28)
ADC
Voltage-code ADC with output on ESL 6 1QQ mhz 500 mwt 1/2Ye.IrIIt
(tnput signal-2.5...+2.Sv)
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The principal problems that arise during the fabrication of integrated DAC and
ADC circuits are the folloraing:
1. Fabrication of defect-free precision photo temp7ates for obtaining convertor
structures on a 7 x 7 millimeter chip witb.around 20,000 components. Tfie size
bf the minimum element on the photo template here is 1.5 microns witfi a toler~
~ ance of �0.1 microns, and tfie number of defective modules does not exceed five
percent. It is essential to incorporate the la~est optical-mechanical ec~uip-
ment to fahricate such templates.
2. Monitoring technical parameters in the process of fabricating convertor
structures on a card during the operations of alloying and pfiotolithograpfiy for
the purpose of insuring the assigned electrical parameters in the components.
3. Measurement of the parameters of higfi-speed DAC's and ADC's on a plate and
during final monitoring. The difficulties of ineasuring parametexs arise from
the requirements for high precision and great speed, as well as the very high
values of the parameters. For example, measuring set--up time for the output
current of a DAC at 50 milliamps with a precision of 0.05 percent and a speed of
10-20 nanoseconds requires highly precise coordinatton of the parameters of the
- devices in the measurement channel, oscillographs witfi sensitivity of 0.5-1.0
millivolts per centimeter and a range up to 500 megafiertz, and appropriate oper-
ating amplifiers, comparators, and limiters.
Aperture time of parallel ADC's in the 10-30 nanosecond range and aperture
tremor up to 10 nanoseconds should be measured witfi a prectsion of �10 percent,
which makes the absolute error of ineasurement fractians of a nanosecond or pico-
second.
The measurement of differential phase, the differenttal amplification factor,
and parameters that describe the signal-noise ratio Cnoise, power output, and
ratio of the mean quadratic value of the signal to the mean quadratic value of
noise) is very complex.
At the present time, therefore, ~e must step up tF?e development of monitoring
and measurement equipment for monitoring the parameters of higfirspeed DAC's and
ADC's. This equipment should be aFile to work under shop conditions. We must
also develop standard measurement methodologies.
COPYRIGHT: Institut kibernetiki, 1981.
11,176
CSO: 1863/121
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_ UDC 681.305
DIGITAL ERROR CORRECTION IN MICROELECTRONIC ANALOG-DIGITAL CONVERTORS
Kiev PREOBRAZOVATELI FORMY INFORMATSII I SREDSTVA PEREDACHI DANNYKH in Russian
1981 (signed to press 21 Apr 81) pp 8-13
[Article by T. I. Goncharuk, L. V. Teslenko and V. A. Romanov from book "Data
Transmission Equipment" edited by Doctor of Teciinical Sciences A. I. Kondalev,
Ordena Lenina Institut kibernetiki, 600 copies, 89 pages]
[F::cerpts] One way to improve the preci.sion and metrological reliability of
- microelectronic analog-digital convertors [ADC~s] is automatic correction of the
transfer characteristic of the convertor. Until recently realization of the
known methods of correction was accomplished in the ADC by hardware means, that
is, special devices that p erform all the necessary operattons to Gorrect ADC
errors were included in the structure of the convertor. Tfie development of micro-
electronic engineering and the appearance of reliaBle, inexpensive microprocessors
and microcomputers now makes it possible to solve tfie proTilem of error correction
in ADC's by program means.
The present article uses concrete examples to consider correction by micro-
processor of errors in the bias, conductance, and nonlineartty of microelectronic
ADC's designed to process instantaneous signal values. Without stopping to ana-
lyze already known methods of correction (the auxiliary measurements method,
the inverse conversion method, and the sample s~gnal method) [1--6], we will only
point out that in our case we have selected the sample signal method as the cor-
rection method [3] because it ts simpler and more efficient than tfie auxiliary
measurements method and, unlike the iterative metfiod of inverse conversions [6],
it does not require an increase in conversion time (which is undesirable in an
ADC for processing instantaneous signal values). Tfie essential feature of the
sample signal method is that a source of sample signals is switched onto the in-
put of the ADC through a multichannel commutator in tfie intervals between con-
versions of the signals under study. The microprocessor at the output of the
ADC, relying on the results of coding of sample signals, determines the devia-
tion of the transfer characteristics of the convertor from the required figure ~
and puts the correction in the digital code of tFie signal under study.
To preclude bias error it is sufficient to perform a computation by the formula
NK = Nx ~ No~ ~1~
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where NX and NK are the code of the number before and after carrection re-
spectively, and No is the code of the sample signal, equal in the given case to
zero.
The digital correction of conductance is done Bp computations according to formula
~1~ -
N~ . I~ _ � A
~ (I-. ~)N� (2)
~
where ~N~s~, = N osp - Nodf ~ No3p and N'~p are the ideal and real values of the
code of the sample signal respectively.
To insure a precision of 0.1 percent it i.s sufficient to take two members of
series (2) [8]
NK N + ltl~yR =K.,yA . (3)
~rv ~ /J
adp
Computation of the coefficient K is done ~?y the microprocessor (series K580 inte-
grated circuits) for 500 microseconds at a cycle frequency of two megahertz and
with an eight-bit output ADC code (the code NK is determined in 300 microseconds).
