CHINESE PROGRESS IN THE PRODUCTION OF INTEGRATED CIRCUITS

• Document Type: CREST
• Collection: General CIA Records
• Document Number (FOIA) /ESDN (CREST): CIA-RDP04T00447R000201350001-3
• Release Decision: RIPPUB
• Original Classification: S
• Document Page Count: 19
• Document Creation Date: December 22, 2016
• Document Release Date: December 9, 2010
• Sequence Number: 1
• Publication Date: March 12, 1985
• Content Type: MEMO

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enra eigecc Agency
Washington. D. C. 20505
DIRECTORATE OF INTELLIGENCE
Chinese Progress in the Production of Integrated Circuits
Summary
One of Beijing's primary technology tasks is to
develop a modern microelectronics industry that will
enable China to produce for export as well as to
meet its domestic requirements for electronic
devices. Because many Chinese integrated circuits
are unreliable and inefficient, Beijing now imports
most electronic devices needed for key computers and
military projects.
China's present ability to produce integrated
circuits lags behind the West by about 10 years.
Devices are larger than their Western counterparts,
require more power, and operate more slowly.
Production problems include inadequate coordination
between research and production units, limited
availability of key pieces of quality-control and
test equipment, and shortages of qualified midlevel
engineers and managers.
To remedy these deficiencies, China has begun a
comprehensive reform of its R&D sector and an
ambitious import program involving both complete
production lines and key pieces of equipment. We
expect these efforts to yield some significant
This memorandum was produced byl lof the Office
of East Asian Analysis in response to a request from the Deputy
Assistant Secretary for Trade Development, Department of
Commerce. Questions and comments are welcome and may be
addressed to Chief, China Division,
EA M 85/10047
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results over the next few years. For Western firms
attempting to sell to China's electronics sector,
China's expansion plans have opened up significant
sales opportunities.
Introduction
China's highest technological priority is to establish a
modern semiconductor industry capable of supporting an expanded
computer development and manufacturing program. By 1990 the.
Chinese hope to develop a capability in advanced microelectronics
equal to the United States' capability in the early 1980s.
China's objectives are twofold:
-- To increase the sophistication of the devices
produced domestically for-use in advanced computers
and in military systems.
-- To boost the supply of medium-level electronic
components available for use in dual-use computers
and in consumer goods.
In the longer term, Beijing intends to become a major
exporter of integrated circuits and a strong competitor in the
international marketplace for sophisticated electronic
components. To accomplish these objectives, China has shifted
its electronics modernization strategy from one emphasizing self-
reliance to one of importing advanced technology and equipment
from the West and Japan to speed the pace of development and to
cut R&D costs.
Growth of the Industry
China's integrated circuit industry had its beginning in
early 1956, when the leadership formed a national committee to
develop plans for the rapid development of semiconductor
devices. During the late 1950s, China produced prototype
semiconductor diodes and transistors. In the early 1960s, it
began to develop a production capability for discrete
semiconductor components, and by 1965 at least 34 factories and
research institutes were making semiconductor materials and
fabricating semiconductor devices.
Despite dislocations caused by the Cultural Revolution, the
electronics sector continued to grow between 1966 and 1976,
chiefly because of its importance to strategic weapons
development. As part of a nationwide policy of dispersing
defense-related production to shield industry from enemy attack,
China during this period constructed additional semiconductor
research and production facilities in remote areas of China. As
a result of this effort, four major electronic research and
production centers were established in China's interior .(Gansu,
Sichuan, Yunnan and Guizhou Provinces), in addition to the
electronic production centers in Beijing, Tianjin, Shanghai, and
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several coastal provinces. These interior production plants are
relatively sophisticated and continue to produce primarily for
military customers. By mid-1971, the number of Chinese plants
known to be engaged in series, batch, or experimental production
of semiconductor components had grown to 82--more than double the
number identified in 1965.
In the late 1970s, China began a new push to acquire Western
technology for the production of semiconductors and other
sophisticated electronic goods. One major new production line
for integrated circuits was planned during this period, a
facility at the Jiangnan Radio Equipment and Materials Plant in
Wuxi, Jiangsu Province. Production at the new plant has been
held up by difficulties in obtaining US export licenses for
needed new equipment, the need to refurbish some of the used
equipment, and legal problems involving the US trade agent. When
completed the Wuxi plant will for a time be China's largest
integrated circuit factory, with a capacity of over 26 million
linear integrated circuits per year.
