LETTER TO DR. DONALD H. STEININGER FROM (Sanitized)
Document Type:
Collection:
Document Number (FOIA) /ESDN (CREST):
CIA-RDP72R00410R000100080009-1
Release Decision:
RIPPUB
Original Classification:
S
Document Page Count:
2
Document Creation Date:
December 15, 2016
Document Release Date:
October 22, 2003
Sequence Number:
9
Case Number:
Publication Date:
February 19, 1969
Content Type:
LETTER
File:
Attachment | Size |
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CIA-RDP72R00410R000100080009-1.pdf | 86.43 KB |
Body:
Approved For Release 2003/11/25: CIA-RDP72R0041OR0001000800 _ `-
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y 5 of
19 February 1969
We have reviewed the EH.-4 coverage of the USDA
and AID areas of interest, and find that there are
at least sample coverages of the areas. The KH--4
has *ix foot around resolution at the nadir.l
As you know, we used the black and white coverage
of as the basis for estimation of yield.
In the absence of disease and catastrophe, the entiwa-
titan determined compared favorably with that utilizing
multi-spectral coverage of small scale. The black and
white analysis method leans very heavily on collateral
information. Thus where tbvre is little collateral 1n-
formation available, mainland China for instance, it
may be assumed that production estimates will have A
high error coefficient. It to logical to assume, however,
that better production estimates can be made with the
additional Input provided by the IM-4 photography. In
areas such as South America where I assume we can oven
get ground truth, the production estimates way be good
enough fc r their intended purpose.
To determine this, I propose to perform KR-4 analysis
Of four regions:
a. Argentina--Chile
c. Thailand
ILLEGIB
d. USSR (Crimea)
In addition, high altitude coverage of :regions a, lb, and
c will be obtained to simulate KB-4 and multi-.spectral
photo lraphy-.
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rhere are details to be worked out, of course, but
I wanted your concurrence on this course of action be-
fore proceeding further.
epu y Director or ence and Technology
Dr. Donald H. Steininger
Executive Office of the President
Office of Science and Technology
Washington, D. C.
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