Thus, the total time to correct an ADC conductance error, including time to con-
vert the sample signal, exceeds 800 mtcroseconds. Txe shauld observe that con-
versiQn of the sample signal and computation of tfie coefficient K for correcting
the ~onductance error of a microelectrontc ADC should not be done more often than
calibration of contemporary digital voltmeters. For thts reason, tfie correction
time for this error can be evaluated only by tfie time of performance of the oper-
ation of multiplying the coefficient K by the code NX, which is 300 microseconds.
Conclusions. Digital correction of error makes it possible to improve the pre-
cision and metrological reliability of microelectronic ADC's, and to avoid the
need to calibrate them, which is made difficult by tfie limited number or com-
plete lack of built-in elements in such ADC's. The usefulness of digital correc-
= tion is especially apparent in analog processors of the Intel 2920 type [9],
which instead of ADC's and DAC's contain a microprocessor set and are built in
the form of one microcircuit.
2. Because of the low spped of contemporary microprocessors, digital correction
in highly productive ADC's is still not efficient. The use of digital correc-
tion in such ADC's is advisable when the cycle frequency of the microprocessor
is 100 megahertz and higher.
- 3. Debugging tfie correction programs and calculating their execution time for
the series K580 microprocessor set waa done by means of a cross-system (developed
at the Kiev Polytechnic Institute) which makes it possi5le to model the work
of microcomputers on the basis of YeS [Unified System] computers.
COPYRIGHT: Institut kibernetiki, 1981.
11,176
CSO: 1863/121
159
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UDC 681.306/14
USE OF ODA-20M UNIT FOR AUTOMATIC DATA TRANSMISSION
Kiev PRSOBRAZOVATELI FORMY INFORMATSII I SREDSTVA PEREDACHI DANNYKH in Russian
1981 (signed to press 21 Apr 81) pp 45-51
[Article by S. N. Zharovskiy from book "Data Convertors and Data Transmission
Equipment" edited by Doctor of Technical gciences A. I. Kondalev, Ordena Lenina
Institut kibernetiki, 600 copie$, 89 pages]
(Text] The ODA-20M system was developed for data transmission on multistation
communications channels (MCC's). Radio or wire cfiannels may be used as MCC's
when subscribers are connected to a multistation system. It is common knowledge
that MCC's are most economical for data transmission, even though their use in-
volves a number of difficulties in organizing priortty control. The use of
programmable supervisors based on microprocessors makes this problem much
easier.
Work on MCC's is based on the fact that all station data transmisston devices
are connected to the common channel in the same way, can carry out various pro-
cedures to process data and prepare it for transmission independently, and are
always in a duty reception mode. This is accomplisfied by the fact that tfie re-
ceiving block of the modem in its initial state is connected to the communications
channel and tts priority for exchanging data on the internal pipeline is set as
highest. As soon as any station begins transmitting data, all other stations .
establish synchronization with the transmitti:ng station and check tfie affiliation
of the data. The addressee station receives the data, checks it, and sends a
response-receipt; the other stations continue execution of interrupted 3obs un-
- til the next transmission. ~
The switching of a station in the data transmission regime is done when the
channel is not occupied (channel state analyzer CSA) under the control of the
priority system, whose jobs include eliminating conflict situations (the compe-
tition regime) and insuring assigned service parameters for all stations. In
physical terms, priority control is realized by setting various delay quantities
upon whose expiration stationa are given the right to transmit on the channel
the next time it is free.
The ODA-20M system has adopted the following package format. First the charac-
ters SBIT are transmitted to tune tYie receiving units to the selected transmission
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speed. Then follow tTie cTiaracters SYN, tfie title Cexcfiange protocolj~ and the
measage itself. Tfie last thing tranemitted is error check bifis. After tfie last
character has been transmitted the transmitting statton switches off tlie cfian-
ne].. On the receiving end.the loss of a carrying signal is taken as a sign
that the transmission is completed.
The title occupies a fixed number of Iiytes C16~ and is used as an escort receipt
to the package of data being transmitted and also as a responding receipt issued
by the receiving station when it receives and cliecks tTie data received.
The title contains information on the addresses of the receiving and transmitting
points, the sources and receivers of data, information on transmission condi-
tions, the nature of the data, the technique for protection against errors, the
_ priority system, and so on. When a response receipt is transmitted the service
characters SBIT and SYN are also transmitted first. Tfien the receipt is trans~
mitted, with contents similar to tTie title of tfie package. Information on the
quality of reception (failure, errors, or without errors) is given in a special
byte (the eighth) in this case. Unlike the title of the package, iu tfie re-
sponse receipt the package length, given in bytes 7 and 6 is equal to zero.