With the backing of the Leading Group for the Invigoration
of the Electronics Industry, formed in 1982 and renamed and
reconstituted in 1984, other facilities of similar size are also
planned for Tianjin, Shanghai, Beijing, Shaoxing, Changsha and
several other cities. Combined output for these major projects
could reach several hundred million integrated circuits per
year.
Current Capabilities...
China's semiconductor industry today reportedly consists of
more than 500 facilities, 200 of which are involved in some
aspect of integrated circuit development and manufacture. The
Chinese claim that the Ministry of Electronics Industry alone
controls at least 140 factories, which produce an estimated 40
million integrated circuits a year. In addition, there are
electronics research and manufacturing enterprises operated by
the Ministry of Astronautics Industry, the Ministry of Posts and
Telecommunications, the Ministry of Machine Building Industry,
the Ministry of Light Industry, the Ministry of Public Security,
and the Chinese Academy of Sciences.
At present, China manufactures nearly 1,000 types of
integrated circuits. Most are small-scale-integration (SSI) or
medium-scale-integration (MSI) devices. More sophisticated
devices, such as 16K random-access-memory (RAM) units, and 16K
eraseable-programmable-read-only-memory (EPROM) circuits, and 8-
and 16-bit microprocessors are also being manufactured, but in
limited quantities and with low production yields.
China's ability to produce integrated circuits in commercial
quantities continues to lag behind the US and Japan by five to 10
years.
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Table 1
Type of Memory IC Y
ear
First
Comme
rcially Avai
lable
US
Japan
China
1K
DRAM
1970
1972
1978
4K
DRAM
1974
1975
1981
16K
DRAM
1976
1977
1985
(est)
64K
DRAM
1980
1980
1989
(est)
256K DRAM
1984
1983
1992
(est)
China's domestic requirements for microprocessors and advanced
logic and memory devices are still being met primarily by imports
from Japan and the US.
China's production capabilities in seven major categories of
integrated circuits are described below:
TTL Circuits. Transistor-transistor-logic circuits
constitute about 50 percent of China's total integrated circuit
production. China produces five series of TTL circuits, all
based on the'Texas Instruments SN74/54 series. Some are produced
to military specifications, able to function in temperatures
ranging from -55 to +125? C. The Chinese claim that all TTL
logic circuits being produced are directly interchangeable with
their US-produced counterparts. China is particularly proud of
its low-power Schottky (LSTTL) devices, 100 varieties of which
are produced--most to military standards--by an integrated
circuit plant in China's interior. This plant, the Tianguang
Electrical Industry Factory, reportedly supplied some of the
circuitry used in China's Galaxy supercomputer. The Tianguang
plant of Gansu Province is benefitting from the modernization of
its sister plant, the Tianguang factory of Shaoxing, Zheji-ang
Province.
ECL Circuits. China's emitter-coupled-logic circuits are
modeled on the Motorola MC10100 and MC10500 series. These ultra
high speed circuits, again produced to military specifications,
are also made by Tianguang. In addition, China claims to use
these circuits in missile guidance systems, satellite
communications equipment, and microwave measurement devices.
General Purpose MOS Logic Circuits. Because of the
relatively slow speed and high power consumption of PMOS
(positive-channel metal-oxide-semiconductor) devices, China is
gradually replacing them with CMOS (complementary MOS)
technology. NMOS (negative-channel MOS) technology continues to
be used extensively in Chinese microprocessors and memory
devices. Mastering the complex CMOS manufacturing process has
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been more difficult, but China reportedly produces more than 70
varieties of CMOS circuits, including microprocessors,
operational amplifiers, voltage comparators, and digital/analog
converters. In 1982, China's domestic sales of CMOS circuits
exceeded 3 million units.
Dedicated Circuits. Chinese versions of these circuits--
used in televisions, radios, watches, and other consumer goods--
are mainly based on Japanese devices made by Sanyo, Toshiba,
Hitachi, Matsushita, NEC, and others. In recent years, China has
purchased equipment for a large number of production lines
designed to produce devices for consumer electronics. Many
contain refurbished equipment purchased from Japanese or US IC
producers, rather than state-of-the-art production technology.
Some of the production lines, such as the one at the Jiangnan
Radio Equipment and Materials Corporation, may be capable of
producing more advanced general purpose integrated circuits than
required for color televisions--such as 8-bit microprocessors and
16K memory devices.
Microprocessors. China produces 1-bit CMOS and 4-, 8- and
16-bit NMOS microprocessors. China's 8-bit microprocessors are
modeled on Intel's 8080 and Motorola's 6800 series. China claims
to be producing single-chip 8-bit processors in at least four
different factories, although the chip is most likely
significantly larger than its Western counterpart.
