CRYSTAL UNITS MANUFACTURE MECHANIZATION PROGRAM. SYSTEM STUDY FINAL REPT. (CONTRACT DA 36-039-SC-54667).

• Document Type: CREST
• Collection: General CIA Records
• Document Number (FOIA) /ESDN (CREST): CIA-RDP81-01043R002200150005-2
• Release Decision: RIPPUB
• Original Classification: U
• Document Page Count: 164
• Document Creation Date: December 23, 2016
• Document Release Date: August 12, 2013
• Sequence Number: 5
• Publication Date: April 29, 1958
• Content Type: REPORT

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Crystal Units
Manufacture Mechanization
Program
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ABSTRACT
development of a system and prototype equipments for a mechan-
ized plant to manufacture CR48/U and CR-23/U quartz crystal units at the rate
of 200,000 per month with one-shift operation. This report finalizes the System
Study and describes the processes and a man-machine system designed to achieve
this goal. The integrated manufacturing system will be highly mechanized and
completely eliminate the demand for critical operator skill. Approximately fifty
operators, none of whom require more than two weeks training, together with
112 pieces of major equipment will be utilized to produce 10,000 tested crystal
units per shift. Predicted yields are in excess of 150 good diced blanks or 100
tested crystal units per pound of raw quartz, based on the production of first
harmonic crystals of frequency between 4.3 and 18 mc. and third harmonic units
ranging from 17 to 54 mc.
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"The assembly line is one of mechanization's most effective tools. It aims at an
uninterrupted production process. This is achieved by organizing and integrating
the various operations. Its ultimate goal is to mold the manufactory into a single
tool wherein all the phases of production, all the machines, become one great unit.
The time factor plays an important part; for the machines must be regulated to
one another:"
MECHANIZATION TAKES COMMAND
S. Gicitoo
Oxford Universal Press, 1948
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F.
CONTENTS
Table of Contents
PART I
Page
Purpose
1
Introduction
1
Results of Study and Conclusions
2
1. Plant Layout
2
2. Major Equipment and Direct Labor
2
3. Processes
3
4. Yields
4
PART 11
PROCESSES
Process 1?Inspect and Heat Stones
5
Process 2?Mount Stones and Orient Z axis
5
Process 3?X-ray Orientation Cut
9
Process 4?Initial Etch
10
Process 5A?Insert Mounted Stones In Transfer Jigs
11 .
Process 5B?X-ray Preposition Stones
12
Process 6?Saw X-sections from Stones
13
Process 7?Remove Plates and Degrease Transfer Jigs
14
Process 8?Separate Sections
14
Process 9?Initial Etch Sections
14
Process 10?Heat Sections and Plates
15
Process 11?Orient Sections for Mounting Side, Inspect for Twinning
15
Process 12?Mount Sections, Orient AT Line, and Cool
16
Process 13?Score Sense Code and Saw X-ray Flat
16
Process 14?Etch Mounted Sections
17
Process 15?Insert Sections in Transfer Jigs and Preposition
17
Process 16?Saw Wafers from Sections
18
Process 17?Remove Plates and Degrease Transfer Jigs
18
Process 18?Separate Wafers from Plates
18
Process 18?Etch Wafers
19
Process 20?Inspect and Layout Wafers
19
Process 21?Mount Wafers
19
Process 22?Ultrasonic Dicing
20
Process 23?Dewax Blanks
21
Process 24--Inspect Blanks
21
Process 25?Load Blanks into Cartridges
21
Process 26?X-ray Sorting
Process 27?Thickness Sorting
26
Process 28?Load Lap Carriers
29
Process 29?Primary Lapping
30
Process 30?Wash Blanks
33
Process 31?Separate, Dry and Inspect Blanks, Load Cartridges
34
Process 32?Frequency Sorting
34
Process 33?Load Lap Carriers
29
III
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z'
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Table of Contents
iv
Page
Process 34?Secondary Lapping
30
Process 35?Wash Blanks
33-
Process 36?Separate, Dry and Inspect Blanks, Load Cartridges
34
Process 37?Frequency Sorting
34
Process 38?Load Lap Carriers
29
Process 39?Final Lapping
30
Process 40?Wash Blanks
33
Process 41?Contouring
35
Process 42?Separate, Dry and Inspect Blanks, Load Cartridges
34
Process 43?Frequency Sorting
34
Process 44?Etch Holder Loading
36
Process 45A?Degrease Etch Holders
37
Process 45B?Final Etching
37
Process 45C?Final Etching and Blank Drying
37
Process 46?Loading Base Plate Masks
39
Process 47?Preheating and Base Plating
42
Process 48?Pre-Aging
49
Process 49A?Clean Bases
50
Process 49B?Mounting and Cementing Blanks
50
Process 50?Air Dry am. Cure Cement
51