Let us look at the work of the system in sequence in the receiving and trans-
mitting modes. There are two types of modems that can be connected to the
internal pipeline: the high-speed channel (,HSC} modem and the low~frequency
channel (LFC) modem. The HSC modem works witfi the microprocessor as an ordinary
computing unit, using standard internal pipeline signals and parallel eigfit-bit
representation of data for this purpose. The functions of establishing synchron-
ization, decoding the address, and shaping t~?e cfiaracters are performed by
hardware in the modem itself. The LFC modem performs only tfie functions of
shaping the channel signal under control of tlie microprocessor, switching the
channel from the reception mode to the transmission mode~ and identifying moments
of passage by the zero level according to the signal being received. All the
other functions are performed by microcomputer software. For this reason LSC
modems can only be used for physical modeling of signal modulation and demodu-
lation during data transmission. It is advisable to use it when the ODA-20M
apparatus is connected to data transmission systems whicfi use series-produced
data transmission equipment. For example, when data is transmitted by liiopulse
signal (or one-time relative phase modulation) 100-150 microseconds of working
time of a 580IK80 type m.~tcroprocessor is used for one bit of informa.tion, which
limits the rate of transmission to 7--10 kiloBits per second.
Figure 1 below shows a block diagram of the algoritfim for data processing in the
receiving mode for an HSC modem. T~ie modem tunes ttself Eo bit synchronization
with the channel signal according to the SBIT characters. Then the characters
by which cyclical synchronization is establisfied are received. The first char-
acter, which differs from SYN, is received as tTie address of the reception
station or the sign of a circular message. If t~ie batch of data (or responding
notice) is addressed to a particular station, the work of the microprocessor is
interrupted and the batch is received in internal memory. The characters are
counted and check sequences are formed in parallel. Tfien tlie error cfieck sub-
routine is connected in. The check sequences that are transmitted are compared
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Figure 1
3enpoe xeeana (1)
YCTBHOBHB ~ 21
CNNX . !
cHOg? (3) 11~~ ~Rynsp? yeT n yeuPoeH
~e Ae
IlptieMe 6 .
OHTP91Ib �
= OIDN60R 7~
mNQHN`l ~8 epeqey �
~ ~i8NT8HUNH
~t108TQ NT "
H9T
epeAaya .
IfBNT9HyHH
- � 8 N0~
B6(]OAH9HN 1'~ 08HP8T
HHCT~NUNq npepse!t~tc -
~ OTOROlIB R I' 8MN9
Key: (1) Channel query;
- (2) Establishing Synchronization;
(3) Your Address?;
(4) Circular?~
(5) Suppression of Reception;
(6) Reception of Batch;
. (7) Error Check;
(8) Errors?;
(9) Transmit "Repeat" Notice;
- (10) Transmit "Correct" Notice;
(11) Execute Protocol Instructions;
(12) Return to Interrupted Program;
( rtz ) Yes;
(He~- ) No.
with those received on the spot. Then a responding nottce is formed and sent to
the transmission station. If no errors are found, the receiving station begins
executing instructions contained in the title of tfie package. If tliere are errors
a universal switch transfers control to the background program interrupted
earlier. The transmission station receives a responding notice and uses it to
decide on the need for repeating the transmission and tfie conditions of doing so
(number of repetitions, change in speed, tireaking down tfie message, and tfie
like) .
Figure 2 below illustrates preparation for data transmission and transmission.
The title of the liatch is fed to the computer Tzy dt.rective or is read from tfie
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Figure 2
3enpoa He nepeqey}r~l) .
~Gp11NPOB 8HN
npoTOSOne
OQY8H9 ~ ~
BBO~( l~6HHHZ 3~
3a~xra~ or 4~
omH6os
~ Ile Aeys 5)
RPNBY ,
9Nano
BepHO? ~ Her noHropeHNq
6onbme
As ea eHHOro? xsr
oo6~eNt+ ) � Aa �
H9T 89HOHQ@HO`T lO,
. . Odpe6orxe
. A~ asepxii~oA
- eN eqNx
Boeeper ~ 11) '
- npepee~op
nporpe~Me
ICey: (1) Transmission Request;
(2) Shaping Exchange Protocol;
(3) Data Input;
(4) Error Protection;
(5) Transmission;
- (6) Receipr of Notice;
(7) Correct?;
(8) Number of Repetitions More than Assigned?;
(9) Message Completed?;
- (10) Processing of Emergency Situations;
(11) Return to Interrupted Program:
( ~ ~ ) Yes ;
(HeT) No. ,
library of standard titles stored in read-only memory. Then the batch shaping
subroutine is used to feed data to internal memory and tfie cfieck sequences are
- formed. After thi.s control is transferred to the transmissiqn generatcr. This
= subroutine is executed on the conditions that (1) the channel is free, (2} there
is authorization ic~r p~~iority control, and (3} a responding notice to the fiatch
of data transmitted earlier has been receive~i.
The transmission generator controls output of the fiatch to the modulator and
switches the channel to transmit. After transmission is completed the processor
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interrupi: is removed and it returns to the 5ackground program. OthQr requests
for transmission at the particular station are held up until notice is received
confirming reception. This restriction is necessary because a new request for
transmission may spoil information in the "old" batch whicfi must be transmitted
again in case of incorrect reception. ,
- Priority control over access to the communications channel is necessary to
avoid conflicts between stations performing data transmission procedures.