In early 1984, China claimed to have begun small-batch
production of 16-bit microprocessors at an interior factory
subordinate to the Ministry of Astronautics Industry, the Lishan
Microelectronics Corporation of Shaanxi Province. The 16-bit
processor can be used in real-time control systems in demanding
environments; it is designed to operate for long hours in a wide
range of temperatures and is resistant to moisture and
Memory Devices. In 1982, China announced that the
Semiconductor Research Institute of the Chinese Academy of
Sciences in Beijing had developed a 16K DRAM (dynamic-random-
access-memory) chip. At the same time, Beijing made public its
ability to produce 4K SRAMs (static-random-access-memory devices
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'? I I
A number of institutes are now working to develop very-
large-scale-integrated circuit (VLSI) technology. In 1983 and
1984, several Chinese facilities attempted to obtain equipment
and information suitable for the production of 256K DRAM
Even if China gains access to Western 256K DRAM
production technology, the Chinese will probably not produce a
prototype 256K DRAM before the end of this decade. Production
capability will require several- additional years.
...and Limitations
In laboratory settings, lack of equipment, rather than
expertise, is largely responsible for China's delay in producing
advanced prototypes. Even with imported high-purity chemicals
and materials, the absence of computer-aided-design (CAD) systems
and state-of-the-art processing equipment prevents the Chinese
from producing VLSIs on the order of a 256K DRAM.
China's development of prototype 64K and 256K DRAM devices
almost certainly requires the acquisition of equipment that will
enable the Chinese to pack circuits more densely by using
narrower design rules. The equipment generally available in
Chinese factories permits the Chinese to produce-devices with
line widths of 5 to 10 microns, and the Chinese claim to have
achieved a 2-micron capability in one institute. In contrast,
Western producers routinely use 2-micron-geometries and have made
substantial progress toward developing a sub-micron capability.
Unable to pack circuitry as densely as Western producers, the
Chinese have been forced to increase the dimensions of their
integrated circuits. Larger chips require larger areas of high-
purity silicon wafers to be defect-free. Because Chinese silicon
is far from pure enough to satisfy this requirement--even Western
silicon producers have tremendous difficulty producing silicon of
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' I I
sufficient purity--China will eventually have to. turn its effort
toward obtaining equipment that will enable Chinese factories to
shrink the size of their circuitry.
Another limitation of China's semiconductor industry is the
long lead-time required before a developed prototype device moves
into factory production. The gap between prototype and
commercial production of memory devices, for example, ranges from
two to four years and appears to have increased over the last
decade, as the sophistication of the devices has risen. In the
West, a one or two year gap between prototype development and
commercial production--slightly longer for 256K DRAM devices--is
the norm.
China's Development and Production of Memory Devices
Type of IC Year Developed Year Produced in
Commercial Quantities
1K DRAM
4K DRAM
16K DRAM
64K DRAM
1976
1979
1981
1984
1978
1981
1985 (est)
1989 test)
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Removing the Obstacles
China is taking steps to improve its ability to develop
advanced devices on a laboratory scale as well as to improve
production capabilities at its electronics factories. To remove
the institutional barriers to advanced electronics production,
Beijing is now embarked on a major reform of its entire
scientific and technological system. Its aim is to bridge the gap
between research findings and commercial production and to
improve the flow of technology between factories. To foster the
internal transfer of technology, the Chinese leadership is
encouraging the mobility of technical personnel, creating
financial incentives for institutes to work closely with
factories on the development of new products and production
techniques, placing a large number of institutes formerly
controlled by the Chinese Academy of Sciences under the direct
control of industrial ministries, and forming regional
corporations, composed of factories and institutes engaged in
semiconductor research and production, in major cities.
To improve material conditions in laboratories and
factories, Beijing has embarked on an ambitious program of
equipment imports, factory renovation, and investment in key
electronics production projects. Because China's goals involve
both rapid expansion in the quantity of electronic devices
produced for civilian applications and rapid advances in the
sophistication of the circuitry produced for military uses,
Beijing is using a variety of means to obtain foreign technology
and equipment for this sector:
-- Cooperative production involving firms from the
United States, Japan, and Western Europe. Although
most of the emphasis on cooperative production in the
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electronics sector is centered on joint venture
investment, the Chinese are also promoting
compensation trade and kit assembly arrangements.
-- Purchases of turnkey plants and design technology for
the-production of advanced electronic devices.