Process 51?Adjustment Plate
51
Process 52?Assemble Cans to Bases.and Solder Preforms
53
Process 53?Base Sealing
54
Process 54?Frequency and Activity Check
55
Process 55--Packaging
56
Process 56?Frequency Stamp Cans
57
Process 57?Degrease Cans
57
Process 58?Hydrogen Anneal Cans
58
PART Ill
MAN-MACHINE SYSTEM
Design Parameters
59
Station A Mount Stones and Orientation Cut
59
Station A' Mount Sections, Sense Code and Saw X-ray Flat
61
Station Initial Etch
63
Station Preposition Stones and Sections
64
Station Saw Sections from Stones
66
Station Saw Wafers from Sections
67
Station Dice Wafers
69
Station ZZ' Angle (X-ray) and Thickness Sorting
72
Station Load Lap Carriers
74
Stations I, L, M Lapping
76
Station Contouring
82
Station Condition Lap Plates
92
Station Frequency Sorting
$3
Station Final Etch
96
Station 0 Base Plate
911
Station Mounting and Cementing Blanks
91
Station Adjustment Plate
92
Station R Preparation of Cans
94
N..
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Station S
Station T
Staeon U
Base Sealing
Frequency 'Check
Packaging
APPENDIX
Table of Contents
Page
96
97
98
.
I
Order Board Frequency Distribution
99
II
Major Equipment and Labor Summary
102
III
Process Flow Sheets
103
IV
Frequency Chart (Schedule)
106
V
Estimated Yields and Shrinkages
108
OW.
6-1
Effective Resistance vs. Frequency for Crystal Blanks
109
15-1
Choice of ZZ' Angles
110
16-1
Thickness of Wafers
112
22-1
Rough Orientation in X-ray Sorter
117
22-2
Cost Estimates on Dicing Quartz Blanks
119
26-1
Sorter Accuracy
123
26-2
Analysis of the Effect of X-Ray Sorting on the Distribution
.
of ZZ' Angle
126
26-3
Errors in X-Ray Sorting with a Double Crystal '
Goniometer
129
41-1
Contouring Survey
137
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45B-1
Control of Final Etch Process
140
ILM-1
Effect of Dead Time on Quality of Lapping Machines
145
K-1
Estimate of Frequency Setting Changes During Sorting
147
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Foreword'
vi
FOREWORD
Quartz Crystal Units Manu acture M ? arnza-
don Program
The objective or this program is to imp ement the pro ucnon o
200,000 quartz crystal units per month from a single line with one-shift operation.
The development of such a facility is a long-range undertaking on the part
of the Government. A plant of this type must be a smooth-working entity in
which men and machines are well-integrated into a continuous work flow. Critical
dependence on the skills of well-trained operators must be avoided if the facility is
to be usefully activated on short notice, as in the event of national emergency. On
the other hand, the production of quartz crystal units has in the past been an art
rather than an engineering science, and manufacture has been of the job-shop, small
lot type rather than straight line high-quantity production. If the facility is to achieve
its goals and produce crystal units of high quality, a hitherto unachieved amount of
skill must be built into the machines, while the operation of each machine type must
fit smoothly into the operations of the next in line.
In summary, such a production facility is a system, not a collection of machines.
Hence, as part of this contract, an intensive System Study has been implemented and
has proceeded hand-in-hand with the actual machine development. This document
is the final report of the System Study, and summarizes the work of many individuals
who have contributed to the present concept.
Two years of study and development on the operations involved in the mech-
anized production of quartz crystals haNe established the validity of the broad
principles outlined in System Study No. 1 of this contract (dated 3 January 1.955),
and have served to confirm many of the machine and process details with remarkable
accuracy. The use of the systems c.7.7cept on which this development program has
been predicated is thereby amply justified. In the large, the results of System Study
No. 1 have been confirmed, expanded, and altered where necessary to represi-nr
the latest advances in the art as known to us.
The techniques of operations research, chemical and physical investigation,
machine design studies, and extensive contact and survey of other workers in Govern-
ment laboratories and industrial facilities have been fully utilized, and are hereby ac-
knowledged. Without the aid of many people, both within and without the Bulova
or don, it woul 4 ? . have been possible to prepare this comprehensive report.
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