Because this system does not provide for querying the states of tfie stations or
centralized control of access to the channel, control functions are performed
autonomously at each station. Different control disciplines can be established
in this case, for example station priorities that are fixed or vary according to
a certain law, in dependence on overall channel traffic, permissible waiting
time, length of the queue of batches, and so on. The exchange proto~~ol indi-
cates the particular nature of channel control discipline. In data exchar.gP
systems where control adaptation is required, none of the stations is given
arbiter functions. This station records all batches transmitted on the channel,
determines the load of the stations, and periodically transmits circular
batches that contain new instructions on priority control.
Physical realization of different priority levels is accomplisfied ~-y a priority
control block which issues authorization for transmission to tfis particular
station within a certain time after the communicattons cfiannei be~comes frPe.
This delay is proportional to the priority level. Thus, a station wTiich fias a
higher level of priority receives autfiorization ~o transmit a~ad occupy the
channel.
In conclusion it should b e noted that the advantages of tfie programmable ODA-20M
equipment are seen most vividly where there must be adaptive control of priority
access, rate of transmission, and various other hardware functions depending on
the current.state of the system.
COPYRIGHT; Institut kibernetiki, 1981.
11,176
CSO: 1863/121
16~.
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UDC 681.306/4
HARDWARE OF ODA-20M DATA EXCHANGE SYSTEM
Kie~ PREOBRAZOVATELI FORMY INFORMATSII I SREDSTVA PEREDACHI DANNYKH in Russian
d
1981 (signed to press 21 .".pr 81) pp 51-54
[Article by P. A. Abysov, S. I~I. Zharovskiy and A. Z. Divinskiy from book "Data
Convertors and Data Transmission Equipment," edited by Doctor of Technical
Sciences A. I. Kondalev, Ordena Lenina Institut kibernetiki, 600 copies,
89 pages]
[Text] The development of data transmission hardware is determined in large part
by the fast-growing needs of all areas of human activity for integrated, dis-
tributed data processing systems. In recent times data transmission networks
for both general use and special purposes have become widespread. They are
constructed on different principles using wire, ground, and satellite radio
channels. As these systems become more complex, the requirements for data
transmission equipment grow and broaden substantially. The significant dif-
ferences in scope of data transmission systems (local and global), in types of
communicatxons channels and terminal equipment used, and in other aspects have
led recently to the development and production of a broad assortment of data
transmission equipment, but it is still not always adequate because of the
rapid modernization of components of data processing systems and the different
types of problems.
For this reason the attention of data transmission equipment developers is
turning to programmable data transmission hardware which is easily adapted to
the application conditions and is therefore more universal and economical.
A definite advance in this area was seen with the appearance of microprocessor
LSIC's, which made it possible not only to increase the universality and flexi-
bility of data transmission equipment, but also to make it much cheaper than
equipr.?ent based on hardware logic. At the same time, the use af microprocessors
permitted a significant improvement in the intellect of data transmission equip-
ment, assigning to it many functions traditionally performed by channel super-
visors, concentrators, and linked computers; in numerous cases they were also
_ given the functions of the computers at subscriber points and terminal complexes.
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Therefore, this area of work is pursuing tfie ob~ect~ve of huilding integrated
hardware for distributed data processing in wfiicli the functions of data collec-
tion, processing, and transmission are interrelated and realized by means of
uniform hardware.
One of the most widespread methods in data transmission engineering is using a
microprocessor as. the communications channel supervisor. Tn this case the
microprocessor is given the following functions: compacting data; control of
input-output; storage and shaping of data; conversion of codes; organization of
exchange protocols and their processing; detection and correction of errors;
control of priority discipline for channel use; communication with numerous
subscribers; synchronization, and others.
Many types of data transmission equipment fiave already b.een built with analogous
_ schematic diagrams. For example, the batch communications system Fased on the
IMP-16 microprocessor (England), the Modbus system from tfie Gould Incorporated
company which works with a 1 8085 microprocessor (Untted States), developments
from the Allen Bradley Company, Texas Instruments, and otliers.
The ODA-20M is one of the first domestically produced developments based on
program-controlled data transmission. Use of a microprocessor control system
opens broad opportunities for matching the technical spectfications of the data
transmission equipment with the concrete requirements that arise when setting
up systems to automate scientific experiments.
The proposed control system has a pipeline structure. Interaction among func-
tional blocks of the system, that is, among tfie central processor, memory
unit, control and indicator console, modem, and input-output units is carried
on through a"Common Line" interface.
The central processor is based on a K580IK80 microprocessor using serie~ K155
microcircuits.
- The memory unit is a semiconductor internal memory witfi.random access and a
semiconductor read-only memory. The memory unit uses K565 RU1 and K565RYe4
_ microcircuits. Minimum capacity is 3-4 kilobytes. Modular enlargement of
the memory unit is possible.
The universal control console enables the operator to control the processes of
data receiving, transmitting, and processing. The characteristics of tfie
proposed system (the characteristics of the lu~lced computer and data transmission
equipment) are taken into account in the control console. It has means for de-
bugging the control system. The control and indicator elements enable tfie
operator to carry on operational monitoring during the work of the system based
on such features as the address. of the suliscrilier, tF?e number of tfie excfiange
_ protocol, the level of priority access to the co~on communications cfiannel, the
state of the subscriber stations, the state of the communications cfiannel, and
others. The operator accomplishes all this by pressing function keys. In the
same way the operator is able, when necessary, to modify these excFiange features.