Although contracts for complete production lines have
declined overall since 1978, the Chinese now appear
more willing to purchase complete sets of equipment
in the area of microelectronics.
-- Purchases of selected pieces of production and test
equipment to modernize existing plants, improve
production yields, and produce more sophisticated
devices, such as large-scale and very-large-scale-
integrated circuits.
-- Purchases of used pieces of equipment as well as
refurbished complete production lines.
Although it is difficult to generalize about the method
Chinese factories most often select, key projects--frequently
related to the production of components to be used in military
systems--often involve new, rather than refurbished, equipment.
Military-related projects are unlikely to involve any form of
cooperative production that would require the presence of foreign
managers or advisers. Joint venture projects, imports of used
equipment, and purchases of complete production lines are the
methods often chosen to boost the production of components to be
used in consumer goods or general-purpose computers.
Among the individual pieces of wafer fabrication equipment
China most actively seeks to import are:
-- Microprocessor-controlled Czochralski furnaces for
growing low-defect single-crystal silicon ingots.
-- Molecular-beam epitaxial reactors for growth of a
layer of pure silicon (or gallium arsenide) on wafer
surfaces.
-- Computer-aided design software, pattern generators
and compilers, and graphics systems for developing
mask designs.
-- Electron beam lithographic equipment for producing
masks.
-- Projection mask alignment systems for use in
photolithography.
-- X-ray lithographic equipment.
-- Ion implanters.
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Plasma etching reactors.
Magnetron sputtering equipment.
Wafer probers for circuit testing.
Automated gold wire bonding equipment.
Equipment, for producing multilayer printed circuit
boards.
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SUBJECT: Chinese Progress in the Production of Integrated
Circuits
National Security Council
1 - David Laux, Senior Staff Member for China, Taiwan and Hong
Kong, Rm 302, EOB
Department of State
3 -
Donald
Anderson, Director, Office of China Affairs, Rm 4318
1 -
Teresa
Jones, Bureau of Intelligence and Research, Rm 6524A
1 -
Larry
Roeder, Office of East-West Trade, Rm 3815
1 -
Chris
Clarke, Bureau of Intelligence and Research, Rm 8840
Department of Defense
1 - Richard Clark, FTD/TQTR, Wright Patterson AFB Ohio, 45433
Department of Treasury
1 - Douglas Mulholland, Deputy Assistant to the Secretary for
National Security, Rm 4326, Main Treasury
Department of Commerce
5 - David K. Diebold, Deputy Assistant Secretary for Trade
Development, Rm 3899
1 - Roger Severance, Acting Deputy Assistant Secretary for East
Asia and Pacific, Rm 2317
1 - John Boidock, Director, Office of Export Administration,
Rm 1097
2 - Christine Lucyk, Office of PRC and Hong Kong, Rm 2317
Central Intelligence Agency
Executive Director (Rm 7E12)
DDI (Rm 7E44)
NIO/EA (Rm 7E62)
NIO/S&T (Rm 5G00)
AG/NIC
CPAS/IMC/CB (Rm 7G07
PDB Staff (Rm 7F30)
CPAS/ILS (Rm 7G50)
FBIS/NEAD/CE (304 Key Bldg)
OSWR/STD/SB (Rm 5F43)
OSWR/TTAC/TAG (Rm 6C43)
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SUBJECT: Chinese Progress in the Production of Integrated
Circuits
Distribution: (continued)
OGI/ECD/TW (Rm 3G46)
OGI/TID/TEC (Rm 3G22)
D/OEA (Rm 4F18)
Research Director/OEA (Rm 4G48)
C/China Division (Rm 4G32)
OEA/China/DEF
OEA/China/DOM
OEA/China/DEV
OEA/China FOR
DDO
DDO
DDO
'EA/
'EA
OCR/ISG (Rm 1H19
C/PE 24)
C/EA
C/DO
DDI/OEA/China/DEV
25X1
25X1
12 March 1985 25X1
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The Management of China's Electronics Industry
This paper provides background on the organizations involved
in the planning, management, and foreign trade of China's
electronics sector.