At the same time, the control and indication elements support work with t~ie
processor part of the equipment as a conventional microcomputer. For this
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purpose there is also the possibility of connecting tnput--output units sucfi as
a photoreader, punched card unit, electric typewriter, magnetic card, and so on,
to the ODA-20M equipment.
The program structure adopted in this syste~m for the processes of controlling
transmission and receiving and data processing insures maximum system fle~xi-
bility and makes it possible to use tfie ODA-20M equipment as data transmission
equipment, as a linked processor, and as a station microcomputer with the possi-
bility of significantly enlarging memory capacity and the overall productivity
of the system.
COPYRIGHT: Institut kibernetiki, 1981.
11,176
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EXHIBITIONS AND COURSES
HUNGARIAN COMPUTERS AT BUDAPEST FAIR
Moscow PRZBORY I SISTEMY UPRAVLENIYA in Russian No 3, Mar 82 pp 46-47
(Article by D. Chani and M. Tot, Hungary]
(Text] An international fair exhibiting computez equipment is held in May of every
year in Budapest: Hungarian and other foreign companies have shown their most
recent resources and systems in the central pavilion of the exhibition. This year
the systems that were shown were based mainly on mi.croprocessors. 7.'his article
primarily examines new equipment from Hungarian plants and institutes.
Videoton Products
Videoton exhibited several systems at the fair. Included among them are a data
collection system based on the YeS-lOlOM computer, designed cooperatively by
specialists of Videoton and IGV enterprises and intended for use in department
stores. The central computer can be connected to 8-16 cash register terminals
equipped with a photoelectric reader. These terminals can be located up to 1.5 km
away from the computer (without a modem).
Possible applications of the YeS-1011 system were demonstrated. Z'he AVIT system is
- a modular system for motor vehicle service enterprises. Despite the fact that its
main function is to support the servicing of motor vehicles, the system can also
be used by various service-rendering enterprises. Data are prepared by a DMC data
base maintenance system. Information is entered into the system from terminals
separated from each other and from the central computer. Another application of
the Ye5-1011 system is an image processing system developed jointly by Videoton
and the Institute for Coordination of Computer Technology. This system can be used
to carry digital information from a screen to any accumulators, to make statistical
calculations, to display pictures, to magnify or reduce images and to compose and
edit text.
A group transmission unit that can be connected to a modular YeS-1011 system was
offered for remote information processing. It transmits information reliably at
moderate speed.
The RPT/80F general-purpose terminal control unit (see figure [figure not repro-
duced]) was shown for the first time. It is used in banking and bookkeeping
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applications. Another new item was a unit that reads symbols off of punchcards;
it is used to read digits and text typed on a.punchcard.
Exhibits of the Telefongyar Plant
This plant produces remote data processing units (modems, user stations, a remote
processor) that are well known to the YeS and SM computer systems. The plant's
new article--a YeS-8534 (TAP-34) intelligent terminal--won the fair prize. It
operates at a transmission rate of 2,400 baud, it is made out of highly integrated
components, and it is controlled by a microprocessor. A terminal can transmit data
to a computer or a remote terminal in batch processing mode or in a dialogue system.
Various peripheral units can be connected to it: an alphanumerical keyboard, a
punchcard reader, a flexible magnetic disc accumulator, a DZM-180 or "Consul-2111"
printer and a double flexible magnetic disc accumulator with a total capacity of
500,000 bytes.
Products of the EMG Plant
- An EMG777 computer was exhibited for the first time this year at the fair. It is
intended for scientific and technical calculations and for use in measuring systems
and data processing systems~ It is capable of graphical expansion to permit solu-
tion of two-dimensional graphical problems. The principal characteristics of the
computer are: Automatic plotting, graphical data output in dialogue mode at high
speed, provision of data bank services in dialogue mode at a high intelligence
level. The unit contains an AM-2901 basic microprogram processor and three Intel
8085 peripheral processors. The built-in peripheral units include an alphanumerical
graphical screen with a diagonal measurement of 31 cm and two places (interfaces)
for connection of a typewriter and an alphanumerical graphical printing unit. Ex-
panded BEYSIKis the programming language.
IGV Exhibits
BDT-100 cash register terminaZs were exhibited. These are connected to a YeS-lOlOM
to form a trading enterprise data collection system. The cash register terminals
can be connected to the computer through a transmission line or a data concentrator.
The terminals are supplied with EAN and UPS bar code readers.
A VGr200 duplicator intended to make copies of A4 format documents is also a new
- development of this plant. It operates at a speed of 12 copies per minute.
Orion Products
One of the Orion plant's new developments is a YeS-8007 fully duplexed modem; after
receiving the Gold Medal at the Leipzig Fair in 1981, it earned first prize at the
Budapest Fair. This modem quadruples the rate of transmission of existing duplex
modems without changing the transmission method. Owing to this, communication in
two-conducter switching circuits may be increased simply by substituting the modems.