Leading Group for the Invigoration of the Electronics Industry
In September 1984, Beijing reorganized and renamed the
Leading Group for Computers and Large-Scale Integrated Circuits,
which had been charged since 1983 with overseeing the development
of these products. At the same time, Vice Premier Li Peng
replaced Vice Premier Wan Li as the chairman of the Leading
Group. In addition, the membership of the Leading Group was
broadened. Ranking official's from the State Economic Commission,
the State Science and.Technology Commission, the National
Defense, Science Technology and Industry Commission, the People's
Bank of China, and the Ministries of Electronics, Machine
Building, Post-and Telecommunications, Railroads, and Water
Resources and Electric Power all serve on the new leading
group. (See Figure 1)
The Leading Group for the Invigoration of the Electronics
Industry is charged with strengthening. centralized leadership
over electronics and information enterprises. Its functions
include:. formulating development goals and general strategies;
approving key plans'and supervising their implementation;
coordinating research and production, and examining and approving
the imports planned for major projects.
The new Leading Group has defined the strategic goal.of the
electronics industry as developing "microelectronics technology
as the foundation, and computer and telecommunications equipment
This unclassified memorandum was prepared by
of the Office of East Asian Analysis in response to a 25X1
request from the Deputy Assistant Secretary for Trade
Development, Department of Commerce. Questions and comments are
welcome and may be addressed to Chief, China Division,
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 Figure 1
Center for Techno-
Economic Research
Chair: Ma Hong
China's Research and Development Community
Policy Elements
State Economic
Commission(SEC)
Min: Lu Dong
Provincial SsT
Research Institutes
State Planning
Commission (SPC)
Min: Song Ping
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I
Science and Technology
Leading Group
Head: Premier Zhao Ziyang
Deputies: Fang Yi.
Song Ping
Leading Group for
Invigoration of
Electronics
Head: Vice
Premier LI Peng
State Science and
Technology Commission
Minister: Song Jian
Vice Ministers: Guo Shuyan,
Zeng Xianlin, Wu Mingyu,
Yang Jun, Teng Teng
Commissioners:
Yang Weizhe, Wu Xing,
Hu Zhaosen
Jia Weiwen, Xie Shaoming
? S&T Policy Department
office for annual plans and
implementation
? National Research Center
for S&T for Development
? Institute for S&T Information
of China
Director: Lin Zixin
? Key Projects Coordination
Department
Head: Jia Weiwen
? Bureau of Technology
Director: Hu Zhaosen
Chinese Academy of
Social Sciences (CASS)
President: Ma Hong
Chinese Academy of Science
(CAS)
President: Lu Jiaxi
Central Mili-
tary Commis-
sion
Chair: Deng
Xiaoping
National Defense
Science,
Technology, and
Industry
Commission
(Responsible for
national defense
S&T plans and im-
plementation in
concert with SPC
and SEC)
Party Central
Committee
Military
Commission
Chair: Deng Xiaoping
Ministry of Education (MOE)
Minister: He Dongchang
Chair: Zhou Peiyuan
Chinese Association
for Science and
Technology
China S&T
Consultative
Service Center
President:
Lin Bomin
Industrial Ministries
Research Academies
and Institutes
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Defense Ministries
LResearch Institutes
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as the main body." The Chinese press reports this goal has been
adopted by the State Council and will be emphasized in China's
Seventh Five Year Plan (1986-1990), soon to be announced.
The Ministry of Electronics Industry
MEI, formerly the Fourth Ministry of Machine Building,
coordinates one of China's most rapidly developing industrial
sectors. The Ministry directs applied electronics research and
manages the development and production of electronics products
for both civilian and military needs.
MEI controls some 2,400 enterprises employing more than
90,000 engineers and technicians and one million additional non-
technical personnel. Although MEI manages some of these
enterprises directly, control of most of them has been delegated
to provincial, municipal, and county organizations, which receive
planning guidance from the Ministry. In addition to MEI and to
provincial and municipal authorities, the Ministries of Posts and
Telecommunications, Astronautics, Machine Building, Light
Industry, and the Chinese Academy of Sciences all produce
electronic goods for their own uses.
Industrial bureaus subordinate to the MEI include:
-- Bureau of Radar Industry - responsible for manufacturing
various ground, weather, and airborne and shipboard
radars.
-- Bureau, of. Communications, Broadcast and Television -
responsible:"for communication, navigation and broadcasting
equipment, television sets, radios, and tape recorders.
-- Bureau of Computer Industry - responsible for
manufacturing computers, peripherals and related
equipment; controls research, production, imports, and
product distribution for a number of institutes and
factories; provides staff support for and policy
recommendations to MEI and the Leading Group; controls
China Software Technology Corporation (CSTC) and China
Computer Technical Service Corporation (CCTSC)--companies
that form joint ventures with foreign firms for software
development and for computer maintenance and service.
-- Bureau of Electronic Components and Devices - responsible
for manufacturing vacuum tubes, semiconductor devices,
integrated circuits, electronic instruments, special
processing equipment, and electronic materials.
Electronics research controlled by the Ministry comes under
the direction of four research academies. Institutes conduct
research for the academies. At least 55 such institutes are
subordinate to the MEI.
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The MEI also controls several specialized import-export
corporations to acquire equipment and technology from foreign
sources. These include the China Electronics Import-Export
Corporation (CEIEC) and the China National Electronic Devices
Corporation (CNEDC). CEIEC has branches in Guangzhou, Shenzhen,
Shanghai, Tianjin, Beijing, and most provinces. (See Figure 2)
Inter-Ministerial Regional Corporations
Regional electronics corporations, composed of factories and
institutes engaged in the production of similar goods, have been
or are being formed in major cities. These regional combines are
being formed to reduce the duplication of research being done by
various institutes, to coordinate factories' imports of equipment
and materials, to facilitate the sharing of technical information
between institutes and factories, and to ensure that components,
computers, and telecommunications equipment are compatible with
one another. Examples include:
-- The Nanjing Radio Company, an integrated complex composed
of 37 factories, and provincial and municipal
authorities.
-- The Shanghai, Software Technological Development Center,
which comprises six universities, two institutes, and
various municipal entities.
-- The Shanghai Computer Company, which includes two computer,
factories, a telecommunications factory, an instrument
factory, a research institute and municipal organizations.
The Shenyang'Computer United Corporation, which includes,
11 production and research units.
Formation of such regional corporations is only one of the
means Beijing is using to remove the institutional barriers to.
progress in the production of electronic goods. Beijing is now
embarked on a major reform of its entire scientific and
technological system, aimed at improving the flow of technology
between institutes and factories, between military and civilian
sectors, and among factories spread across several ministries.
To foster the internal transfer of technology, the Chinese
leadership is encouraging the mobility of technical personnel,
creating financial incentives for institutes to work closely with
factories on the development of new products and production
techniques, and placing a large number of institutes formerly
controlled by the Chinese Academy of Sciences under the direct
control of industrial ministries. All sectors are involved in
this effort, but the electronics industry is the focal point for
many of the reforms.
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Figure 2
Ministry of Electronics Industry
Management Bureau of
Radar Industr
China Software
Technology Corp.
Bureau of
Communications
Bureau of
Com uter Industry,
Foreign Trade
China Electronics
Import-Export
Corporation
Regional Branches
of CEIEC
China National
Electronics Devices
import-Export
Corporation
Bureau of
Electronic Components
and Devices
I__
China Computer
Technical Service
Corporation
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The Buyers
A large and. increasing number of corporations are involved
in China's imports of semiconductor production technology and
equipment. At the national level, there are several trading
corporations under the Ministry of Foreign Economic Relations and
Trade, the Ministry of Electronics Industry, and each of the
defense industrial ministries. Buying corporations are also
operated by the Chinese Academy of Sciences, the National
Defense, Science, Technology and Industry Commission, and the
State Science and Technology Commission. (See Table 1.)
In addition to the national level trade corporations, the
current decentralization of China's foreign trade has given rise
to a number of regional or municipal-level trade organizations.
The number of local traders is multiplying rapidly, and the value
of the purchases many are authorized to make--as well as their
authority to sign cooperative production agreements--remains
unclear. The regional corporations most actively involved in
electronics procurement are located in Shanghai, Tianjin, and the
Shenzhen Special Economic Zone.
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National Electronics Trade Corporations
Corporation
Subordination
China Electronics Import-
Export Corporation
China National Electronic
Devices Corporation
China Great Wall Industry
Corporation
China Precision Machinery
Import-Export Corporation
China Yanshan Science and
Technology Corporation
Xiaofeng Technology and
Equipment Corporation
Xinshidai Company
Ministry of Electronics
Industry (MEI)
Ministry of Astronautics
Industry (MOAI)
National Defense Science
Technology and Industry
Commission (NDSTIC)
Oriental Scientific Instruments
Import-Export Corporation
China Scientific Instruments
and Materials Corporation
China Electronic System
Engineering Corporation
China National Instruments
Import-Export Corporation
China National Technology
Import-Export Corporation
Chinese Academy of Science
State Science and
Technology Commission
Ministry of National
Defense
Ministry of Foreign
Economic Relations and
Trade (MFERT)
Sanitized Copy Approved for Release 2010/12/09: CIA-RDP04T00447R000201350001-3