Up until now, a rate of 1,200 baud could be achieved only with four-conducter direct
links using an FSK modem. The same transmission rate~can be achieved with two-
conductor transmission lines using the new modem built by the Orion plant (AM-12 TD
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is thc plant code) at lower cost. The YeS-8006 modem is capable of only semiduplex
transmission. Owing to change in transmission directions, a delay of 300 msec is
created within the block. When a fully duplexed AM-12 TD modem is used, this
delay is eliminated.
Mention should also be made of a data preparation system called "Ordash" by the
Orion plant. It can be used to collect and monitor data of any form. The system
consists o~ a microcomputer and eight workplaces. Data from these workplaces are
transcribed onto a disc. These places are supplied with a keyboard-equipped display.
Exhibits of the Institute for Coordination of Computer Technology
The institute is focusing its efforts on the use of computer technology in the
national economy. Systems characteristically used in the institute's research work,
to include for agriculture, food industry, power engineering, warehouse management
- and transportation,were showii at this fair. Among the exhibits the "Teleterm," a
simple, inexpensive terminal, aroused considerable interest. It possesses a built-in
pushbutton telephone set. It works as a computer terminal, and it provides a direct
communication link, by a telephone line, between an information system and produc-
tion personnel. Microprocessor control means that the equipment can be adapted to
particular tasks. Use of the new unit to control a meatpacking plant warehouse
was demonstrated.
Mention should be made of software created for a color display. 2'his software
could be used in the processing of images in autonomous mode, or to achieve a
link-up with a computer. It can process various sorts of images: medical, meteoro-
logical, materials testing images and so on. In order that it could be used with
large systems, the institute has created a possibility for adapting it to TPA 11/40
and YeS-1011 computers.
COPYRIGHT: Izdatel'stvo "Mashinostroyeniye". "Pribory i sistemy upravleniya", 1982
11004
CSO: 1863/133
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COMPUTER SCIENCE COURSES ANNOUNCED
Riga AVTOMATIKA I VYCHISLITEL'NAYA TEKHtaIKA in Russian No 6, Nov-Dec 81 p 100
� [Announcement of computer science courses conducted in Budapest at the Interna-
tional Ce:.iter for Instruction in Computer Science for 1982]
~Text] International Courses in Computer Science in Budapest
International Center for Instruction in Computer Science (SZAMOK)
Postal address: 1502 Budapest 112, P. 0. Box 146, fiungary
International Courses for 1982
International Courses for Retraining of Personnel in Computer Science at SZAMOK
in 1982
Course Title Course Date/Language [all
given in English unless otherwise noted]
_ 1. Concurrent Programming 1-5 March
2. Modern Methods of Design in Data Processing 8-12 March
3. Efficient Structured Programm.ing in COBOL 15-19 March
4. Reliahility of Computer Systems 22-26 March
5. Practice in Design of Data Banks 29 March - 2 April
6. Management Systems 5-9 April
7. Structured Design of Programs by the
(Varniet) Method (Practice) 19-30 April
8. Use of Digital Simulation 19-23 April
- 9. Project Management 26-30 April
10. Structured Design of Programs by the
(Jackson) Method (Practice) 3-14 May
11. Structured Design of Systems 3-5 May
~ 12. Practice in Structured Design of Systems 6-8 May
13. Management of Working Groups of Programmers 10-14 May
_ 14. ~fficient Problem-Solving by Using PROLOG 17-21 May
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- 15. Designing Reliable Use of Computer liardware 17-21 May
16. Testing Computer Systems 24-28 May ~
17~ Using Graphic Displays in Engineering Design . 31 I~ay - 4 June
18. Application Technology for the R-11 Russian Language,
Megaminicomputer 7-11 June
19. Automation of Library Operations and
Information Services 6 Sept. - 1 Octo
20. Applied Statistics in an Enterprise by Using Russian Language,
Computers 4-8 October
21. Evaluation of Working Systems for Production
Control and Inventory Management 11-15 October
~ 22. Software Portability Russian Language,
18-22 October
23. AD:~;Programming Language 25-29 October
2~:. VID~OTON NETWORK SYSTEM 1-5 November
25. Usi~g the Network Planning Method 8-12 November
26. Com~;~uter System Efficiency Analysis Russian Language,
' 15-19 November
In addition to course students, our hotel accepts foreign tourists as well
throughout the year.
Halls available for international meetings.
SZAMOK Hotel:.
Budapest, XI, Sakashin Arpad Street, 68.
Telephone: 669-377, telex: 22-4499.
V/0 "Vneshtorgreklama" ~Foreign Trade Advertising Agency]
COPYRIGHT: Izdatel'stvo "Zinatne", "Avtom~tika i vychislitel'naya tekhnika", 1981
8545
CSO: 1863/82
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PUBLICATIONS
ABSTRACTS OF ARTICLES IN JOURNAL 'AUTOMATION AND COMPUTER TECHNOLOGY',
NOVEMBER-DECEMBER 1981
Riga AVTOMATIKA I VYCHISLITEL'NAYA TEKHNIKA in Russian No 6, Nov-Dec 81 pp 95, 97,
99
UDC 681.324
OPTIMIZATION OF BATCH PROCESSING BY THE METHOD OF DECISION FAMILIES
- ~Abstract of article by V. I. Khoreyev]
~Text] A design method is discussed for determining all optimal schedules for
batch data processing in associations reducible in structure to open. The result
is oriented to controlling processes in shared-use computer centers. Bibl. 5.
UDC 681.3.06:681.323
EVALUATION OF TWO TASK SCHEDULING ALGORITHMS FOR HOMOGENEOUS COMPUTER SYSTEMS
~Abstract of article by V. Yu. Bakenrot, V. V. Kolobayev and 0. B. Makarevich]
[Text] Authors evaluate operation of two algorithms for minimax planning of
solution to a package of simple independent problems in fiomogeneous computer sys-
tems, based on descending ordering of the problems by their solution time and .
assignment of them to machines in that order with regard to machine busy time
(the well known LPT algorithm and its modification), for which there is defined
the range of values of the upper bound of the absolute error of the corresponding
schedules ~ahen the specified condition for problem solving time is met. Bibl. 2.
UDC 681.32:519.713
OUTPUT DECOMPOSITION FOR COMBINATIONAL PROGRAMMABLE LOGIC ARRAY STRUCTURES
[Abstract of article by M. I. Shvartsman]
~Text] Discussed is the problem of implementing a system of Boolean functions
with programmable logic arrays (PLA) for the case when the number of system func-
tions exceeds the number of PLA outputs. Selected as the criterion of decomposi-
tion is the minimum of the sum of conjunctions of all subsystems up to minimiza-
tion. Suggested is the basic algorithm for obtaining decomposition, as well as
- two modifications of it. Test results and statistical evaluatic~ns are given.
Tahles 1, bibliography of 7 titles.
173
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UDC 681.325
ll~SIGN OF HiGH-SPE~D SPECIALIZED COMPUTERS TO REALIZE MULTIPLACE EXPRESSIONS
[Abstract of article by V. I. Zhabin, V. T~ Korneychuk and V. P. Tarasenko]
~Text] A method is suggested for synthesizing the structure of high-speed
specialized computers with tight coupling between operation devices of the quasi-
parallel type, which permit overlapping the processes of bit-by-bit input and
output of information beginning with the high-order bits. Figs. 2, bibl. 4 titles.
UDC 519.713
RACE-FREE CODING OF ASYNC1iRON0US Ai7TOMATA WITH ELEMENTS OF STORAGE WITH DIFFERENT
STABILITY �
[Abstract of article by A. N. Melikhov, L. S. Bershteyn and M. M. Chernyak]
iTextJ An algorithm is suggested for race-free coding of asynchronous automata,
oriented to use of flipflops with a different number of stable states. In the pro-
cess, the;problem is solved for opti.mizing the result of coding from the position
of minimizing the summary stability of the multistable storage elements used.
Tables 6, figs. 1, bibliography of 4 titles.
" UDC 519.711.7:681.324
GLOBAL OPTIMUM STRUCTURAL SYNTHESIS FOR DATA TRANSMISSION NETWORK USING
COORDINATION THEORY
. ~Abstract of article by D. I. Mladenov and T. A. StoilovJ
~Text] The problem of global optimum structural synthesis is formulated and solved.
It considers delay ti.mes in networks, reliability and cost and defines the network
structure and communication channel throughput. The problem is formed by composi-
tion of two partial problems, each of which determines certain parameters and
characteristics of those mentioned above. The synthesis process is a procedure
which is affected a certain way by the solutions to the partial synthesis problems.
As a result of this, the solution to the problen of global optiunum structural syn-
thesis is derived. The effect of the partial synthesis problems is considered by
- using coordination theory algorithms. An example of global synthesis of network
topology and channel throughput by the criterion of cost is given. Figs. 3, bibl. 7.
UDC 519.58
- SEARCH FOR OPTIMAL SOLUTION OF COMBINATORIAL pROBLEMS WITH BOOLEAN VARIABLES ON
RLARRANCEABLE CELLULAR COMPUTING ARRAYS
~Abstract of article by V. 0. Groppen]
j,TextJ This work covers the problem of efficient allocation of resources of
cellular computing arrays when solving extremal combinatorial problems with Boolean
variahles by.exhaustive search procedures. Problems of synthesis of varlous
17l~
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resource allocation strategies and implementation of them in specific situations
are discussed. Results are given for efficiency test of various strategies by
using program simulators. Implementation of a number of approaches is illustrated
by examples. Figs. 5, bibliography of 8 titles.
UDC 519.7
STRUCTURAL AND LOGICAL METHOD OF APPROXIMATE COMBINATORIAL OPTIMIZATION IN
PROBLEMS OF ALLOCATING COMPUTER CAPACITY
~Abstract of article by V. I. Levin]
~Text] The problem of optimum distribution of problems between n computers is
considered. The efficiency of solving the i-th problem on the j-th computer is
a... Considered the criterion of the optimum is the maxi.mum of the summary eff i-
i~
ciency from the solution of all problems. A general method is presented for the
approximate search for the extremum of the function of discrete variables, based
on using infinite-valued logic, with the basic operations x~/ y~ax(x,y)--disjunc-
tion, and x/~ y=min(x,y)--conjunction. For the matrix A=~lai~~l of efficiencies,
a logic determinant-characteristic is introduced, the computation of which yields
the solution to the problem. An approximate method for computing this character-
istic, possessing complexity exponential by n, is presented. Tables 2, bibl. 7.
UDC 519.216
ONE PROBLEM OF OPTIMIZATION WITti BOOLEAN VARIABLES
_ ~Abstract of article by A. N. Antamoshkin]
[Text] Discussed is the possibility of using an algorithm for random search with
- adaptation and a modification of it, intended for conditional opti.mizatian of
functionals with Boolean variables, for solving the problem of unconditional
optimization. The proposed transform of the problem permits using the algorithms
essentially in unchanged form. Bibliography of 4 titles.
UDC 681.3.068
PKINCIPLES OF COMPOSING CONSTRUCTOR PROGRAM FOR GENERATING A SYNTAX PARSER BY
MLTHOll OF G(k)-GRAMMARS
~Abstract of article by V. S. Zonis and A. S. Shumey]
~Text] Discussed are the principles for designing the constructor program for
automatic generation of a syntax parser by using the method of G(k)-grammars,
which is an evolution of the method of LR(k)-grammars. The program consists of
- two parts: 1) a subroutine for analysis of the source grammar and representati_on
of it in main storage in the form of two tables: a table of nonterminal symbols
and a table of grammar rules, and 2) a subroutine proper for generation of a table
_of the set of parser states. The entire constructor program t?as 1200 instructions
in SM-3/SM-4 Assembler. Tables 1, bibliography of 4 titles.
175
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UDC 681.3.014:621.391.19
PROCESSING OF RASTER IMAGES OF EXTENDED OBJECTS
(Abstract of article by A. G. Vo~tretsov, V. I. Kushnir and A. N. Yakovlev]
~Text] Automatic processing of a raster image in real time is discussed. The pro-
cessing algorithm includes the stage of selecting separate images and the stage of
detecting among them figures close to a parallelogram. A structural scheme of a
device that implements this algorithm based on a microcunputer is given.
Figs. 3, bihliography of 4 titles.
UDC 681.142.4
ESTIMATES OF DYNAMIC CHARACTERISTICS OF MULTIMACHINE SYSTEMS FOR AUTOMATING
EXPERIMENTAL RESEARCH
' 1Abstract of article by Yu. F. Ryabov and V. P. Khomutnikov]
[Text] Simulation modeling is used to study the different alternatives for
designing multimachine systems for automation of experiments. Examples of rela-
tions between user indicators of efficiency and the load and structural and
quantitative parameters of the system are dervied. Tab]_es 2, figs. 5, bibl. 9.
UDC 551.46:681.3:53.08
INTEGRATED SYSTEMS FOR AUTOMATION OF SCIENTIFIC RESEARCH ON MULTIPURPOSE RESEARCH
VESSELS
lAbstract of article by 0. S. Zudin, S. N. Domaratskiy, I. P. Kotik, G. N. Kuklin,
A. A. Novikov, L. S. Sitnikov, 0. Laaksonen and R. Aarinen]
1Text] Problems of organization of the structure of scientific research automation
systems (SANI) for multipurpose ships are di~cussed using as an example the
Integrated System for Automation of Scientific Research on the "Akademik Mstislav
Keldysh," a multipurpose research ship for the U5SR Academy of Sciences. This
- system combines into a single entity the facilities for automating oceanologic
experiments, automatic ship navigation equipment, facilities for acquisition of
meteosynoptic data and computer facilities in the form of 12 different computers
- and 3 crates with modules of CAMAC apparatus. It is shown that maximal flexibility
for such systems is afforded by using a hierarchical structure with data processing
and logging distributed by levels of the hierarchy and the bus-modular method of
organizing the hardware at all levels. Problems of computer interaction, organiza-
tion of links between the different subsystems and the selection of intertaces for
ttie different levels are discussed. Special attention is paid to joint use of the
CAMAC system and the IEC instrument bus. Incorporating three resources for the
data logging subsystem is suggested: a parameter description table, a status
- table and a directory. Problems of self-identification of data are broached.
Special attention is paid to ti.me tags. Figs. 4, bibliography of 6 titles.
176
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UDC 519.872~2
' DESIGN OF NONHOMOGENEOUS COMPUTER SYSTEMS
[Abetract of article by Yu. I. Ryzhikov]
~ }
j,Text] A computer system is :.onsidered as a queueing system of the form M/M/n,
_ where the channels of each of k types have their own parameter ui for allocation of
servicing time. The system states are descxibed by the total number of r.equests in
in and by the number of channels of each type that are doing tlie servicing. An
iteration scheme is suggested for design of the allocation of the number of
requests in an open system with an unrestricted queue and a modification of it
for a restricted queue and for a closed system. A method for computing servicing
time indicators is shown. Characteristics of a PL/1 program that implements the
method and a numeric example are given. Tables 1, figs. 2, bibliography of 7 titlo
COPYRIGHT: Izdatel~stvo "Zinatne", "Avtomatika i vychislitel'naya tekhnika", 1981
- 8545
CSO: 1863/82 END
~
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